BICMOS RF/Microwave Up/Down Converters 28

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum Supply Current	Construction	Minimum RF Input Frequency	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Maximum Operating Temperature	Minimum Down Conversion Gain	Maximum Output Power	Minimum Intermediate Frequency (IF)	Maximum RF Input Frequency	Minimum Operating Temperature	Terminal Finish	LO Tunable	Maximum Noise Figure	Additional Features	JESD-609 Code	Maximum Intermediate Frequency (IF)
ADMV4420ACPZ	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	32	PLASTIC/EPOXY	BICMOS		COMPONENT	16950 MHz	5	LCC32,.2SQ,20	50 ohm		85 Cel	26 dB	7 dBm	900 MHz	22050 MHz	-40 Cel		YES				2500 MHz
MC13770FCR2	Freescale Semiconductor		SURFACE MOUNT	12	PLASTIC/EPOXY	BICMOS				2.75	LCC12,.12SQ,20		RF/Microwave Up/Down Converters	85 Cel					-40 Cel
ADMV4420ACPZ-R2	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	32	PLASTIC/EPOXY	BICMOS		COMPONENT	16950 MHz	5	LCC32,.2SQ,20	50 ohm		85 Cel	26 dB	7 dBm	900 MHz	22050 MHz	-40 Cel		YES				2500 MHz
ADMV4420ACPZ-RL7	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	32	PLASTIC/EPOXY	BICMOS		COMPONENT	16950 MHz	5	LCC32,.2SQ,20	50 ohm		85 Cel	26 dB	7 dBm	900 MHz	22050 MHz	-40 Cel		YES				2500 MHz
MAX9996ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	240 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3	350 MHz
MAX9996ETP+TD	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	240 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3	350 MHz
MAX9996ETP+	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	240 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3	350 MHz
MAX9986ETP+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB		e3	250 MHz
MAX9984ETP+TD	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	400 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Mixers	85 Cel			50 MHz	1000 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES			e3	250 MHz
MAX9986ETP+	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB		e3	250 MHz
MAX19997AETX+TD	Analog Devices		SURFACE MOUNT	36	PLASTIC/EPOXY	BICMOS	420 mA			3.3/5	LCC36,.25SQ,20		RF/Microwave Up/Down Converters	85 Cel					-40 Cel
MAX9994ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	235 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7.2 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3	350 MHz
MAX9984ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	400 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Mixers	85 Cel			50 MHz	1000 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES			e3	250 MHz
MAX9996ETP+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	240 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3	350 MHz
MAX9986ETP+TD	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB		e3	250 MHz
MAX9986ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB		e3	250 MHz
STW82100BTR	STMicroelectronics	DOWN CONVERTER	SURFACE MOUNT	44	PLASTIC/EPOXY	BICMOS		COMPONENT	1850 MHz	3.3,5	LCC44,.28SQ,20	50 ohm	RF/Microwave Up/Down Converters	85 Cel				2400 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES			e3
STW82100B	STMicroelectronics	DOWN CONVERTER	SURFACE MOUNT	44	PLASTIC/EPOXY	BICMOS		COMPONENT	1850 MHz	3.3,5	LCC44,.28SQ,20	50 ohm	RF/Microwave Up/Down Converters	85 Cel				2400 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES			e3
SA9503	NXP Semiconductors	DOWN CONVERTER	SURFACE MOUNT	32	PLASTIC/EPOXY	BICMOS	34.5 mA	COMPONENT	869 MHz	3	LCC32,.16SQ,20		RF/Microwave Up/Down Converters	85 Cel	10.5 dB		50 MHz	894 MHz	-40 Cel		NO	11 dB	DOWN CONVERSION GAIN FOR FM IS 6.5		300 MHz
MAX9994ETP	Maxim Integrated	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	235 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7.2 dB		40 MHz	2200 MHz	-40 Cel	TIN LEAD	YES	9.7 dB		e0	350 MHz
MAX9996ETP-T	Maxim Integrated	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	240 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	Tin/Lead (Sn/Pb)	YES	9.7 dB		e0	350 MHz
MAX9994ETP+TD	Maxim Integrated	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	235 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7.2 dB		40 MHz	2200 MHz	-40 Cel	Tin (Sn)	YES	9.7 dB		e3	350 MHz
MAX9984ETP	Maxim Integrated	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	400 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Mixers	85 Cel			50 MHz	1000 MHz	-40 Cel	TIN LEAD	YES			e0	250 MHz
MAX9996ETP	Maxim Integrated	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	240 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	TIN LEAD	YES	9.7 dB		e0	350 MHz
MAX9984ETP-T	Maxim Integrated	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	400 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Mixers	85 Cel			50 MHz	1000 MHz	-40 Cel	Tin/Lead (Sn/Pb)	YES			e0	250 MHz
MAX9986ETP-T	Maxim Integrated	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	Tin/Lead (Sn/Pb)	YES	9.3 dB		e0	250 MHz
MAX9994ETP-T	Maxim Integrated	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	235 mA	COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	7.2 dB		40 MHz	2200 MHz	-40 Cel	Tin/Lead (Sn/Pb)	YES	9.7 dB		e0	350 MHz
MAX9986ETP	Maxim Integrated	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	265 mA	COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters	85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	TIN LEAD	YES	9.3 dB		e0	250 MHz

RF/Microwave Up/Down Converters

RF/microwave up/down converters are electronic devices that can convert high frequency (HF) signals to a lower frequency or vice versa. These converters are essential components of modern communication systems, where the frequency of the signal needs to be changed to enable transmission and reception. The up/down conversion process can be achieved through a variety of methods, including heterodyne mixing, direct mixing, and superheterodyne mixing.

Heterodyne mixing involves mixing the incoming signal with a local oscillator signal to generate an intermediate frequency (IF) signal. This method is widely used in superheterodyne receivers and is often used in upconversion. Direct mixing involves converting the frequency of the input signal to the desired frequency using a nonlinear device such as a diode. This method is often used in frequency synthesizers and mixers.

Superheterodyne mixing combines the advantages of heterodyne and direct mixing to achieve high sensitivity and selectivity. In a superheterodyne receiver, the incoming signal is mixed with a local oscillator signal to produce an IF signal, which is then amplified and demodulated. Superheterodyne mixing is also used in frequency upconversion, where the input signal is mixed with a local oscillator signal to produce the desired output frequency.

RF/microwave up/down converters are used in a variety of applications, including wireless communication systems, satellite communication systems, radar systems, and test and measurement equipment. They are available in various forms, including integrated circuits (ICs), modules, and subsystems, and can operate at a range of frequencies, from a few megahertz to several gigahertz.