Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Maximum RF Output Frequency | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Minimum RF Output Frequency | Construction | Minimum RF Input Frequency | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Minimum Up Conversion Gain | Maximum Operating Temperature | Minimum Down Conversion Gain | Maximum Output Power | Minimum Intermediate Frequency (IF) | Maximum RF Input Frequency | Minimum Operating Temperature | Terminal Finish | LO Tunable | Maximum Noise Figure | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Input Power (CW) | Minimum Operating Frequency | Maximum Intermediate Frequency (IF) | Maximum Operating Frequency |
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|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
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NXP Semiconductors |
UP/DOWN CONVERTER |
2500 MHz |
2400 MHz |
2400 MHz |
85 Cel |
50 MHz |
2500 MHz |
-40 Cel |
NO |
10.9 dB |
-10 dBm |
500 MHz |
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NXP Semiconductors |
DOWN CONVERTER |
COMPONENT |
50 ohm |
85 Cel |
-20 Cel |
YES |
16 dB |
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NXP Semiconductors |
UP/DOWN CONVERTER |
2500 MHz |
2400 MHz |
COMPONENT |
2400 MHz |
50 ohm |
85 Cel |
300 MHz |
2500 MHz |
-40 Cel |
YES |
400 MHz |
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|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
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|
NXP Semiconductors |
DOWN CONVERTER |
COMPONENT |
50 ohm |
85 Cel |
-20 Cel |
YES |
16 dB |
|||||||||||||||||||||||||||
NXP Semiconductors |
DOWN CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
BICMOS |
34.5 mA |
COMPONENT |
869 MHz |
3 |
LCC32,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
10.5 dB |
50 MHz |
894 MHz |
-40 Cel |
NO |
11 dB |
DOWN CONVERSION GAIN FOR FM IS 6.5 |
300 MHz |
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NXP Semiconductors |
DOWN CONVERTER |
70 Cel |
-20 Cel |
NO |
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NXP Semiconductors |
UP/DOWN CONVERTER |
2500 MHz |
2400 MHz |
COMPONENT |
2400 MHz |
50 ohm |
85 Cel |
300 MHz |
2500 MHz |
-40 Cel |
YES |
400 MHz |
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NXP Semiconductors |
DOWN CONVERTER |
COMPONENT |
869 MHz |
85 Cel |
6.5 dB |
50 MHz |
894 MHz |
-40 Cel |
NO |
11 dB |
300 MHz |
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NXP Semiconductors |
UP CONVERTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
2500 MHz |
35 mA |
1700 MHz |
COMPONENT |
3 |
TSSOP16,.25 |
RF/Microwave Up/Down Converters |
12 dB |
85 Cel |
70 MHz |
-30 Cel |
Tin/Lead (Sn/Pb) |
YES |
e0 |
350 MHz |
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|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
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NXP Semiconductors |
UP/DOWN CONVERTER |
2500 MHz |
2400 MHz |
2400 MHz |
85 Cel |
50 MHz |
2500 MHz |
-40 Cel |
NO |
10.9 dB |
-10 dBm |
500 MHz |
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NXP Semiconductors |
DOWN CONVERTER |
SURFACE MOUNT |
48 |
PLASTIC/EPOXY |
BIPOLAR |
2 |
60 mA |
COMPONENT |
5 |
QFP48,.35SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
100 Cel |
65 dB |
4.5 MHz |
1575 MHz |
-40 Cel |
Tin/Lead (Sn/Pb) |
NO |
e0 |
14.5 MHz |
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|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
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|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
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|
NXP Semiconductors |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
93 mA |
COMPONENT |
5 |
SSOP24,.3 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
-20 Cel |
YES |
16 dB |
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NXP Semiconductors |
UP/DOWN CONVERTER |
COMPONENT |
50 MHz |
75 Cel |
36 MHz |
861 MHz |
-10 Cel |
YES |
46 MHz |
||||||||||||||||||||||||||
|
NXP Semiconductors |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
125 mA |
3.3 |
LCC24,.16SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
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NXP Semiconductors |
UP/DOWN CONVERTER |
COMPONENT |
50 MHz |
75 Cel |
36 MHz |
861 MHz |
-10 Cel |
YES |
9 dB |
46 MHz |
|||||||||||||||||||||||||
NXP Semiconductors |
UP/DOWN CONVERTER |
2500 MHz |
2400 MHz |
COMPONENT |
2400 MHz |
50 ohm |
85 Cel |
300 MHz |
2500 MHz |
-40 Cel |
YES |
400 MHz |
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NXP Semiconductors |
DOWN CONVERTER |
COMPONENT |
50 ohm |
85 Cel |
-20 Cel |
YES |
16 dB |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
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NXP Semiconductors |
DOWN CONVERTER |
70 Cel |
-20 Cel |
NO |
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NXP Semiconductors |
DOWN CONVERTER |
COMPONENT |
869 MHz |
85 Cel |
6.5 dB |
50 MHz |
894 MHz |
-40 Cel |
NO |
11 dB |
300 MHz |
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NXP Semiconductors |
DOWN CONVERTER |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
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|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
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NXP Semiconductors |
UP/DOWN CONVERTER |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DOWN CONVERTER |
SURFACE MOUNT |
38 |
PLASTIC/EPOXY |
COMPONENT |
950 MHz |
5 |
TSSOP38,.25,20 |
RF/Microwave Up/Down Converters |
85 Cel |
2175 MHz |
-20 Cel |
NO |
18 dB |
||||||||||||||||||||
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
RF/microwave up/down converters are electronic devices that can convert high frequency (HF) signals to a lower frequency or vice versa. These converters are essential components of modern communication systems, where the frequency of the signal needs to be changed to enable transmission and reception. The up/down conversion process can be achieved through a variety of methods, including heterodyne mixing, direct mixing, and superheterodyne mixing.
Heterodyne mixing involves mixing the incoming signal with a local oscillator signal to generate an intermediate frequency (IF) signal. This method is widely used in superheterodyne receivers and is often used in upconversion. Direct mixing involves converting the frequency of the input signal to the desired frequency using a nonlinear device such as a diode. This method is often used in frequency synthesizers and mixers.
Superheterodyne mixing combines the advantages of heterodyne and direct mixing to achieve high sensitivity and selectivity. In a superheterodyne receiver, the incoming signal is mixed with a local oscillator signal to produce an IF signal, which is then amplified and demodulated. Superheterodyne mixing is also used in frequency upconversion, where the input signal is mixed with a local oscillator signal to produce the desired output frequency.
RF/microwave up/down converters are used in a variety of applications, including wireless communication systems, satellite communication systems, radar systems, and test and measurement equipment. They are available in various forms, including integrated circuits (ICs), modules, and subsystems, and can operate at a range of frequencies, from a few megahertz to several gigahertz.