Analog Devices RF/Microwave Up/Down Converters 187

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum RF Output Frequency	Maximum Voltage Standing Wave Ratio	Maximum Supply Current	Minimum RF Output Frequency	Construction	Minimum RF Input Frequency	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Minimum Up Conversion Gain	Maximum Operating Temperature	Minimum Down Conversion Gain	Minimum Intermediate Frequency (IF)	Maximum RF Input Frequency	Minimum Operating Temperature	Terminal Finish	LO Tunable	Maximum Noise Figure	JESD-609 Code	Minimum Input Power (CW)	Maximum Intermediate Frequency (IF)
MAX9996ETP+	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			240 mA		COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	7 dB	40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB	e3		350 MHz
MAX9986ETP+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	9 dB	50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB	e3		250 MHz
MAX9984ETP+TD	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	400 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Mixers		85 Cel		50 MHz	1000 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES		e3		250 MHz
MAX9986ETP+	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	9 dB	50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB	e3		250 MHz
MAX19997AETX+TD	Analog Devices		SURFACE MOUNT	36	PLASTIC/EPOXY	BICMOS			420 mA				3.3/5	LCC36,.25SQ,20		RF/Microwave Up/Down Converters		85 Cel				-40 Cel
MAX9994ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			235 mA		COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	7.2 dB	40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB	e3		350 MHz
MAX9984ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	400 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Mixers		85 Cel		50 MHz	1000 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES		e3		250 MHz
MAX9996ETP+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			240 mA		COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	7 dB	40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB	e3		350 MHz
MAX9993ETP+D	Analog Devices	DOWN CONVERTER						1.5			COMPONENT	1700 MHz			50 ohm			85 Cel		50 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES		e3	22 dBm	350 MHz
MAX9993ETP+TD	Analog Devices	DOWN CONVERTER						1.5			COMPONENT	1700 MHz			50 ohm			85 Cel		50 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES		e3	22 dBm	350 MHz
MAX9986ETP+TD	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	9 dB	50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB	e3		250 MHz
MAX9993ETP+T	Analog Devices	DOWN CONVERTER						1.5			COMPONENT	1700 MHz			50 ohm			85 Cel		50 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES		e3	22 dBm	350 MHz
MAX9993ETP+	Analog Devices	DOWN CONVERTER						1.5			COMPONENT	1700 MHz			50 ohm			85 Cel		50 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES		e3	22 dBm	350 MHz
MAX9986ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	9 dB	50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB	e3		250 MHz
MAX2261EUT-T	Analog Devices		SURFACE MOUNT	6	PLASTIC/EPOXY				11.3 mA				3/5	TSOP6,.11,37		RF/Microwave Up/Down Converters		85 Cel				-40 Cel	TIN LEAD			e0
MAX2263EUT-T	Analog Devices		SURFACE MOUNT	6	PLASTIC/EPOXY				4.1 mA				3/5	TSOP6,.11,37		RF/Microwave Up/Down Converters		85 Cel				-40 Cel	TIN LEAD			e0
MAX2661EUT+T	Analog Devices	UP CONVERTER					2500 MHz	2.2		400 MHz	COMPONENT				50 ohm		7 dB	85 Cel		40 MHz		-40 Cel	Matte Tin (Sn) - annealed	NO	11.8 dB	e3		500 MHz
MAX2223ETI+T	Analog Devices	UP/DOWN CONVERTER																					Matte Tin (Sn) - annealed			e3
MAX2681EUT+	Analog Devices	DOWN CONVERTER						1.5			COMPONENT	400 MHz			50 ohm			85 Cel	6.7 dB	10 MHz	2500 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES		e3		500 MHz
MAX2411AEEI+T	Analog Devices	UP/DOWN CONVERTER					1900 MHz	2							50 ohm		6.8 dB	85 Cel	8.5 dB		1900 MHz	-40 Cel	Matte Tin (Sn) - annealed	NO		e3		450 MHz
MAX2106CCM	Analog Devices	DOWN CONVERTER									COMPONENT	925 MHz			50 ohm			85 Cel			2175 MHz	0 Cel	TIN LEAD	NO		e0
MAX2662EUT-T	Analog Devices	UP CONVERTER					2500 MHz											85 Cel		10 MHz		-40 Cel	TIN LEAD	NO		e0		500 MHz
MAX2661EUT+	Analog Devices	UP CONVERTER																					Matte Tin (Sn) - annealed			e3
MAX2673	Analog Devices	UP CONVERTER					2500 MHz			40 MHz							12 dB			10 MHz			TIN LEAD	YES	8 dB	e0		500 MHz
MAX2673EUA+	Analog Devices	UP CONVERTER					2500 MHz	2.2		400 MHz	COMPONENT				50 ohm		7.8 dB	85 Cel		40 MHz		-40 Cel	Matte Tin (Sn) - annealed	NO	10.4 dB	e3		500 MHz
MAX2680AUT+	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	6	PLASTIC/EPOXY			1.5	7.7 mA		COMPONENT	400 MHz	3	TSSOP6,.08	50 ohm			85 Cel		10 MHz	2500 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	11.7 dB	e3		500 MHz
MAX2260EUT-T	Analog Devices		SURFACE MOUNT	6	PLASTIC/EPOXY				6.6 mA				3/5	TSOP6,.11,37		RF/Microwave Up/Down Converters		85 Cel				-40 Cel	TIN LEAD			e0
MAX2660	Analog Devices	UP CONVERTER					2500 MHz			40 MHz							8 dB			10 MHz			TIN LEAD	YES	8 dB	e0		500 MHz
MAX2673EUA+T	Analog Devices	UP CONVERTER					2500 MHz	2.2		400 MHz	COMPONENT				50 ohm		7.8 dB	85 Cel		40 MHz		-40 Cel	Matte Tin (Sn) - annealed	NO	10.4 dB	e3		500 MHz
MAX2680EUT+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	6	PLASTIC/EPOXY	BIPOLAR		1.5	7.7 mA		COMPONENT	400 MHz	3/5	TSOP6,.11,37	50 ohm	RF/Microwave Up/Down Converters		85 Cel	5.7 dB	10 MHz	2500 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES		e3		500 MHz
MAX2223ETI+	Analog Devices	UP/DOWN CONVERTER																					Matte Tin (Sn) - annealed			e3
MAX2661	Analog Devices	UP CONVERTER					2500 MHz			40 MHz							11 dB			10 MHz			TIN LEAD	YES	8 dB	e0		500 MHz
MAX2671EUT+	Analog Devices	UP CONVERTER																					Matte Tin (Sn) - annealed			e3
MAX2329EUP	Analog Devices	DOWN CONVERTER													50 ohm			85 Cel				-40 Cel	TIN LEAD	NO		e0
MAX2681	Analog Devices	DOWN CONVERTER										400 MHz							14.2 dB	10 MHz	2500 MHz		TIN LEAD	YES	7 dB	e0		500 MHz
MAX2680	Analog Devices	DOWN CONVERTER										400 MHz							11.6 dB	10 MHz	2500 MHz		TIN LEAD	YES	6.3 dB	e0		500 MHz
MAX2663	Analog Devices	UP CONVERTER					2500 MHz			40 MHz							4 dB			10 MHz			TIN LEAD	YES	8 dB	e0		500 MHz
MAX2660EUT+	Analog Devices	UP CONVERTER																					Matte Tin (Sn) - annealed			e3
MAX2680EUT+	Analog Devices	DOWN CONVERTER						1.5			COMPONENT	400 MHz			50 ohm			85 Cel	5.7 dB	10 MHz	2500 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES		e3		500 MHz
MAX2682	Analog Devices	DOWN CONVERTER										400 MHz							14.7 dB	10 MHz	2500 MHz		TIN LEAD	YES	6.5 dB	e0		500 MHz
MAX2671	Analog Devices	UP CONVERTER					2500 MHz			40 MHz							11 dB			10 MHz			TIN LEAD	YES	8 dB	e0		500 MHz
MAX2680AUT+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	6	PLASTIC/EPOXY			1.5	7.7 mA		COMPONENT	400 MHz	3	TSSOP6,.08	50 ohm			85 Cel		10 MHz	2500 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	11.7 dB	e3		500 MHz
MAX2411AEEI+	Analog Devices	UP/DOWN CONVERTER					1900 MHz	2							50 ohm		6.8 dB	85 Cel	8.5 dB		1900 MHz	-40 Cel	Matte Tin (Sn) - annealed	NO		e3		450 MHz

