RECTANGULAR Image Sensors 1,058

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Part	Manufacturer	Sensors or Transducers Type	Mounting Feature	Output Type	Package Shape or Style	Output Range	Pixel Size (um)	Maximum Supply Voltage	Master Clock	Body Length/Diameter	Body Width	Spectral Response (nm)	Power Supplies (V)	Optical Format (inch)	Sub-Category	Body Height	Minimum Supply Voltage	Maximum Operating Temperature	Horizontal Pixel	Minimum Operating Temperature	Terminal Finish	Termination Type	Data Rate	Frame Rate	Maximum Operating Current	Array Type	Additional Features	Housing	JESD-609 Code	Dynamic Range	Vertical Pixel
FTT1010-M/TG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			40 mm	40 inch			1	CCD Image Sensors	4.1 mm		60 Cel	1030	-40 Cel		SOLDER				FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		70 dB	1072
FTF3020-M/EG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			52.7 mm	40 inch					4.1 mm		60 Cel		-40 Cel		SOLDER				FULL FRAME	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		72 dB
FTT1010-M/HG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			40 mm	40 inch			1	CCD Image Sensors	4.1 mm		60 Cel	1030	-40 Cel		SOLDER				FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		70 dB	1072
FTT1010-M/EG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			40 mm	40 inch			1	CCD Image Sensors	4.1 mm		60 Cel	1030	-40 Cel		SOLDER				FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		70 dB	1072
FT18/TG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		7.5X7.5			29.4 mm	15.49 inch			2/3		2.98 mm		60 Cel		-40 Cel	TIN/NICKEL PALLADIUM	SOLDER				FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED	e3/e4	60 dB
FT18/SG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		7.5X7.5			29.4 mm	15.49 inch			2/3		2.98 mm		60 Cel		-40 Cel	TIN/NICKEL PALLADIUM	SOLDER				FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED	e3/e4	60 dB
FTF3020-M/TG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			52.7 mm	40 inch					4.1 mm		60 Cel		-40 Cel		SOLDER				FULL FRAME	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		72 dB
FTF3020-C/IG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			52.7 mm	40 inch				CCD Image Sensors	4.1 mm		60 Cel	3120	-40 Cel		SOLDER				FULL FRAME	ELECTRONIC SHUTTER	CERAMIC, METAL-SEALED COFIRED		72 dB	2060
OV09650-KL1A	Infineon Technologies	IMAGE SENSOR,CMOS	SURFACE MOUNT	ANALOG VOLTAGE	RECTANGULAR	0.30-2.70V	3.18X3.18	1.98 V		5.095 mm	5.715 inch					.82 mm	1.62 V	70 Cel		-20 Cel		SOLDER	12 Mbps	15 fps	20 mA	FULL FRAME	IT ALSO HAS SUPPLY VOLTAGE 2.45 TO 2.8 VOLT AND 2.25 TO 3.6 VOLT			62 dB
TCD2704D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	5-7V	5X5	13 V		53.6 mm	10.16 inch		12		CCD Image Sensors	3.9 mm	11.4 V	60 Cel	7500	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				LINEAR	SENSITIVITY FOR RED 4.60 V/LX.S, RED 5.40 V/LX.S, GREEN 2.80 V/LX.S	CERAMIC, METAL-SEALED COFIRED	e0		4
TCD2557D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	3.50-7.50V	7X7	13 V		53.6 mm	10.16 inch		12		CCD Image Sensors	3.2 mm	11.4 V	60 Cel	5340	0 Cel		SOLDER				LINEAR	SENSITIVITY FOR RED 9.30 V/LX.S, GREEN 9.90 V/LX.S, BLUE 5.40 V/LX.S	CERAMIC, METAL-SEALED COFIRED			3
