UP CONVERTER RF/Microwave Up/Down Converters 107

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum RF Output Frequency	Maximum Voltage Standing Wave Ratio	Maximum Supply Current	Minimum RF Output Frequency	Construction	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Minimum Up Conversion Gain	Maximum Operating Temperature	Maximum Output Power	Minimum Intermediate Frequency (IF)	Minimum Operating Temperature	Terminal Finish	LO Tunable	Maximum Noise Figure	Additional Features	JESD-609 Code	Minimum Input Power (CW)	Maximum Intermediate Frequency (IF)
HMC815BLC5TR-R5	Analog Devices	UP CONVERTER					27000 MHz			21000 MHz	COMPONENT			50 ohm		7 dB	85 Cel		0 MHz	-40 Cel	GOLD OVER NICKEL	YES			e4		3750 MHz
HMC7912LP5ETR	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	PLASTIC/EPOXY	GAAS	24000 MHz			21000 MHz	COMPONENT	5	LCC32,.2SQ,20	50 ohm		10 dB	85 Cel	4 dBm	0 MHz	-40 Cel	MATTE TIN	YES	14 dB		e3	10 dBm	3500 MHz
HMC819LC5	Analog Devices	UP CONVERTER					23600 MHz			17700 MHz	COMPONENT			50 ohm		11 dB	85 Cel		0 MHz	-40 Cel	GOLD OVER NICKEL	YES			e4		3750 MHz
HMC6146BLC5A	Analog Devices	UP CONVERTER					44000 MHz			40000 MHz	COMPONENT			50 ohm		7 dB	85 Cel		0 MHz	-40 Cel	GOLD OVER NICKEL	YES			e4		4000 MHz
HMC8118	Analog Devices	UP CONVERTER	SURFACE MOUNT	24		GAAS	76000 MHz			71000 MHz	COMPONENT		DIE OR CHIP	50 ohm			85 Cel		0 MHz	-55 Cel		YES				10 dBm	10000 MHz
HMC815BLC5	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS	27000 MHz			21000 MHz	COMPONENT	4.5	LCC32,.2SQ,20	50 ohm		7 dB	85 Cel	20 dBm	0 MHz	-40 Cel	GOLD OVER NICKEL	YES			e4	15 dBm	3750 MHz
HMC6505LC5	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS						5	LCC32,.2SQ,20		RF/Microwave Up/Down Converters		85 Cel			-40 Cel
ADMV7310BCEZ	Analog Devices	UP CONVERTER	SURFACE MOUNT	50	PLASTIC/EPOXY		76000 MHz	1.92		71000 MHz	COMPONENT	-1,-5,1.5,4				24.5 dB	85 Cel		0 MHz	-40 Cel		YES					2000 MHz
HMC819LC5TR	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS			300 mA			5	LCC32,.2SQ,20		RF/Microwave Up/Down Converters		85 Cel			-40 Cel
ADMV1013ACCZ	Analog Devices	UP CONVERTER					44000 MHz			24000 MHz	COMPONENT			50 ohm		13 dB	85 Cel		800 MHz	-40 Cel			19 dB				6000 MHz
HMC6787ALC5ATR	Analog Devices	UP CONVERTER	SURFACE MOUNT	16	CERAMIC	GAAS	40000 MHz			37000 MHz	COMPONENT	3		50 ohm		7 dB	85 Cel		0 MHz	-40 Cel		YES					4000 MHz
HMC6146BLC5ATR-R5	Analog Devices	UP CONVERTER	SURFACE MOUNT	16	CERAMIC	GAAS	44000 MHz			40000 MHz	COMPONENT	3		50 ohm		7 dB	85 Cel		0 MHz	-40 Cel	GOLD OVER NICKEL	YES			e4		4000 MHz
HMC7584LG	Analog Devices	UP CONVERTER					76000 MHz			71000 MHz	COMPONENT			50 ohm			85 Cel		0 MHz	-40 Cel		YES		IMAGE REJECTION			2000 MHz
HMC7911LP5ETR	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	PLASTIC/EPOXY	GAAS	20000 MHz			17000 MHz	COMPONENT	5	LCC32,.2SQ,20	50 ohm		13.5 dB	85 Cel		0 MHz	-40 Cel	MATTE TIN	YES			e3	10 dBm	3500 MHz
HMC6505ALC5	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS	8600 MHz			5500 MHz	COMPONENT	5	LCC32,.2SQ,20	50 ohm		12 dB	85 Cel	22 dBm	0 MHz	-40 Cel	GOLD OVER NICKEL	YES			e4	10 dBm	3000 MHz
HMC6505ALC5TR	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS	8600 MHz			5500 MHz	COMPONENT	5	LCC32,.2SQ,20	50 ohm		12 dB	85 Cel	22 dBm	0 MHz	-40 Cel	TUNGSTEN NICKEL GOLD	YES				10 dBm	3000 MHz
ADMV4530ACCZ-RL7	Analog Devices	UP CONVERTER	SURFACE MOUNT	40	PLASTIC/EPOXY		31000 MHz	4.42		27000 MHz	COMPONENT	1.8,3.3,4	LCC40,.24SQ,20	50 ohm		17 dB	85 Cel		2000 MHz	-40 Cel		YES				5 dBm	3000 MHz
HMC8118-SX	Analog Devices	UP CONVERTER	SURFACE MOUNT	24		GAAS	76000 MHz			71000 MHz	COMPONENT		DIE OR CHIP	50 ohm			85 Cel		0 MHz	-55 Cel		YES				10 dBm	10000 MHz
HMC924LC5TR	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS						5	LCC32,.2SQ,20		RF/Microwave Up/Down Converters		85 Cel			-40 Cel
HMC925LC5TR	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS						5	LCC32,.2SQ,20		RF/Microwave Up/Down Converters		85 Cel			-40 Cel
HMC8119-SX	Analog Devices	UP CONVERTER					86000 MHz			81000 MHz	COMPONENT			50 ohm			85 Cel		0 MHz	-55 Cel		YES					10000 MHz
