BIPOLAR RF/Microwave Up/Down Converters 95

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  2. RF/Microwave Up/Down Converters
Manufacturers
    • Agilent Technologies
    • Analog Devices
    • Broadcom
    • Freescale Semiconductor
    • Infineon Technologies
    • L-3 Narda-miteq
    • Maxim Integrated
    • NXP Semiconductors
    • Onsemi
    • Qorvo
    • Renesas Electronics
    • STMicroelectronics
    • Texas Instruments
    • Toshiba
RF or Microwave Device Type
    • DOUBLE BALANCED
    • DOWN CONVERTER
    • UP CONVERTER
    • UP/DOWN CONVERTER
Mounting Feature
    • PANEL MOUNT
    • SURFACE MOUNT
No. of Terminals
    • 10
    • 12
    • 120
    • 14
    • 16
    • 20
    • 24
    • 28
    • 30
    • 32
    • 34
    • 36
    • 38
    • 40
    • 44
    • 48
    • 5
    • 50
    • 6
    • 8
Package Body Material
    • CERAMIC
    • METAL
    • PLASTIC/EPOXY
Technology (1)
    • BIPOLAR
    • BICMOS
    • CMOS
    • GAAS
Maximum RF Output Frequency
    • 13500 MHz
    • 1450 MHz
    • 15400 MHz
    • 16000 MHz
    • 17000 MHz
    • 1900 MHz
    • 20000 MHz
    • 2100 MHz
    • 23600 MHz
    • 2400 MHz
    • 24000 MHz
    • 2450 MHz
    • 2500 MHz
    • 2700 MHz
    • 27000 MHz
    • 31000 MHz
    • 3450 MHz
    • 3550 MHz
    • 3600 MHz
    • 3800 MHz
    • 40000 MHz
    • 44000 MHz
    • 76000 MHz
    • 849 MHz
    • 8600 MHz
    • 86000 MHz
    • 868 MHz
Maximum Input Power (CW)
    • 22 dBm
Maximum Voltage Standing Wave Ratio
    • 1.2
    • 1.43
    • 1.5
    • 1.6
    • 1.7
    • 1.8
    • 1.92
    • 2
    • 2.1
    • 2.2
    • 2.5
    • 4.42
Maximum Supply Current
    • 1.4 mA
    • 100 mA
    • 105 mA
    • 108 mA
    • 11.3 mA
    • 11.7 mA
    • 110 mA
    • 12 mA
    • 12.7 mA
    • 120 mA
    • 125 mA
    • 13.5 mA
    • 130 mA
    • 14.8 mA
    • 150 mA
    • 16 mA
    • 16.6 mA
    • 180 mA
    • 185 mA
    • 19 mA
    • 19.5 mA
    • 190 mA
    • 195 mA
    • 2.1 mA
    • 200 mA
    • 21.8 mA
    • 210 mA
    • 215 mA
    • 217 mA
    • 225 mA
    • 23.5 mA
    • 230 mA
    • 235 mA
    • 238 mA
    • 240 mA
    • 25.3 mA
    • 25.5 mA
    • 26.8 mA
    • 265 mA
    • 275 mA
    • 30 mA
    • 30.8 mA
    • 300 mA
    • 31.5 mA
    • 32 mA
    • 325 mA
    • 33 mA
    • 34 mA
    • 34.5 mA
    • 345 mA
    • 35 mA
    • 37 mA
    • 4.1 mA
    • 40 mA
    • 40.5 mA
    • 400 mA
    • 420 mA
    • 45 mA
    • 45.5 mA
    • 48 mA
    • 50.7 mA
    • 52 mA
    • 52.7 mA
    • 520 mA
    • 53.5 mA
    • 585 mA
    • 59 mA
    • 6.6 mA
    • 60 mA
    • 65 mA
    • 66 mA
    • 7.7 mA
    • 70 mA
    • 78 mA
    • 8 mA
    • 8.5 mA
    • 87 mA
    • 89 mA
    • 90 mA
    • 92 mA
    • 93 mA
Minimum RF Output Frequency
    • 10000 MHz
    • 11000 MHz
    • 12000 MHz
    • 12700 MHz
