Part | RoHS | Manufacturer | Sensors or Transducers Type | Mounting Feature | Output Type | Package Shape or Style | Output Range | Pixel Size (um) | Maximum Supply Voltage | Screening Level | Master Clock | Body Length/Diameter | Body Width | Spectral Response (nm) | Power Supplies (V) | Optical Format (inch) | Sub-Category | Body Height | Minimum Supply Voltage | Maximum Operating Temperature | Horizontal Pixel | Minimum Operating Temperature | Terminal Finish | Termination Type | Data Rate | Output Interface Type | Frame Rate | Maximum Operating Current | Array Type | Additional Features | Housing | JESD-609 Code | Dynamic Range | Vertical Pixel |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Sony |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
ANALOG VOLTAGE |
RECTANGULAR |
6.5X6.25 |
15.45 V |
12.2 mm |
11.43 inch |
400-1000 |
15 |
1/3 |
CCD Image Sensors |
4.62 mm |
14.55 V |
60 Cel |
752 |
-10 Cel |
SOLDER |
6 mA |
INTERLINE |
ELECTRONIC SHUTTER |
PLASTIC |
5 dB |
582 |
|||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
ANALOG VOLTAGE |
RECTANGULAR |
7.4X7.4 |
15.5 V |
44.45 mm |
45.34 inch |
4.88 mm |
14.5 V |
4872 |
SOLDER |
30 Mbps |
INTERLINE |
SENSITIVITY IS 30 UV/ELECTRON |
65 dB |
3248 |
||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
6X6 |
1/3 |
Tin/Silver/Copper (Sn/Ag/Cu) |
SOLDER |
60 fps |
FRAME |
AEC-Q100; GLOBAL SHUTTER |
e1 |
|||||||||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
4.80X4.80 |
1.9 V |
360 MHz |
14.22 mm |
14.22 inch |
400-1000 |
3.3 |
1/2 |
CCD Image Sensors |
2.28 mm |
1.7 V |
85 Cel |
1280 |
-40 Cel |
SOLDER |
4-WIRE INTERFACE |
210 fps |
FRAME |
GLOBAL SHUTTER, ROLLING SHUTTER |
60 dB |
1024 |
||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
RECTANGULAR |
4.80X4.80 |
1.9 V |
68 MHz |
6.13 mm |
4.93 inch |
1/3.6 |
.75 mm |
1.7 V |
85 Cel |
808 |
-40 Cel |
TIN SILVER COPPER |
SOLDER |
68 Mbps |
4-WIRE INTERFACE |
120 fps |
59 mA |
FULL FRAME |
GLOBAL SHUTTER; IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE; IT ALSO HAVE MASTER CLOCK 340 MHZ (10-BIT) AND 272 MHZ (8-BIT) WHEN PLL IS NOT USED |
e1 |
59 dB |
608 |
||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
SQUARE |
4.80X4.80 |
2 V |
62 MHz |
14.22 mm |
14.22 inch |
3.3 |
1/2 |
Other Sensors/Transducers |
2.2 mm |
1.6 V |
85 Cel |
1280 |
-40 Cel |
SOLDER |
4-WIRE INTERFACE |
150 fps |
75 mA |
FRAME |
IT ALSO HAVE SUPPLY VOLTAGE 3.0 TO 3.6 V, ALSO CURRENT CONSUMPTION 130 MA, GLOBAL SHUTTER, ROLLING SHUTTER |
53 dB |
1024 |
|||||||||
Omnivision Technologies |
||||||||||||||||||||||||||||||||||
|
Hamamatsu Photonics Kk |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
14X14 |
5.25 V |
41.6 mm |
10.02 inch |
5 |
CCD Image Sensors |
3 mm |
4.75 V |
85 Cel |
2048 |
-40 Cel |
SOLDER |
10 Mbps |
50 mA |
LINEAR |
IT ALSO HAVE A DYNAMIC RANGE OF 66 DB |
72.04 dB |
1 |
|||||||||||
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
0.40-1.50V |
3.75 |
1.95 V |
50 MHz |
9 mm |
9 inch |
1/3 |
1.4 mm |
1.7 V |
105 Cel |
1280 |
-40 Cel |
SOLDER |
2-WIRE INTERFACE |
60 fps |
130 mA |
LINEAR |
IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5-3.1 V; ELECTRONIC ROLLING SHUTTER |