RF/Microwave Up/Down Converters

RF/microwave up/down converters are electronic devices that can convert high frequency (HF) signals to a lower frequency or vice versa. These converters are essential components of modern communication systems, where the frequency of the signal needs to be changed to enable transmission and reception. The up/down conversion process can be achieved through a variety of methods, including heterodyne mixing, direct mixing, and superheterodyne mixing.

Heterodyne mixing involves mixing the incoming signal with a local oscillator signal to generate an intermediate frequency (IF) signal. This method is widely used in superheterodyne receivers and is often used in upconversion. Direct mixing involves converting the frequency of the input signal to the desired frequency using a nonlinear device such as a diode. This method is often used in frequency synthesizers and mixers.

Superheterodyne mixing combines the advantages of heterodyne and direct mixing to achieve high sensitivity and selectivity. In a superheterodyne receiver, the incoming signal is mixed with a local oscillator signal to produce an IF signal, which is then amplified and demodulated. Superheterodyne mixing is also used in frequency upconversion, where the input signal is mixed with a local oscillator signal to produce the desired output frequency.

RF/microwave up/down converters are used in a variety of applications, including wireless communication systems, satellite communication systems, radar systems, and test and measurement equipment. They are available in various forms, including integrated circuits (ICs), modules, and subsystems, and can operate at a range of frequencies, from a few megahertz to several gigahertz.