    • 1500 MHz
    • 1700 MHz
    • 17000 MHz
    • 17700 MHz
    • 2100 MHz
    • 21000 MHz
    • 2400 MHz
    • 24000 MHz
    • 27000 MHz
    • 29000 MHz
    • 3300 MHz
    • 3425 MHz
    • 37000 MHz
    • 40 MHz
    • 400 MHz
    • 40000 MHz
    • 5500 MHz
    • 5900 MHz
    • 71000 MHz
    • 81000 MHz
    • 824 MHz
    • 864 MHz
    • 950 MHz
    • 9500 MHz
Construction
    • COMPONENT
    • MODULE
Minimum RF Input Frequency
    • 100 MHz
    • 1000 MHz
    • 10000 MHz
    • 12600 MHz
    • 1400 MHz
    • 150 MHz
    • 1500 MHz
    • 1570 MHz
    • 16950 MHz
    • 1700 MHz
    • 17000 MHz
    • 17500 MHz
    • 1800 MHz
    • 1850 MHz
    • 2000 MHz
    • 20000 MHz
    • 2100 MHz
    • 21000 MHz
    • 21200 MHz
    • 2300 MHz
    • 2400 MHz
    • 24000 MHz
    • 27000 MHz
    • 30 MHz
    • 300 MHz
    • 3300 MHz
    • 3400 MHz
    • 3700 MHz
    • 37000 MHz
    • 400 MHz
    • 50 MHz
    • 5600 MHz
    • 600 MHz
    • 700 MHz
    • 7000 MHz
    • 71000 MHz
    • 800 MHz
    • 81000 MHz
    • 815 MHz
    • 850 MHz
    • 864 MHz
    • 869 MHz
    • 900 MHz
    • 9000 MHz
    • 925 MHz
    • 950 MHz
Power Supplies (V)
    • +-5
    • -1,-5,1.5,4
    • -1,1.5,2,4
    • 1
    • 1.8
    • 1.8,3.3
    • 1.8,3.3,4
    • 1.8,3.3,5
    • 10
    • 2.7/4.5
    • 2.75
    • 2.8
    • 3
    • 3,4
    • 3,5
    • 3.3
    • 3.3,5
    • 3.3/5
    • 3.5
    • 3.5,5
    • 3.75
    • 3/3.3
    • 3/4
    • 3/5
    • 4
    • 4.5
    • 5
    • 9
Package Equivalence Code
    • DIE OR CHIP
    • FL8,.2FL
    • LCC12,.12SQ,20
    • LCC16,.16SQ,25
    • LCC16,.1X.14,20
    • LCC20,.16SQ,20
    • LCC20,.20SQ,25
    • LCC24,.16SQ,20
    • LCC28,.16X.2,20
    • LCC28,.27SQ,32
    • LCC28,.2SQ,20
    • LCC32,.16SQ,20
    • LCC32,.2SQ,16
    • LCC32,.2SQ,20
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC44,.28SQ,20
    • LCC48,.27SQ,20
    • LCC6(UNSPEC)
    • LCC6,.2SQ,40
    • LCC8,.2SQ,28
    • MODULE(UNSPEC)
    • QFP120,1.2SQ,32
    • QFP48,.35SQ,20
    • SOLCC6,.05,25
    • SOP14,.25
    • SOP16,.35,32
    • SOP20,.25,40
    • SOP20,.3
    • SOP34,.3,32
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.25
    • SSOP20,.3
    • SSOP24,.3
    • SSOP28,.3
    • SSOP30,.3
    • SSOP8,.19
    • SSOP8,.2
    • TQFP48,.35SQ
    • TSOP5/6,.11,37
    • TSOP6,.11,37
    • TSSOP10,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
    • TSSOP38,.25,20
    • TSSOP6,.08
    • TSSOP8,.16
    • TSSOP8,.19
Characteristic Impedance
    • 100 ohm
    • 30 ohm
    • 50 ohm
    • 75 ohm
Sub-Category
    • RF/Microwave Mixers
    • RF/Microwave Up/Down Converters
Minimum Up Conversion Gain
    • -.1 dB
    • 10 dB
    • 11 dB
    • 12 dB
    • 13 dB
    • 13.5 dB
    • 14 dB
    • 15 dB
    • 17 dB
    • 17.5 dB
    • 20 dB
    • 22 dB
