Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Maximum RF Output Frequency | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Minimum RF Output Frequency | Construction | Minimum RF Input Frequency | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Minimum Up Conversion Gain | Maximum Operating Temperature | Minimum Down Conversion Gain | Maximum Output Power | Minimum Intermediate Frequency (IF) | Maximum RF Input Frequency | Minimum Operating Temperature | Terminal Finish | LO Tunable | Maximum Noise Figure | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Input Power (CW) | Minimum Operating Frequency | Maximum Intermediate Frequency (IF) | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
2700 MHz |
185 mA |
2100 MHz |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
20 dB |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
YES |
TTL COMPATIBLE |
e3 |
10 dBm |
||||||||||||||
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
200 mA |
COMPONENT |
3300 MHz |
5 |
LCC20,.16SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
27 dB |
400 MHz |
3800 MHz |
-40 Cel |
Matte Tin (Sn) |
YES |
e3 |
10 dBm |
500 MHz |
|||||||||||||
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
COMPONENT |
5 |
TSSOP16,.25 |
RF/Microwave Up/Down Converters |
85 Cel |
21 dB |
-20 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
NO |
10 dB |
e4 |
|||||||||||||||||||
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
COMPONENT |
5 |
TSSOP16,.25 |
RF/Microwave Up/Down Converters |
85 Cel |
21 dB |
-20 Cel |
NO |
10 dB |
||||||||||||||||||||||
|
Texas Instruments |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
3800 MHz |
200 mA |
3300 MHz |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
22 dB |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
NO |
TTL COMPATIBLE |
e3 |
10 dBm |
||||||||||||||
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
48 |
PLASTIC/EPOXY |
3550 MHz |
2400 MHz |
COMPONENT |
5 |
LCC48,.27SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
90 dB |
400 MHz |
-40 Cel |
Matte Tin (Sn) |
YES |
4.7 dB |
e3 |
20 dBm |
500 MHz |
|||||||||||||
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
200 mA |
COMPONENT |
3300 MHz |
5 |
LCC20,.16SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
27 dB |
400 MHz |
3800 MHz |
-40 Cel |
Matte Tin (Sn) |
YES |
e3 |
10 dBm |
500 MHz |
|||||||||||||
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
200 mA |
COMPONENT |
3300 MHz |
5 |
LCC20,.16SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
27 dB |
400 MHz |
3800 MHz |
-40 Cel |
Matte Tin (Sn) |
YES |
e3 |
10 dBm |
500 MHz |
|||||||||||||
|
Texas Instruments |
UP CONVERTER |
SURFACE MOUNT |
48 |
PLASTIC/EPOXY |
3600 MHz |
1700 MHz |
COMPONENT |
5 |
LCC48,.27SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
0 dBm |
250 MHz |
-40 Cel |
Matte Tin (Sn) |
YES |
e3 |
20 dBm |
350 MHz |
|||||||||||||||
|
Texas Instruments |
UP CONVERTER |
SURFACE MOUNT |
48 |
PLASTIC/EPOXY |
2500 MHz |
1500 MHz |
COMPONENT |
5 |
LCC48,.27SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
0 dBm |
250 MHz |
-40 Cel |
Matte Tin (Sn) |
YES |
e3 |
20 dBm |
350 MHz |
|||||||||||||||
|
Texas Instruments |
UP CONVERTER |
SURFACE MOUNT |
48 |
PLASTIC/EPOXY |
2500 MHz |
1500 MHz |
COMPONENT |
5 |
LCC48,.27SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
0 dBm |
250 MHz |
-40 Cel |
Matte Tin (Sn) |
YES |
e3 |
20 dBm |
350 MHz |
|||||||||||||||
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
48 |
PLASTIC/EPOXY |
2400 MHz |
1700 MHz |
COMPONENT |
5 |
LCC48,.27SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
90 dB |
400 MHz |
-40 Cel |
Matte Tin (Sn) |
YES |
4.7 dB |
e3 |
20 dBm |
500 MHz |
|||||||||||||
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
13500 MHz |
9500 MHz |
COMPONENT |
+-5 |
LCC32,.2SQ,20 |
50 ohm |
12 dB |
85 Cel |
0 MHz |
-40 Cel |
YES |
10 dBm |
3500 MHz |
|||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
COMPONENT |
5600 MHz |
5 |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