TCD2712DG	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	VOLTAGE OUTPUT	RECTANGULAR	4-6V	9.32X9.32	10.5 V		98 mm	10.16 inch					7 mm	9.5 V	60 Cel		0 Cel		SOLDER				LINEAR		CERAMIC
TCD2713DG	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	DIGITAL VOLTAGE	RECTANGULAR	4-6V	9.32X9.32	10.5 V		105 mm	10.16 inch	400-1200	10		CCD Image Sensors	7 mm	9.5 V	60 Cel	7500	0 Cel		SOLDER				LINEAR		CERAMIC			4
TCD2503C	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	4.50-7.50V	14X14	13 V		90 mm	15 inch				CCD Image Sensors	5.13 mm	10.5 V	60 Cel	5000	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				LINEAR	SENSITIVITY FOR RED 17.30 V/LX.S, GREEN 21.70 V/LX.S, BLUE 7.20 V/LX.S	CERAMIC, METAL-SEALED COFIRED	e0		3
BU302MCG	Toshiba	IMAGE SENSOR,CMOS			RECTANGULAR		3.45X3.45	5.25 V		32.3 mm	29 inch					29 mm	4.75 V	40 Cel	2064	0 Cel				120 fps		FRAME	GLOBAL SHUTTER	METAL			1544
TCD2901D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	4-6V	4X4	13 V		53.6 mm	10.16 inch		12		CCD Image Sensors	3.2 mm	11.4 V	60 Cel	10550	0 Cel		SOLDER				FRAME TRANSFER	SENSITIVITY FOR RED 2.50 V/LX.S, GREEN 2.40 V/LX.S, BLUE 1.40 V/LX.S	CERAMIC, METAL-SEALED COFIRED			3
TCD2717BFG	Toshiba	IMAGE SENSOR,CCD	SURFACE MOUNT	VOLTAGE OUTPUT	RECTANGULAR	4-6V	4.7X4.7	10.5 V		55.2 mm	7.8 inch	400-700				2.8 mm	9.5 V	60 Cel		0 Cel		SOLDER				LINEAR		CERAMIC
TCD2561D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	5-7V	7X7	13 V		53.6 mm	10.16 inch		12		CCD Image Sensors	3.89 mm	11.4 V	60 Cel	5340	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				LINEAR	SENSITIVITY FOR RED 9 V/LX.S, GREEN 10.50 V/LX.S, RED 5.50 V/LX.S	CERAMIC, METAL-SEALED COFIRED	e0		4
BU505MCG	Toshiba	IMAGE SENSOR,CMOS			RECTANGULAR		3.45X3.45	5.25 V		32.3 mm	29 inch					29 mm	4.75 V	40 Cel	2464	0 Cel				75 fps		FRAME	GLOBAL SHUTTER	METAL			2056
BU302MCF	Toshiba	IMAGE SENSOR,CMOS			RECTANGULAR		3.45X3.45	5.25 V		32.3 mm	29 inch					29 mm	4.75 V	40 Cel	2064	0 Cel				120 fps		FRAME	GLOBAL SHUTTER	METAL			1544
TCD2558D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	5-7V	7X7	13 V		53.6 mm	10.16 inch		12		CCD Image Sensors	4.17 mm	11.4 V	60 Cel	5340	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				LINEAR	SENSITIVITY FOR RED 9.30 V/LX.S, GREEN 9.90 V/LX.S, BLUE 5.40 V/LX.S	CERAMIC, GLASS-SEALED	e0		3
TCD2711DG	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	VOLTAGE OUTPUT	RECTANGULAR	3.50-6.50V	9.325X9.325	10.5 V		105 mm	10.16 inch	400-700				7 mm	9.5 V	60 Cel		0 Cel		SOLDER				LINEAR	SENSITIITY FOR RED 18.9 V/LX.S, BLUE 13.4 V/LX.S	CERAMIC
TCD2950D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	5-7V	4X4	13 V		53.6 mm	10.16 inch		12		CCD Image Sensors	4.17 mm	11.4 V	60 Cel	10680	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				FRAME TRANSFER	SENSITIVITY FOR RED 1.40 V/LX.S, GREEN 1.90 V/LX.S, 1.30 V/LX.S	CERAMIC, METAL-SEALED COFIRED	e0		3
TCD2716DG	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT		RECTANGULAR		4.7X4.7												7450			SOLDER				LINEAR		CERAMIC			3
BU302MG	Toshiba	IMAGE SENSOR,CMOS			RECTANGULAR		3.45X3.45	5.25 V		32.3 mm	29 inch					29 mm	4.75 V	40 Cel	2064	0 Cel				120 fps		FRAME	GLOBAL SHUTTER	METAL			1544