    • 24.5 dB
    • 3.9 dB
    • 4 dB
    • 6.7 dB
    • 6.8 dB
    • 64 dB
    • 7 dB
    • 7.8 dB
    • 8 dB
    • 8.6 dB
Maximum Operating Temperature
    • 100 Cel
    • 105 Cel
    • 125 Cel
    • 50 Cel
    • 70 Cel
    • 75 Cel
    • 80 Cel
    • 85 Cel
Minimum Down Conversion Gain
    • -.8 dB
    • -2 dB
    • -3.5 dB
    • -5 dB
    • 10 dB
    • 10.5 dB
    • 10.6 dB
    • 10.7 dB
    • 10.9 dB
    • 11 dB
    • 11.3 dB
    • 11.6 dB
    • 12 dB
    • 12.5 dB
    • 13 dB
    • 14 dB
    • 14.2 dB
    • 14.7 dB
    • 15 dB
    • 15.5 dB
    • 16 dB
    • 18 dB
    • 21 dB
    • 22 dB
    • 23 dB
    • 24.5 dB
    • 25 dB
    • 26 dB
    • 27 dB
    • 33 dB
    • 35 dB
    • 4.4 dB
    • 4.7 dB
    • 4.8 dB
    • 5.7 dB
    • 6 dB
    • 6.5 dB
    • 6.6 dB
    • 6.7 dB
    • 65 dB
    • 7 dB
    • 7.2 dB
    • 7.8 dB
    • 8 dB
    • 8.5 dB
    • 8.7 dB
    • 9 dB
    • 9.6 dB
    • 90 dB
Maximum Output Power
    • -2.5 dBm
    • -6 dBm
    • 0 dBm
    • 10 dBm
    • 17 dBm
    • 2 dBm
    • 20 dBm
    • 22 dBm
    • 25 dBm
    • 4 dBm
    • 7 dBm
Minimum Intermediate Frequency (IF)
    • .1 MHz
    • 0 MHz
    • 1 MHz
    • 10 MHz
    • 100 MHz
    • 1000 MHz
    • 1050 MHz
    • 1066 MHz
    • 1240 MHz
    • 20 MHz
    • 2000 MHz
    • 24 MHz
    • 250 MHz
    • 2500 MHz
    • 270 MHz
    • 2700 MHz
    • 2800 MHz
    • 300 MHz
    • 350 MHz
    • 36 MHz
    • 4.5 MHz
    • 40 MHz
    • 400 MHz
    • 50 MHz
    • 610 MHz
    • 70 MHz
    • 700 MHz
    • 800 MHz
    • 850 MHz
    • 900 MHz
    • 950 MHz
Maximum RF Input Frequency
    • 1000 MHz
    • 1060 MHz
    • 1100 MHz
    • 1200 MHz
    • 12000 MHz
    • 1400 MHz
    • 15400 MHz
    • 1575 MHz
    • 1580 MHz
    • 1600 MHz
    • 16000 MHz
    • 1900 MHz
    • 2000 MHz
    • 20000 MHz
    • 2100 MHz
    • 2150 MHz
    • 2175 MHz
    • 2200 MHz
    • 22050 MHz
    • 23600 MHz
    • 2400 MHz
    • 24000 MHz
    • 250 MHz
    • 2500 MHz
    • 2700 MHz
    • 28000 MHz
    • 2900 MHz
    • 3000 MHz
    • 31000 MHz
    • 32000 MHz
    • 330 MHz
    • 34000 MHz
    • 3500 MHz
    • 3800 MHz
    • 40000 MHz
    • 4200 MHz
    • 44000 MHz
    • 5000 MHz
    • 6000 MHz
    • 7000 MHz
    • 76000 MHz
    • 8600 MHz
    • 86000 MHz
    • 861 MHz
    • 868 MHz
    • 894 MHz
    • 9000 MHz
    • 930 MHz
    • 950 MHz
    • 995 MHz
Minimum Operating Temperature
    • -10 Cel
    • -20 Cel
    • -25 Cel
    • -30 Cel
    • -40 Cel
    • -55 Cel
    • 0 Cel
Terminal Finish
    • GOLD
    • GOLD OVER NICKEL
    • Gold (Au) - with Nickel (Ni) barrier
    • MATTE TIN
    • Matte Tin (Sn)
    • Matte Tin (Sn) - annealed
    • NICKEL PALLADIUM GOLD
    • Nickel/Palladium/Gold (Ni/Pd/Au)
    • SILVER
    • Silver (Ag)
    • TIN
    • TIN LEAD
    • TUNGSTEN NICKEL GOLD