115 dB |
960 |
||||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
0.40-1.50V |
3.75 |
1.95 V |
50 MHz |
9 mm |
9 inch |
1/3 |
1.39 mm |
1.7 V |
70 Cel |
1280 |
-30 Cel |
TIN SILVER COPPER |
SOLDER |
2-WIRE INTERFACE |
54 fps |
90 mA |
FRAME |
GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.5 V TO 3.1 V |
e1 |
71.1 dB |
960 |
|||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
0.4-1.26V |
3X3 |
1.26 V |
54 MHz |
9.995 mm |
5.595 inch |
1/2.6 |
.666 mm |
1.14 V |
85 Cel |
1920 |
-40 Cel |
TIN SILVER COPPER |
SOLDER |
2-WIRE INTERFACE |
120 fps |
250 mA |
FRAME |
GLOBAL SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE; COLOR SENSITIVITY IS 22.3 KE/LUX.S |
e1 |
71.4 dB |
1200 |
|||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
0.4-1.26V |
3X3 |
1.26 V |
54 MHz |
9.995 mm |
5.595 inch |
1/2.6 |
.666 mm |
1.14 V |
85 Cel |
1920 |
-40 Cel |
TIN SILVER COPPER |
SOLDER |
2-WIRE INTERFACE |
120 fps |
250 mA |
FRAME |
GLOBAL SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE; COLOR SENSITIVITY IS 22.3 KE/LUX.S |
e1 |
71.4 dB |
1200 |
|||||||
|
Ams Ag |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
1 |
70 Cel |
-30 Cel |
Matte Tin (Sn) |
SOLDER |
SPI INTERFACE |
37 fps |
FRAME |
GLOBAL SHUTTER, EXTENDED DYNAMIC RANGE UPTO 90 DB |
CERAMIC |
e3 |
60 dB |
|||||||||||||||||||
|
Teledyne E2v (Uk) |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
0.55-1.25V |
5.3X5.3 |
2 V |
12.7 mm |
12.7 inch |
3.3 |
1/1.8 |
CCD Image Sensors |
2.305 mm |
1.6 V |
65 Cel |
1280 |
-30 Cel |
Gold (Au) - with Nickel (Ni) barrier |
SOLDER |
60 fps |
55 mA |
FRAME |
ITS ALSO OPERATES IN 3.15-3.45V |
CERAMIC |
e4 |
1024 |
|||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
9X9 |
15.5 V |
14.75 V |
768 |
SOLDER |
10 Mbps |
FULL FRAME |
IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON |
CERAMIC |
76 dB |
512 |
|||||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
6.8X6.8 |
15.25 V |
34.54 mm |
20.19 inch |
200-1100 |
14.5 V |
60 Cel |
2184 |
-60 Cel |
SOLDER |
15 Mbps |
FULL FRAME |
IT HAS A SENSITIVITY OF 12 MICRO VOLT PER ELECTRON |
CERAMIC |
78 dB |
1472 |
||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
2/3 |
14.5 V |
70 Cel |
1920 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON |
64 dB |
1080 |
||||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
33.02 mm |
20.07 inch |
1 |
14.5 V |
70 Cel |
2336 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON |
64 dB |
1752 |
||||||||||||||||
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
VOLTAGE OUTPUT |
RECTANGULAR |
14X14 |
12.5 V |
48.01 mm |
15.24 inch |
5.51 mm |
11.5 V |
SOLDER |
20 Mbps |
LINEAR |
SENSITIVITY IS 11.5 MICRO VOLT PER ELECTRON |
CERAMIC |
76 dB |
||||||||||||||||||
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
ANALOG VOLTAGE |
RECTANGULAR |
5.2-5.5V |
9X9 |
15.5 V |
93.98 mm |
15.24 inch |
350-850 |
6.1 mm |
14.5 V |
70 Cel |
8002 |
0 Cel |
SOLDER |
6 Mbps |
LINEAR |
IT HAS OUTPUT SENSITIVITY OF 14 MICRO VOLT PER ELECTRON; IT ALSO HAVE DYNAMIC RANGE 82 DB |
CERAMIC |
87 dB |
8002 |