HMC709LC5	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS	17000 MHz		150 mA	11000 MHz	COMPONENT	5	LCC32,.2SQ,20	50 ohm	RF/Microwave Up/Down Converters	10 dB	85 Cel		0 MHz	-55 Cel	GOLD OVER NICKEL	YES			e4		1500 MHz
HMC815LC5TR	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS			300 mA			4.5	LCC32,.2SQ,20		RF/Microwave Up/Down Converters		85 Cel			-55 Cel
ADMV4530ACCZ	Analog Devices	UP CONVERTER	SURFACE MOUNT	40	PLASTIC/EPOXY		31000 MHz	4.42		27000 MHz	COMPONENT	1.8,3.3,4	LCC40,.24SQ,20	50 ohm		17 dB	85 Cel		2000 MHz	-40 Cel		YES				5 dBm	3000 MHz
HMC6505ALC5TR-R5	Analog Devices	UP CONVERTER	SURFACE MOUNT	32	CERAMIC	GAAS	8600 MHz			5500 MHz	COMPONENT	5	LCC32,.2SQ,20	50 ohm		12 dB	85 Cel	22 dBm	0 MHz	-40 Cel	TUNGSTEN NICKEL GOLD	YES				10 dBm	3000 MHz
ADMV7320BCEZ	Analog Devices	UP CONVERTER	SURFACE MOUNT	50	PLASTIC/EPOXY		86000 MHz	1.43		81000 MHz	COMPONENT	-1,-5,1.5,4					85 Cel		0 MHz	-40 Cel		YES				4 dBm	2000 MHz
HMC7585LG	Analog Devices	UP CONVERTER					86000 MHz			81000 MHz	COMPONENT			50 ohm					0 MHz			YES					2000 MHz
ADMV4630BCPZN	Analog Devices	UP CONVERTER
ADMV4630BCPZN-RL7	Analog Devices	UP CONVERTER
MAX2661EUT+T	Analog Devices	UP CONVERTER					2500 MHz	2.2		400 MHz	COMPONENT			50 ohm		7 dB	85 Cel		40 MHz	-40 Cel	Matte Tin (Sn) - annealed	NO	11.8 dB		e3		500 MHz
MAX2662EUT-T	Analog Devices	UP CONVERTER					2500 MHz										85 Cel		10 MHz	-40 Cel	TIN LEAD	NO			e0		500 MHz
MAX2661EUT+	Analog Devices	UP CONVERTER																			Matte Tin (Sn) - annealed				e3
MAX2673	Analog Devices	UP CONVERTER					2500 MHz			40 MHz						12 dB			10 MHz		TIN LEAD	YES	8 dB		e0		500 MHz
MAX2673EUA+	Analog Devices	UP CONVERTER					2500 MHz	2.2		400 MHz	COMPONENT			50 ohm		7.8 dB	85 Cel		40 MHz	-40 Cel	Matte Tin (Sn) - annealed	NO	10.4 dB		e3		500 MHz
MAX2660	Analog Devices	UP CONVERTER					2500 MHz			40 MHz						8 dB			10 MHz		TIN LEAD	YES	8 dB		e0		500 MHz
MAX2673EUA+T	Analog Devices	UP CONVERTER					2500 MHz	2.2		400 MHz	COMPONENT			50 ohm		7.8 dB	85 Cel		40 MHz	-40 Cel	Matte Tin (Sn) - annealed	NO	10.4 dB		e3		500 MHz
MAX2661	Analog Devices	UP CONVERTER					2500 MHz			40 MHz						11 dB			10 MHz		TIN LEAD	YES	8 dB		e0		500 MHz
MAX2671EUT+	Analog Devices	UP CONVERTER																			Matte Tin (Sn) - annealed				e3
MAX2663	Analog Devices	UP CONVERTER					2500 MHz			40 MHz						4 dB			10 MHz		TIN LEAD	YES	8 dB		e0		500 MHz
MAX2660EUT+	Analog Devices	UP CONVERTER																			Matte Tin (Sn) - annealed				e3
MAX2671	Analog Devices	UP CONVERTER					2500 MHz			40 MHz						11 dB			10 MHz		TIN LEAD	YES	8 dB		e0		500 MHz
MRFIC1813	NXP Semiconductors	UP CONVERTER	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	2500 MHz		35 mA	1700 MHz	COMPONENT	3	TSSOP16,.25		RF/Microwave Up/Down Converters	12 dB	85 Cel		70 MHz	-30 Cel	Tin/Lead (Sn/Pb)	YES			e0		350 MHz
CGY340	Infineon Technologies	UP CONVERTER	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	3450 MHz			3425 MHz	COMPONENT	+-5	SOP16,.35,32		RF/Microwave Up/Down Converters		85 Cel	0 dBm	1066 MHz	-40 Cel	Tin/Lead (Sn/Pb)	NO			e0		1091 MHz
MAX2673EUA	Maxim Integrated	UP CONVERTER	SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR	2500 MHz	2.2	26.8 mA	400 MHz	COMPONENT	3/5	TSSOP8,.19	50 ohm	RF/Microwave Up/Down Converters	7.8 dB	85 Cel		40 MHz	-40 Cel	TIN LEAD	NO	10.4 dB		e0		500 MHz
MAX2721EUP+T	Maxim Integrated	UP CONVERTER					2500 MHz	2		2100 MHz	COMPONENT			50 ohm			85 Cel	-2.5 dBm	1050 MHz	-40 Cel	Matte Tin (Sn)	YES			e3		2500 MHz
MAX2663EUT-T	Maxim Integrated	UP CONVERTER	SURFACE MOUNT	6	PLASTIC/EPOXY	BIPOLAR	2500 MHz	2.1	4.1 mA	400 MHz	COMPONENT	3/5	TSOP6,.11,37	50 ohm	RF/Microwave Up/Down Converters	-.1 dB	85 Cel		40 MHz	-40 Cel	TIN LEAD	NO	12.7 dB		e0		500 MHz
MAX2721EUP	Maxim Integrated	UP CONVERTER					2500 MHz	2		2100 MHz	COMPONENT			50 ohm			85 Cel	-2.5 dBm	1050 MHz	-40 Cel	Tin/Lead (Sn85Pb15)	YES			e0		2500 MHz
MAX2720EUP+T	Maxim Integrated	UP CONVERTER					2100 MHz	2		1700 MHz	COMPONENT			50 ohm			85 Cel	-6 dBm	850 MHz	-40 Cel	MATTE TIN	YES			e3		2100 MHz