    • Tin (Sn)
    • Tin/Bismuth (Sn/Bi)
    • Tin/Lead (Sn/Pb)
    • Tin/Lead (Sn85Pb15)
    • Tin/Silver/Copper (Sn/Ag/Cu)
LO Tunable
    • NO
    • YES
Maximum Noise Figure
    • 10 dB
    • 10.4 dB
    • 10.9 dB
    • 11 dB
    • 11.3 dB
    • 11.5 dB
    • 11.7 dB
    • 11.8 dB
    • 11.9 dB
    • 12.7 dB
    • 13 dB
    • 13.5 dB
    • 14 dB
    • 14.5 dB
    • 15 dB
    • 15.5 dB
    • 15.7 dB
    • 16 dB
    • 16.5 dB
    • 18 dB
    • 19 dB
    • 2.2 dB
    • 2.5 dB
    • 2.6 dB
    • 22 dB
    • 24 dB
    • 3 dB
    • 4 dB
    • 4.7 dB
    • 5.5 dB
    • 6.3 dB
    • 6.5 dB
    • 7 dB
    • 8 dB
    • 8.5 dB
    • 8.8 dB
    • 9 dB
    • 9.3 dB
    • 9.5 dB
    • 9.7 dB
Maximum Conversion Loss
    • 28 dB
Additional Features
    • ADDITIONAL 5V SUPPLY IS ALSO REQUIRED
    • DOWN CONVERSION GAIN FOR FM IS 6.5
    • HIGH RELIABILITY
    • IMAGE REJECTION
    • IT CAN ALSO OPERATE AT 1850 TO 1910 MHZ
    • IT CAN ALSO OPERATE AT 1930 TO 1990 MHZ
    • K-F, SAM-F, IT CAN ALSO OPERATE AT 1000 TO 2000 MHZ
    • K-F; SMA-F
    • LOW NOISE
    • LOWNOISE
    • TTL COMPATIBLE
JESD-609 Code
    • e0
    • e1
    • e3
    • e4
    • e6
Minimum Input Power (CW)
    • -10 dBm
    • -15 dBm
    • -17 dBm
    • -25 dBm
    • -30 dBm
    • 0 dBm
    • 10 dBm
    • 13 dBm
    • 15 dBm
    • 18 dBm
    • 2 dBm
    • 20 dBm
    • 22 dBm
    • 4 dBm
    • 5 dBm
    • 8 dBm
Minimum Operating Frequency
    • 1700 MHz
Maximum Intermediate Frequency (IF)
    • 100 MHz
    • 1000 MHz
    • 10000 MHz
    • 1091 MHz
    • 1280 MHz
    • 14.5 MHz
    • 150 MHz
    • 1500 MHz
    • 1950 MHz
    • 2000 MHz
    • 2100 MHz
    • 25.5 MHz
    • 250 MHz
    • 2500 MHz
    • 300 MHz
    • 3000 MHz
    • 350 MHz
    • 3500 MHz
    • 3750 MHz
    • 40 MHz
    • 400 MHz
    • 4000 MHz
    • 450 MHz
    • 46 MHz
    • 500 MHz
    • 550 MHz
    • 600 MHz
    • 6000 MHz
    • 650 MHz
    • 900 MHz
Maximum Operating Frequency
    • 2200 MHz
Reset All
Part RoHS Manufacturer RF or Microwave Device Type Mounting Feature No. of Terminals Package Body Material Technology Maximum RF Output Frequency Maximum Input Power (CW) Maximum Voltage Standing Wave Ratio Maximum Supply Current Minimum RF Output Frequency Construction Minimum RF Input Frequency Power Supplies (V) Package Equivalence Code Characteristic Impedance Sub-Category Minimum Up Conversion Gain Maximum Operating Temperature Minimum Down Conversion Gain Maximum Output Power Minimum Intermediate Frequency (IF) Maximum RF Input Frequency Minimum Operating Temperature Terminal Finish LO Tunable Maximum Noise Figure Maximum Conversion Loss Additional Features JESD-609 Code Minimum Input Power (CW) Minimum Operating Frequency Maximum Intermediate Frequency (IF) Maximum Operating Frequency