||||||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL OUTPUT |
SQUARE |
0.40-1.40V |
1.67X1.67 |
1.9 V |
48 MHz |
12 mm |
12 inch |
1/2.3 |
1.35 mm |
1.7 V |
70 Cel |
3856 |
-30 Cel |
NICKEL PALLADIUM GOLD |
SOLDER |
480 Mbps |
2-WIRE INTERFACE |
60 fps |
190 mA |
FRAME |
IT ALSO HAVE ANALOG SUPPLY VOLTAGE 2.4-3.1 V, ELECTRONIC ROLLING SHUTTER |
PLASTIC |
e4 |
65.2 dB |
2764 |
|||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
5.2X5.2 |
3.6 V |
48 MHz |
14.22 mm |
14.22 inch |
1/2 |
2.25 mm |
3 V |
70 Cel |
1280 |
0 Cel |
SOLDER |
2-WIRE INTERFACE |
30 fps |
24 mA |
FRAME |
ELECTRONIC ROLLING SHUTTER |
CERAMIC |
68.2 dB |
1024 |
|||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
5.2X5.2 |
3.6 V |
48 MHz |
14.22 mm |
14.22 inch |
1/2 |
2.25 mm |
3 V |
70 Cel |
1280 |
0 Cel |
SOLDER |
2-WIRE INTERFACE |
30 fps |
24 mA |
FRAME |
ELECTRONIC ROLLING SHUTTER |
CERAMIC |
68.2 dB |
1024 |
|||||||||
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
0.30-3.30V |
3.20X3.20 |
3.6 V |
48 MHz |
14.22 mm |
14.22 inch |
3.3 |
1/2 |
CCD Image Sensors |
2.25 mm |
3 V |
60 Cel |
2048 |
0 Cel |
SOLDER |
2-WIRE INTERFACE |
12 fps |
27.8 mA |
FRAME |
ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 3-3.60 V |
CERAMIC |
61 dB |
1536 |
|||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL CURRENT |
SQUARE |
-9-9mA |
6X6 |
3.6 V |
26.6 MHz |
11.43 mm |
11.43 inch |
1/3 |
2.3 mm |
3 V |
70 Cel |
752 |
-30 Cel |
SOLDER |
2-WIRE INTERFACE |
60 fps |
60 mA |
FRAME |
GLOBAL SHUTTER, IT ALSO HAVE DYNAMIC RANGE 80 DB-100 DB IN HDR MODE |
CERAMIC |
54.4 dB |
480 |
||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
4.80X4.80 |
1.9 V |
72 MHz |
14.22 mm |
14.22 inch |
400-1000 |
1/2 |
2.28 mm |
1.7 V |
85 Cel |
1280 |
-40 Cel |
SOLDER |
4-WIRE INTERFACE |
210 fps |
80 mA |
FRAME |
IT ALSO OPERATES AT 3.2 TO 3.4 V SUPPLY VOLTAGE, GLOBAL SHUTTER |
60 dB |
1024 |
|||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
4.80X4.80 |
1.9 V |
72 MHz |
14.22 mm |
14.22 inch |
400-1000 |
1/4 |
2.28 mm |
1.7 V |
85 Cel |
640 |
-40 Cel |
SOLDER |
4-WIRE INTERFACE |
815 fps |
80 mA |
FRAME |
IT ALSO OPERATES AT 3.2 TO 3.4 V SUPPLY VOLTAGE, GLOBAL SHUTTER |
60 dB |
480 |
|||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
4.80X4.80 |
1.9 V |
72 MHz |
14.22 mm |
14.22 inch |
400-1000 |
1/4 |
2.28 mm |
1.7 V |
85 Cel |
640 |
-40 Cel |
SOLDER |
4-WIRE INTERFACE |
815 fps |
80 mA |
FRAME |
IT ALSO OPERATES AT 3.2 TO 3.4 V SUPPLY VOLTAGE, GLOBAL SHUTTER |
60 dB |
480 |
|||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
0.4-1.5V |
3.2X3.2 |
1.3 V |
32.4 MHz |
20.88 mm |
19.9 inch |
300-1000 |
1/1.1 |
2.54 mm |
1.1 V |
85 Cel |
4096 |
-40 Cel |
SOLDER |
I2C/SPI INTERFACE |
80 fps |
240 mA |
FRAME |
GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.7 V TO 2.9V |
CERAMIC, METAL-SEALED COFIRED |
68 dB |
2160 |
|||||||
|
Omnivision Technologies |
IMAGE SENSOR,CMOS |
1.75X1.75 |
1.58 |
CCD Image Sensors |
85 Cel |
1616 |
-30 Cel |
1216 |
|||||||||||||||||||||||||
Texas Instruments |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
ANALOG VOLTAGE |
SQUARE |
10X10 |
13 V |
10 mm |
10 inch |
13 |
CCD Image Sensors |