10 dB |
0 MHz |
8600 MHz |
-40 Cel |
SILVER |
YES |
2.5 dB |
e4 |
15 dBm |
3500 MHz |
|||||||||||||
|
Analog Devices |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
CMOS |
238 mA |
3.3 |
LCC16,.16SQ,25 |
RF/Microwave Up/Down Converters |
MATTE TIN |
e3 |
||||||||||||||||||||||||
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
20000 MHz |
17000 MHz |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
13.5 dB |
85 Cel |
0 MHz |
-40 Cel |
MATTE TIN |
YES |
e3 |
10 dBm |
3500 MHz |
||||||||||||||
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
325 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
|||||||||||||||||||||||||
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
325 mA |
COMPONENT |
900 MHz |
5 |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
23 dB |
10 dBm |
50 MHz |
1600 MHz |
-40 Cel |
Tin/Lead (Sn/Pb) |
YES |
e0 |
500 MHz |
||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
34 |
PLASTIC/EPOXY |
1.92 |
COMPONENT |
71000 MHz |
-1,1.5,2,4 |
100 ohm |
85 Cel |
7 dB |
0 MHz |
76000 MHz |
-40 Cel |
YES |
8 dB |
2000 MHz |
|||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
GAAS |
COMPONENT |
20000 MHz |
3/4 |
LCC6(UNSPEC) |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-2 dB |
700 MHz |
31000 MHz |
-40 Cel |
GOLD OVER NICKEL |
YES |
e4 |
13 dBm |
3000 MHz |
|||||||||||||
|
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
325 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
|||||||||||||||||||||||||
|
Analog Devices |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
CMOS |
238 mA |
3.3 |
LCC16,.16SQ,25 |
RF/Microwave Up/Down Converters |
MATTE TIN |
e3 |
||||||||||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
3.3,5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
|||||||||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
200 mA |
4.5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-55 Cel |
MATTE TIN |
e3 |
|||||||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
325 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
28 |
PLASTIC/EPOXY |
225 mA |
COMPONENT |
1500 MHz |
3.3 |
LCC28,.16X.2,20 |
50 ohm |
105 Cel |
4.4 dB |
1 MHz |
7000 MHz |
-40 Cel |
MATTE TIN |
YES |
24 dB |
e3 |
20 dBm |
900 MHz |
|||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
28 |
PLASTIC/EPOXY |
225 mA |
COMPONENT |
1500 MHz |
3.3 |
LCC28,.16X.2,20 |
50 ohm |
105 Cel |
4.4 dB |
1 MHz |
7000 MHz |
-40 Cel |
MATTE TIN |
YES |
24 dB |
e3 |
20 dBm |
900 MHz |
|||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
BICMOS |
COMPONENT |
16950 MHz |
5 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
26 dB |
7 dBm |
900 MHz |
22050 MHz |
-40 Cel |
YES |
2500 MHz |
||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
120 mA |
COMPONENT |
10000 MHz |
3,4 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
9 dB |
0 MHz |
16000 MHz |
-40 Cel |
MATTE TIN |
NO |
2.5 dB |
e3 |
8 dBm |
3500 MHz |
||||||||||||
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
24000 MHz |
21000 MHz |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
10 dB |
85 Cel |
4 dBm |
0 MHz |
-40 Cel |
MATTE TIN |
YES |
14 dB |
e3 |
10 dBm |
3500 MHz |
||||||||||||
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
50 |
PLASTIC/EPOXY |
76000 MHz |
1.92 |
71000 MHz |
COMPONENT |
-1,-5,1.5,4 |
24.5 dB |
85 Cel |
0 MHz |
-40 Cel |
YES |
2000 MHz |
|||||||||||||||||||
Analog Devices |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
520 mA |
5 |
LCC40,.24SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
225 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
COMPONENT |
5600 MHz |
5 |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
10 dB |
0 MHz |
8600 MHz |
-40 Cel |
SILVER |
YES |
2.5 dB |
e4 |
15 dBm |
3500 MHz |
|||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
105 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-55 Cel |
|||||||||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
BICMOS |
COMPONENT |
16950 MHz |
5 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