MAX2671EUT-T

Maxim Integrated

UP CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

2500 MHz

2.2

16.6 mA

400 MHz

COMPONENT

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

6.7 dB

85 Cel

40 MHz

-40 Cel

Tin/Lead (Sn/Pb)

NO

11.3 dB

e0

500 MHz

MAX2671EUT+T

Analog Devices

UP CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

2500 MHz

2.2

16.6 mA

400 MHz

COMPONENT

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

6.7 dB

85 Cel

40 MHz

-40 Cel

Matte Tin (Sn) - annealed

NO

11.3 dB

e3

500 MHz

IAM-82008-TR1

Agilent Technologies

DOWN CONVERTER

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

2.5

65 mA

COMPONENT

50 MHz

10

SOP8,.25

50 ohm

RF/Microwave Mixers

85 Cel

13 dB

0 MHz

5000 MHz

-40 Cel

Tin/Lead (Sn/Pb)

YES

HIGH RELIABILITY

e0

2000 MHz

IAM-81008-TR1

Agilent Technologies

DOWN CONVERTER

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

1.5

16 mA

COMPONENT

5

SOP8,.25

50 ohm

RF/Microwave Mixers

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

e0

MAX2682EUT-T

Maxim Integrated

DOWN CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

1.5

21.8 mA

400 MHz

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

85 Cel

8.7 dB

10 MHz

2500 MHz

-40 Cel

TIN LEAD

YES

e0

500 MHz

MAX2682EUT+T

Analog Devices

DOWN CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

1.5

12.7 mA

COMPONENT

400 MHz

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

85 Cel

8.7 dB

10 MHz

2500 MHz

-40 Cel

Matte Tin (Sn) - annealed

YES

e3

500 MHz

MAX2681EUT-T

Maxim Integrated

DOWN CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

1.5

12.7 mA

400 MHz

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

85 Cel

6.7 dB

10 MHz

2500 MHz

-40 Cel

TIN LEAD

YES

e0

500 MHz

MAX2681EUT+T

Analog Devices

DOWN CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

1.5

21.8 mA

COMPONENT

400 MHz

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

85 Cel

6.7 dB

10 MHz

2500 MHz

-40 Cel

Matte Tin (Sn) - annealed

YES

e3

500 MHz

IAM-82008-STR

Agilent Technologies

DOWN CONVERTER

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

2.5

65 mA

COMPONENT

50 MHz

10

SOP8,.25

50 ohm

RF/Microwave Mixers

13 dB

0 MHz

5000 MHz

Tin/Lead (Sn/Pb)