TCD2723BFG	Toshiba	IMAGE SENSOR,CCD	SURFACE MOUNT	VOLTAGE OUTPUT	RECTANGULAR	3.8-6.8V	4.7X4.7	10.5 V		55.2 mm	7.8 inch	400-700				2.8 mm	9.5 V	60 Cel		0 Cel		SOLDER				LINEAR	SENSITIITY FOR RED 26.6 V/LX.S, BLUE 16.3 V/LX.S	CERAMIC
CIPS217MS5A	Toshiba	IMAGE SENSOR,NMOS		DIGITAL VOLTAGE	RECTANGULAR	0.10-4.90V		12.5 V									11.5 V	50 Cel		0 Cel						LINEAR
TCD2701C	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	4.50-7.50V	9.32X9.32	13 V		90 mm	15 inch				CCD Image Sensors	5.13 mm	11.4 V	60 Cel	7500	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				LINEAR	SENSITIVITY FOR RED 7.20 V/LX.S, GREEN 9.10 V/LX.S, BLUE 4 V/LX.S	CERAMIC, METAL-SEALED COFIRED	e0		3
CIPS257MD5A	Toshiba	IMAGE SENSOR,NMOS		DIGITAL VOLTAGE	RECTANGULAR	0.10-4.90V		12.5 V									11.5 V	50 Cel		0 Cel						LINEAR
TCD2919BFG	Toshiba	IMAGE SENSOR,CCD	SURFACE MOUNT	VOLTAGE OUTPUT	RECTANGULAR	4-6V	2.625X8.4	10.5 V		41 mm	6.1 inch	400-700				2.8 mm	9.5 V	60 Cel		0 Cel		SOLDER				LINEAR	SENSITIITY FOR RED 12.2 V/LX.S, BLUE 7.9 V/LX.S	CERAMIC
TCD2564DG	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	VOLTAGE OUTPUT	RECTANGULAR	3.5-6.5V	7X7	10.5 V		53.6 mm	10.16 inch	400-700				4.2 mm	9.5 V	60 Cel	5400	0 Cel		SOLDER				LINEAR	SENSITIVITY FOR GREEN 12.5 V/LX.S, BLUE 5 V/LX.S	CERAMIC			3
CIPS305MS5A	Toshiba	IMAGE SENSOR,NMOS		DIGITAL VOLTAGE	RECTANGULAR	0.10-4.90V		12.5 V									11.5 V	50 Cel		0 Cel						LINEAR
TCD2715DG	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	VOLTAGE OUTPUT	RECTANGULAR	3.50-6.50V	4.7X4.7	10.5 V		53.6 mm	10.16 inch	400-700				4.2 mm	9.5 V	60 Cel		0 Cel		SOLDER				LINEAR	SENSITIITY FOR RED 5.8 V/LX.S, BLUE 1.9 V/LX.S	CERAMIC
TCD2255D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	DIGITAL VOLTAGE	RECTANGULAR	5V	8X8	13 V		41.6 mm	10.16 inch		12		CCD Image Sensors	3.22 mm	11.4 V	60 Cel	2700	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				LINEAR	SENSITIVITY FOR RED 13 V/LX.S, GREEN 16.30 V/LX.S, BLUE 5.70 V/LX.S	CERAMIC, GLASS-SEALED	e0		3
TCD2716ADG	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT		RECTANGULAR		4.7X4.7												7450			SOLDER				LINEAR		CERAMIC			3
TCD2700C	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	4.50-7.50V	8X8	13 V		90 mm	15 inch		15		CCD Image Sensors	5.13 mm	11.4 V	60 Cel	7500	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				LINEAR	SENSITIVITY FOR RED 5.30 V/LX.S, GREEN 7.70 V/LX.S, BLUE 2 V/LX.S	CERAMIC, METAL-SEALED COFIRED	e0		3
TCD2560D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	4-6V	5.25X5.25	13 V		41.6 mm	10.16 inch		12		CCD Image Sensors	3.22 mm	11.4 V	60 Cel	5400	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				FRAME TRANSFER	SENSITIVITY FOR RED 4.80 V/LX.S, GREEN 6.70 V/LX.S, BLUE 2.90 V/LX.S	CERAMIC, GLASS-SEALED	e0		3
TCD2725BFG	Toshiba	IMAGE SENSOR,CCD	SURFACE MOUNT	VOLTAGE OUTPUT	RECTANGULAR	3.70-6.70V	4.7X4.7	10.5 V		55.2 mm	7.8 inch	400-700				2.8 mm	9.5 V	60 Cel		0 Cel		SOLDER				LINEAR	SENSITIITY FOR RED 14.3 V/LX.S, BLUE 5.8 V/LX.S	CERAMIC
TCD2565BFG	Toshiba	IMAGE SENSOR,CCD	SURFACE MOUNT	VOLTAGE OUTPUT	RECTANGULAR	4-6V	5.25X5.25	10.5 V		41 mm	6.1 inch					2.8 mm	9.5 V	60 Cel		0 Cel		SOLDER				LINEAR		CERAMIC