3.35 mm |
11 V |
55 Cel |
324 |
-10 Cel |
SOLDER |
10 mA |
FRAME TRANSFER |
ELECTRONIC SHUTTER |
PLASTIC |
66 dB |
243 |
||||||||||||
Toshiba |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
ANALOG VOLTAGE |
RECTANGULAR |
3-4.50V |
14X14 |
5.3 V |
41.6 mm |
10.16 inch |
5 |
CCD Image Sensors |
3.22 mm |
4.7 V |
60 Cel |
2160 |
-25 Cel |
Tin/Lead (Sn/Pb) |
SOLDER |
LINEAR |
CERAMIC, GLASS-SEALED |
e0 |
57 dB |
1 |
|||||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
SQUARE |
9 mm |
9 inch |
1/3 |
1.55 mm |
Tin/Silver/Copper (Sn/Ag/Cu) |
SOLDER |
FRAME |
GLOBAL SHUTTER |
e1 |
|||||||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
SQUARE |
9 mm |
9 inch |
1/3 |
1.55 mm |
Tin/Silver/Copper (Sn/Ag/Cu) |
SOLDER |
FRAME |
GLOBAL SHUTTER |
e1 |
|||||||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
0.4-1.26V |
3X3 |
1.26 V |
54 MHz |
9.995 mm |
5.595 inch |
1/2.6 |
.666 mm |
1.14 V |
85 Cel |
1920 |
-40 Cel |
TIN SILVER COPPER |
SOLDER |
2-WIRE INTERFACE |
120 fps |
250 mA |
FRAME |
GLOBAL SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE; COLOR SENSITIVITY IS 22.3 KE/LUX.S |
e1 |
71.4 dB |
1200 |
|||||||
|
Ams Ag |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
1 |
70 Cel |
-30 Cel |
Matte Tin (Sn) |
SOLDER |
SPI INTERFACE |
37 fps |
FRAME |
GLOBAL SHUTTER, EXTENDED DYNAMIC RANGE UPTO 90 DB |
CERAMIC |
e3 |
60 dB |
|||||||||||||||||||
Sony |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
0.4-1.4V |
2.9X2.9 |
1.3 V |
74.25 MHz |
12 mm |
9.3 inch |
1.52 mm |
1.1 V |
85 Cel |
1937 |
-30 Cel |
SOLDER |
4-WIRE INTERFACE |
120 fps |
252 mA |
FRAME |
ELECTRONIC SHUTTER, IT ALSO REQUIRES AT 2.9 V AND 1.8 V NOMINAL SUPPLY VOLTAGE |
CERAMIC |
1097 |
|||||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
3.75 |
1.95 V |
50 MHz |
10 mm |
10 inch |
1/3 |
1.38 mm |
1.7 V |
70 Cel |
1280 |
-30 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
SOLDER |
2-WIRE INTERFACE |
60 fps |
55 mA |
FRAME |
GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.5 V TO 3.1 V |
e1 |
64 dB |
960 |
||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
3.75 |
1.95 V |
50 MHz |
10 mm |
10 inch |
1/3 |
1.38 mm |
1.7 V |
70 Cel |
1280 |
-30 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
SOLDER |
2-WIRE INTERFACE |
60 fps |
55 mA |
FRAME |
GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.5 V TO 3.1 V |
e1 |
64 dB |
960 |
||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
0.20-2.60V |
5.60X5.60 |
3.05 V |
27 MHz |
11.43 mm |
11.43 inch |
1/4 |
4.05 mm |
2.55 V |
60 Cel |
640 |
-20 Cel |
SOLDER |
2-WIRE INTERFACE |
30 fps |
8 mA |
FRAME |
ELECTRONIC ROLLING SHUTTER |
PLASTIC |
60 dB |
480 |
||||||||
Omnivision Technologies |
IMAGE SENSOR,CMOS |
DIGITAL OUTPUT |
RECTANGULAR |
1.75 |
1/13 |
70 Cel |
-30 Cel |
30 fps |
FRAME |
ROLLING SHUTTER |
||||||||||||||||||||||||
|
Hamamatsu Photonics Kk |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
VOLTAGE OUTPUT |
RECTANGULAR |
7X125 |
3.45 V |
22.9 mm |
2.7 inch |
1.6 mm |
3.15 V |
85 Cel |
-40 Cel |
SOLDER |
30 mA |
LINEAR |
GLASS |
73.97 dB |
||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