26 dB |
7 dBm |
900 MHz |
22050 MHz |
-40 Cel |
YES |
2500 MHz |
||||||||||||||||
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
20000 MHz |
17000 MHz |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
13.5 dB |
85 Cel |
0 MHz |
-40 Cel |
MATTE TIN |
YES |
e3 |
10 dBm |
3500 MHz |
||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
200 mA |
COMPONENT |
5600 MHz |
3.5 |
LCC24,.16SQ,20 |
85 Cel |
10 dB |
0 MHz |
8600 MHz |
-40 Cel |
Matte Tin (Sn) - annealed |
YES |
2.5 dB |
e3 |
3500 MHz |
||||||||||||||
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
325 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
31000 MHz |
4.42 |
27000 MHz |
COMPONENT |
1.8,3.3,4 |
LCC40,.24SQ,20 |
50 ohm |
17 dB |
85 Cel |
2000 MHz |
-40 Cel |
YES |
5 dBm |
3000 MHz |
||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
210 mA |
4.5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
|||||||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
200 mA |
COMPONENT |
5600 MHz |
3.5 |
LCC24,.16SQ,20 |
85 Cel |
10 dB |
0 MHz |
8600 MHz |
-40 Cel |
MATTE TIN |
YES |
2.5 dB |
e3 |
3500 MHz |
||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
200 mA |
4.5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-55 Cel |
MATTE TIN |
e3 |
|||||||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
GAAS |
COMPONENT |
20000 MHz |
3/4 |
LCC6,.2SQ,40 |
50 ohm |
85 Cel |
-2 dB |
700 MHz |
31000 MHz |
-40 Cel |
YES |
13 dBm |
3000 MHz |
||||||||||||||||
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
31000 MHz |
4.42 |
27000 MHz |
COMPONENT |
1.8,3.3,4 |
LCC40,.24SQ,20 |
50 ohm |
17 dB |
85 Cel |
2000 MHz |
-40 Cel |
YES |
5 dBm |
3000 MHz |
||||||||||||||||
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
150 mA |
COMPONENT |
700 MHz |
3.3 |
LCC40,.24SQ,20 |
50 ohm |
85 Cel |
4.7 dB |
50 MHz |
3800 MHz |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
15.7 dB |
ADDITIONAL 5V SUPPLY IS ALSO REQUIRED |
e4 |
20 dBm |
350 MHz |
||||||||||||
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
225 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
|||||||||||||||||||||||||
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
50 |
PLASTIC/EPOXY |
86000 MHz |
1.43 |
81000 MHz |
COMPONENT |
-1,-5,1.5,4 |
85 Cel |
0 MHz |
-40 Cel |
YES |
4 dBm |
2000 MHz |
RF/microwave up/down converters are electronic devices that can convert high frequency (HF) signals to a lower frequency or vice versa. These converters are essential components of modern communication systems, where the frequency of the signal needs to be changed to enable transmission and reception. The up/down conversion process can be achieved through a variety of methods, including heterodyne mixing, direct mixing, and superheterodyne mixing.
Heterodyne mixing involves mixing the incoming signal with a local oscillator signal to generate an intermediate frequency (IF) signal. This method is widely used in superheterodyne receivers and is often used in upconversion. Direct mixing involves converting the frequency of the input signal to the desired frequency using a nonlinear device such as a diode. This method is often used in frequency synthesizers and mixers.
Superheterodyne mixing combines the advantages of heterodyne and direct mixing to achieve high sensitivity and selectivity. In a superheterodyne receiver, the incoming signal is mixed with a local oscillator signal to produce an IF signal, which is then amplified and demodulated. Superheterodyne mixing is also used in frequency upconversion, where the input signal is mixed with a local oscillator signal to produce the desired output frequency.
RF/microwave up/down converters are used in a variety of applications, including wireless communication systems, satellite communication systems, radar systems, and test and measurement equipment. They are available in various forms, including integrated circuits (ICs), modules, and subsystems, and can operate at a range of frequencies, from a few megahertz to several gigahertz.