BU505MG	Toshiba	IMAGE SENSOR,CMOS			RECTANGULAR		3.45X3.45	5.25 V		32.3 mm	29 inch					29 mm	4.75 V	40 Cel	2464	0 Cel				75 fps		FRAME	GLOBAL SHUTTER	METAL			2056
BU505MCF	Toshiba	IMAGE SENSOR,CMOS			RECTANGULAR		3.45X3.45	5.25 V		32.3 mm	29 inch					29 mm	4.75 V	40 Cel	2464	0 Cel				75 fps		FRAME	GLOBAL SHUTTER	METAL			2056
TCD8100C	Toshiba	IMAGE SENSOR,NMOS	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	0.80-1V		13 V									11 V	60 Cel		0 Cel		SOLDER				LINEAR
TCM5043LU	Toshiba	IMAGE SENSOR,CMOS	SURFACE MOUNT	DIGITAL VOLTAGE	RECTANGULAR	0.40-2.20V		2.9 V	24.54 MHz					1/4			2.7 V	60 Cel		-20 Cel		SOLDER		30 fps	21 mA	FRAME TRANSFER	ELECTRONIC SHUTTER
TCM5043G	Toshiba	IMAGE SENSOR,CMOS		DIGITAL VOLTAGE	RECTANGULAR	0.40-2.20V	5.4X5.4	3 V	24.54 MHz					1/4			2.6 V	60 Cel		-20 Cel				30 fps	21 mA	FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED
TCD1501C	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	4-6.50V	7X7	13 V		53.6 mm	10.4 inch					4.19 mm	11.4 V				Tin/Lead (Sn/Pb)	SOLDER				LINEAR		CERAMIC, METAL-SEALED COFIRED	e0	70 dB
TCD1300D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	3.50-6V	8X8	13 V		41.6 mm	10.16 inch					3.92 mm	11.4 V					SOLDER				LINEAR		CERAMIC, GLASS-SEALED
TCD1708D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	DIGITAL VOLTAGE	RECTANGULAR	1.70-3.50V	4.7X4.7	5.25 V		52.6 mm	9.65 inch		5		CCD Image Sensors	4.19 mm	4.75 V	60 Cel	7450	0 Cel		SOLDER				LINEAR		CERAMIC, METAL-SEALED COFIRED		68 dB	1
TCD1704C	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	3.50-6.50V	7X7	13 V		90 mm	15.5 inch		15		CCD Image Sensors	5.8 mm	11.4 V	60 Cel	7500	0 Cel	Tin/Lead (Sn/Pb)	SOLDER				LINEAR		CERAMIC, METAL-SEALED COFIRED	e0	68 dB	1

Image Sensors

Image sensors are electronic devices that capture images and convert them into digital signals that can be processed and stored in electronic devices such as cameras, smartphones, and security systems. They are a critical component of digital imaging technology and have revolutionized the way we capture and store visual information.

Image sensors work by detecting and converting light into electrical signals. They typically consist of a grid of millions of tiny photodiodes, each of which generates an electrical charge in response to the amount of light it receives. When light enters the sensor, it is absorbed by the photodiodes, which generate a corresponding electrical signal. The signals from each photodiode are then combined to form a digital image.

There are two main types of image sensors: charge-coupled devices (CCDs) and complementary metal-oxide-semiconductor (CMOS) sensors. CCDs are the older of the two technologies and are characterized by their high image quality, low noise, and low power consumption. CMOS sensors, on the other hand, are more modern and are known for their high-speed performance, low power consumption, and lower cost.

Image sensors are widely used in a variety of applications, including digital cameras, smartphones, security systems, and medical imaging. They have also enabled the development of new technologies such as virtual and augmented reality, self-driving cars, and facial recognition.