YES

HIGH RELIABILITY

e0

2000 MHz

MAX2660EUT-T

Maxim Integrated

UP CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

2500 MHz

2.2

6.6 mA

400 MHz

COMPONENT

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

3.9 dB

85 Cel

40 MHz

-40 Cel

TIN LEAD

NO

11.9 dB

e0

500 MHz

MAX2682EUT

Maxim Integrated

DOWN CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

1.5

21.8 mA

COMPONENT

400 MHz

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

85 Cel

8.7 dB

10 MHz

2500 MHz

-40 Cel

TIN LEAD

YES

e0

500 MHz

MAX2682EUT+

Analog Devices

DOWN CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

1.5

12.7 mA

COMPONENT

400 MHz

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

85 Cel

8.7 dB

10 MHz

2500 MHz

-40 Cel

Matte Tin (Sn) - annealed

YES

e3

500 MHz

MAX2680EUT+T

Analog Devices

DOWN CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

1.5

7.7 mA

COMPONENT

400 MHz

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

85 Cel

5.7 dB

10 MHz

2500 MHz

-40 Cel

Matte Tin (Sn) - annealed

YES

e3

500 MHz

LA7784-TLM-E

Onsemi

SURFACE MOUNT

34

PLASTIC/EPOXY

BIPOLAR

130 mA

5

SOP34,.3,32

RF/Microwave Up/Down Converters

70 Cel

-20 Cel

Tin/Bismuth (Sn/Bi)

e6

MRFIC1502

NXP Semiconductors

DOWN CONVERTER

SURFACE MOUNT

48

PLASTIC/EPOXY

BIPOLAR

2

60 mA

COMPONENT

5

QFP48,.35SQ,20

50 ohm

RF/Microwave Up/Down Converters

100 Cel

65 dB

4.5 MHz

1575 MHz

-40 Cel

Tin/Lead (Sn/Pb)

NO

e0

14.5 MHz

PMB2332

Infineon Technologies

DOWN CONVERTER

SURFACE MOUNT

16

PLASTIC/EPOXY

BIPOLAR

2.7/4.5

TSSOP16,.25

50 ohm

RF/Microwave Mixers

85 Cel

1100 MHz

-40 Cel

Tin/Lead (Sn/Pb)

YES

e0

3000 MHz

TUA6110XS

Infineon Technologies

DOWN CONVERTER

SURFACE MOUNT

28

PLASTIC/EPOXY

BIPOLAR

32 mA

5

SSOP28,.3

RF/Microwave Mixers

80 Cel

-20 Cel

Tin/Lead (Sn/Pb)

e0

PMB2333

Infineon Technologies

UP/DOWN CONVERTER

SURFACE MOUNT

16

PLASTIC/EPOXY

BIPOLAR

COMPONENT

2.7/4.5

TSSOP16,.25

50 ohm

RF/Microwave Mixers

85 Cel

3000 MHz

-40 Cel

Tin/Lead (Sn/Pb)

YES

e0

3000 MHz

MAX2673EUA

Maxim Integrated

UP CONVERTER

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

2500 MHz

2.2

26.8 mA

400 MHz

COMPONENT

3/5

TSSOP8,.19

50 ohm

RF/Microwave Up/Down Converters

7.8 dB

85 Cel

40 MHz

-40 Cel

TIN LEAD

NO

10.4 dB

e0

500 MHz

MAX2663EUT-T

Maxim Integrated

UP CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

2500 MHz

2.1

4.1 mA

400 MHz

COMPONENT

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

-.1 dB

85 Cel

40 MHz

-40 Cel

TIN LEAD

NO

12.7 dB

e0

500 MHz

MAX2661EUT-T

Maxim Integrated

UP CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

2500 MHz

2.2

11.3 mA

400 MHz

COMPONENT

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

7 dB

85 Cel

40 MHz

-40 Cel

TIN LEAD

NO

11.8 dB

e0

500 MHz

MAX2406EEP

Maxim Integrated

DOWN CONVERTER

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

30 mA

3/5

SSOP20,.25

RF/Microwave Up/Down Converters

85 Cel

1900 MHz

-40 Cel

Tin/Lead (Sn85Pb15)