SQUARE |
0.40-1.50V |
3.75 |
1.95 V |
50 MHz |
9 mm |
9 inch |
1/3 |
1.39 mm |
1.7 V |
70 Cel |
1280 |
-30 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
SOLDER |
2-WIRE INTERFACE |
54 fps |
90 mA |
FRAME |
GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.5 V TO 3.1 V |
e1 |
71.1 dB |
960 |
|||||||
Onsemi |
IMAGE SENSOR,CMOS |
SURFACE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
0.40-1.40V |
2.2X2.2 |
1.9 V |
27 MHz |
6.648 mm |
6.278 inch |
350-1150 |
1/3 |
.7 mm |
1.7 V |
70 Cel |
2304 |
-30 Cel |
SOLDER |
2-WIRE INTERFACE |
60 fps |
75 mA |
FRAME |
ELECTRONIC ROLLING SHUTTER, GLOBAL RESET RELEASE, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.76-2.9V |
69.5 dB |
1536 |
|||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
ANALOG VOLTAGE |
RECTANGULAR |
9X9 |
15.5 V |
37.2 mm |
32.99 inch |
5.97 mm |
14.5 V |
4008 |
SOLDER |
INTERLINE |
SENSITIVITY IS 13 UV/ELECTRON, ELECTRONIC SHUTTER |
28 dB |
2672 |
|||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
9X9 |
15.5 V |
44.45 mm |
32.64 inch |
5.97 mm |
14.5 V |
70 Cel |
4008 |
-50 Cel |
SOLDER |
28 Mbps |
INTERLINE |
IT HAS A SENSITIVITY OF 13 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER |
CERAMIC |
66 dB |
2672 |
|||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
ANALOG VOLTAGE |
RECTANGULAR |
5.4X5.4 |
15.5 V |
29.21 mm |
20.32 inch |
4.42 mm |
14.5 V |
70 Cel |
3326 |
-10 Cel |
SOLDER |
28 Mbps |
FULL FRAME |
SENSITIVITY IS 23 MICRO V/ELECTRON |
CERAMIC |
64.4 dB |
2504 |
|||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
15 |
2/3 |
CCD Image Sensors |
14.5 V |
70 Cel |
1920 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON |
64 dB |
1080 |
Image sensors are electronic devices that capture images and convert them into digital signals that can be processed and stored in electronic devices such as cameras, smartphones, and security systems. They are a critical component of digital imaging technology and have revolutionized the way we capture and store visual information.
Image sensors work by detecting and converting light into electrical signals. They typically consist of a grid of millions of tiny photodiodes, each of which generates an electrical charge in response to the amount of light it receives. When light enters the sensor, it is absorbed by the photodiodes, which generate a corresponding electrical signal. The signals from each photodiode are then combined to form a digital image.
There are two main types of image sensors: charge-coupled devices (CCDs) and complementary metal-oxide-semiconductor (CMOS) sensors. CCDs are the older of the two technologies and are characterized by their high image quality, low noise, and low power consumption. CMOS sensors, on the other hand, are more modern and are known for their high-speed performance, low power consumption, and lower cost.
Image sensors are widely used in a variety of applications, including digital cameras, smartphones, security systems, and medical imaging. They have also enabled the development of new technologies such as virtual and augmented reality, self-driving cars, and facial recognition.