RF/Microwave Up/Down Converters

RF/microwave up/down converters are electronic devices that can convert high frequency (HF) signals to a lower frequency or vice versa. These converters are essential components of modern communication systems, where the frequency of the signal needs to be changed to enable transmission and reception. The up/down conversion process can be achieved through a variety of methods, including heterodyne mixing, direct mixing, and superheterodyne mixing.

Heterodyne mixing involves mixing the incoming signal with a local oscillator signal to generate an intermediate frequency (IF) signal. This method is widely used in superheterodyne receivers and is often used in upconversion. Direct mixing involves converting the frequency of the input signal to the desired frequency using a nonlinear device such as a diode. This method is often used in frequency synthesizers and mixers.

Superheterodyne mixing combines the advantages of heterodyne and direct mixing to achieve high sensitivity and selectivity. In a superheterodyne receiver, the incoming signal is mixed with a local oscillator signal to produce an IF signal, which is then amplified and demodulated. Superheterodyne mixing is also used in frequency upconversion, where the input signal is mixed with a local oscillator signal to produce the desired output frequency.

RF/microwave up/down converters are used in a variety of applications, including wireless communication systems, satellite communication systems, radar systems, and test and measurement equipment. They are available in various forms, including integrated circuits (ICs), modules, and subsystems, and can operate at a range of frequencies, from a few megahertz to several gigahertz.