NO

9 dB

e0

-10 dBm

MAX2680EUT-T

Maxim Integrated

DOWN CONVERTER

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

1.5

7.7 mA

400 MHz

3/5

TSOP6,.11,37

50 ohm

RF/Microwave Up/Down Converters

85 Cel

5.7 dB

10 MHz

2500 MHz

-40 Cel

TIN LEAD

YES

e0

500 MHz

TA1322FN

Toshiba

DOWN CONVERTER

SURFACE MOUNT

30

PLASTIC/EPOXY

BIPOLAR

COMPONENT

850 MHz

5

SSOP30,.3

75 ohm

RF/Microwave Up/Down Converters

85 Cel

24.5 dB

350 MHz

2200 MHz

-20 Cel

YES

13 dB

550 MHz

TA4302F

Toshiba

DOWN CONVERTER

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

90 mA

5

SOP20,.25,40

RF/Microwave Up/Down Converters

85 Cel

-20 Cel

Tin/Lead (Sn/Pb)

e0

TA4303F

Toshiba

DOWN CONVERTER

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

87 mA

COMPONENT

900 MHz

5

SOP20,.25,40

RF/Microwave Up/Down Converters

85 Cel

14 dB

350 MHz

2150 MHz

-20 Cel

NO

22 dB

550 MHz

TA4107F(TE12L)

Toshiba

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

40.5 mA

4.5

TSSOP8,.16

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

TA1296FN

Toshiba

DOWN CONVERTER

SURFACE MOUNT

30

PLASTIC/EPOXY

BIPOLAR

COMPONENT

850 MHz

5

SSOP30,.3

75 ohm

RF/Microwave Up/Down Converters

85 Cel

25 dB

350 MHz

2200 MHz

-20 Cel

YES

13 dB

550 MHz

TA4301F

Toshiba

DOWN CONVERTER

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

45 mA

COMPONENT

900 MHz

5

SOP20,.25,40

RF/Microwave Up/Down Converters

85 Cel

14 dB

350 MHz

1600 MHz

-20 Cel

Tin/Lead (Sn/Pb)

YES

22 dB

e0

550 MHz

TA4107F

Toshiba

DOWN CONVERTER

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

40.5 mA

COMPONENT

4.5

TSSOP8,.16

50 ohm

RF/Microwave Up/Down Converters

85 Cel

-3.5 dB

-40 Cel

NO

16 dB

TA4103F

Toshiba

UP CONVERTER

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

33 mA

3

TSSOP8,.16

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

UPC8106T-E3

Renesas Electronics

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

13.5 mA

3/5

TSOP6,.11,37

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

UPB1008K

Renesas Electronics

SURFACE MOUNT

36

PLASTIC/EPOXY

BIPOLAR

23.5 mA

3

LCC36,.25SQ,20

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

UPC3202GR-E1

Renesas Electronics

DOWN CONVERTER

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

COMPONENT

5

SSOP20,.25

RF/Microwave Up/Down Converters

80 Cel

22 dB

-20 Cel

Tin/Lead (Sn/Pb)

YES

13 dB

e0

-30 dBm

UPC1687G-E1

Renesas Electronics

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

48 mA

5

SOP8,.25

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

UPC8104GR

Renesas Electronics

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

3/5

SSOP20,.25

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

UPC3220GR-E1

Renesas Electronics

DOWN CONVERTER

SURFACE MOUNT

16

PLASTIC/EPOXY

BIPOLAR

53.5 mA

COMPONENT

30 MHz

5

SSOP16,.25

50 ohm

RF/Microwave Up/Down Converters

85 Cel

18 dB

.1 MHz

250 MHz

-40 Cel

Tin/Lead (Sn/Pb)

NO

8.5 dB

e0

150 MHz

UPC1694GR-E1

Renesas Electronics

SURFACE MOUNT

14

PLASTIC/EPOXY

BIPOLAR

48 mA

5

SOP14,.25

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

UPC8103T

Renesas Electronics

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

1.4 mA

1

TSOP6,.11,37

RF/Microwave Up/Down Converters

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

e0

UPC8112T-E3

Renesas Electronics

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

11.7 mA

3

TSOP6,.11,37

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

UPB1003GS-E1

Renesas Electronics

SURFACE MOUNT

30

PLASTIC/EPOXY

BIPOLAR

52.7 mA

3

SSOP30,.3

RF/Microwave Up/Down Converters

85 Cel

-20 Cel

Tin/Lead (Sn/Pb)

e0

UPC8108T

Renesas Electronics

SURFACE MOUNT

6

PLASTIC/EPOXY

BIPOLAR

2.1 mA

1

TSOP6,.11,37

RF/Microwave Up/Down Converters

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

e0

UPC3228T5S-E1-A

Renesas Electronics

SURFACE MOUNT

32

PLASTIC/EPOXY

BIPOLAR

110 mA

5

LCC32,.2SQ,16

RF/Microwave Up/Down Converters

80 Cel

-20 Cel

UPB1007K-E1-A

Renesas Electronics

SURFACE MOUNT

36

PLASTIC/EPOXY

BIPOLAR

35 mA

3

LCC36,.25SQ,20

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

UPC1694GR-E2

Renesas Electronics

SURFACE MOUNT

14

PLASTIC/EPOXY

BIPOLAR

48 mA

5

SOP14,.25

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

UPB1004GS-E1

Renesas Electronics

SURFACE MOUNT

30

PLASTIC/EPOXY

BIPOLAR

50.7 mA

3

SSOP30,.3

RF/Microwave Up/Down Converters

85 Cel

-20 Cel

Tin/Lead (Sn/Pb)

e0

UPC8104GR-E1

Renesas Electronics

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

37 mA

3/5

SSOP20,.25

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

UPC1687G-E2

Renesas Electronics

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

48 mA

5

SOP8,.25

RF/Microwave Up/Down Converters

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

RF/Microwave Up/Down Converters

RF/microwave up/down converters are electronic devices that can convert high frequency (HF) signals to a lower frequency or vice versa. These converters are essential components of modern communication systems, where the frequency of the signal needs to be changed to enable transmission and reception. The up/down conversion process can be achieved through a variety of methods, including heterodyne mixing, direct mixing, and superheterodyne mixing.

Heterodyne mixing involves mixing the incoming signal with a local oscillator signal to generate an intermediate frequency (IF) signal. This method is widely used in superheterodyne receivers and is often used in upconversion. Direct mixing involves converting the frequency of the input signal to the desired frequency using a nonlinear device such as a diode. This method is often used in frequency synthesizers and mixers.

Superheterodyne mixing combines the advantages of heterodyne and direct mixing to achieve high sensitivity and selectivity. In a superheterodyne receiver, the incoming signal is mixed with a local oscillator signal to produce an IF signal, which is then amplified and demodulated. Superheterodyne mixing is also used in frequency upconversion, where the input signal is mixed with a local oscillator signal to produce the desired output frequency.

RF/microwave up/down converters are used in a variety of applications, including wireless communication systems, satellite communication systems, radar systems, and test and measurement equipment. They are available in various forms, including integrated circuits (ICs), modules, and subsystems, and can operate at a range of frequencies, from a few megahertz to several gigahertz.