Image Sensors

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Part	Manufacturer	Sensors or Transducers Type	Mounting Feature	Output Type	Package Shape or Style	Output Range	Pixel Size (um)	Maximum Supply Voltage	Master Clock	Body Length/Diameter	Body Width	Power Supplies (V)	Optical Format (inch)	Sub-Category	Body Height	Minimum Supply Voltage	Maximum Operating Temperature	Horizontal Pixel	Minimum Operating Temperature	Terminal Finish	Termination Type	Data Rate	Output Interface Type	Frame Rate	Maximum Operating Current	Array Type	Additional Features	Housing	JESD-609 Code	Dynamic Range	Vertical Pixel
FTF3020-M/IG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			52.7 mm	40 inch				4.1 mm		60 Cel		-40 Cel		SOLDER					FULL FRAME	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		72 dB
FTF3020-C/TG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			52.7 mm	40 inch			CCD Image Sensors	4.1 mm		60 Cel	3120	-40 Cel		SOLDER					FULL FRAME	ELECTRONIC SHUTTER	CERAMIC, METAL-SEALED COFIRED		72 dB	2060
FTT1010-M/IG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			40 mm	40 inch		1	CCD Image Sensors	4.1 mm		60 Cel	1030	-40 Cel		SOLDER					FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		70 dB	1072
OM6802WC/M0	NXP Semiconductors		SURFACE MOUNT				5X5					2.8		CCD Image Sensors			70 Cel	708	-20 Cel												494
FTT1010-M/TG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			40 mm	40 inch		1	CCD Image Sensors	4.1 mm		60 Cel	1030	-40 Cel		SOLDER					FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		70 dB	1072
SCM20025IBMN	NXP Semiconductors	IMAGE SENSOR,CMOS	SURFACE MOUNT	DIGITAL VOLTAGE	SQUARE	0.20-3.10V	7.80X7.80	3.6 V	13.5 MHz				1/4			3 V	40 Cel	352	0 Cel		SOLDER		2-WIRE INTERFACE	130 fps		FRAME	ELECTRONIC SHUTTER	CERAMIC		42 dB	288
FTF3020-M/EG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			52.7 mm	40 inch				4.1 mm		60 Cel		-40 Cel		SOLDER					FULL FRAME	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		72 dB
FTT1010-M/HG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			40 mm	40 inch		1	CCD Image Sensors	4.1 mm		60 Cel	1030	-40 Cel		SOLDER					FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		70 dB	1072
FTT1010-M/EG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			40 mm	40 inch		1	CCD Image Sensors	4.1 mm		60 Cel	1030	-40 Cel		SOLDER					FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		70 dB	1072
FT18/TG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		7.5X7.5			29.4 mm	15.49 inch		2/3		2.98 mm		60 Cel		-40 Cel	TIN/NICKEL PALLADIUM	SOLDER					FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED	e3/e4	60 dB
FT17N	NXP Semiconductors	IMAGE SENSOR,CMOS
FXA1012WC	NXP Semiconductors	IMAGE SENSOR,CCD	SURFACE MOUNT	ANALOG CURRENT	SQUARE		5.1X5.1			16.3 mm	16.3 inch		2/3	CCD Image Sensors	3.55 mm		60 Cel	1688	-20 Cel		SOLDER					FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, METAL-SEALED COFIRED		70 dB	1324
FT18/SG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		7.5X7.5			29.4 mm	15.49 inch		2/3		2.98 mm		60 Cel		-40 Cel	TIN/NICKEL PALLADIUM	SOLDER					FRAME TRANSFER	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED	e3/e4	60 dB
FTF3020-M/TG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			52.7 mm	40 inch				4.1 mm		60 Cel		-40 Cel		SOLDER					FULL FRAME	ELECTRONIC SHUTTER	CERAMIC, GLASS-SEALED		72 dB
FTF3020-C/IG	NXP Semiconductors	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG CURRENT	RECTANGULAR		12X12			52.7 mm	40 inch			CCD Image Sensors	4.1 mm		60 Cel	3120	-40 Cel		SOLDER					FULL FRAME	ELECTRONIC SHUTTER	CERAMIC, METAL-SEALED COFIRED		72 dB	2060
LUPA-1300-C	Infineon Technologies	IMAGE SENSOR,CMOS	THROUGH HOLE MOUNT				14X14					5		CCD Image Sensors			60 Cel	1280	0 Cel												1024
OV09650-KL1A	Infineon Technologies	IMAGE SENSOR,CMOS	SURFACE MOUNT	ANALOG VOLTAGE	RECTANGULAR	0.30-2.70V	3.18X3.18	1.98 V		5.095 mm	5.715 inch				.82 mm	1.62 V	70 Cel		-20 Cel		SOLDER	12 Mbps		15 fps	20 mA	FULL FRAME	IT ALSO HAS SUPPLY VOLTAGE 2.45 TO 2.8 VOLT AND 2.25 TO 3.6 VOLT			62 dB
IBIS4-1300-C-1	Infineon Technologies	IMAGE SENSOR,CMOS	SURFACE MOUNT				7X7					5		CCD Image Sensors				1030													1286
LUPA-4000-M	Infineon Technologies	IMAGE SENSOR,CMOS	SURFACE MOUNT				12X12					3.3		CCD Image Sensors			60 Cel	2048	0 Cel												2048
CYIM1SE9600AA-QZDC	Infineon Technologies
CYIS1SM0250AA-HFC	Infineon Technologies
IBIS5-A-1300-C-2	Infineon Technologies	IMAGE SENSOR,CMOS
LUPA-300-C-2	Infineon Technologies
IBIS5-A-1300-M-2	Infineon Technologies	IMAGE SENSOR,CMOS
LUPA-300-M-2	Infineon Technologies
IBIS4-6600-C-1	Infineon Technologies	IMAGE SENSOR,CMOS
IBIS4-1300-C-2	Infineon Technologies	IMAGE SENSOR,CMOS	SURFACE MOUNT				7X7					5		CCD Image Sensors				1030													1286
IBIS4-6600-C-2	Infineon Technologies	IMAGE SENSOR,CMOS
IBIS5-A-1300-C-1	Infineon Technologies	IMAGE SENSOR,CMOS
IBIS4-6600-M-2	Infineon Technologies	IMAGE SENSOR,CMOS
IBIS4-1300-M-2	Infineon Technologies	IMAGE SENSOR,CMOS
STAR-250-ND	Infineon Technologies	IMAGE SENSOR,CMOS
IBIS4-1300-C1-2	Infineon Technologies	IMAGE SENSOR,CMOS
IBIS5-A-1300-M-1	Infineon Technologies	IMAGE SENSOR,CMOS
CYIL1SE3000AA-BDCES	Infineon Technologies		SURFACE MOUNT				8X8					2.5		CCD Image Sensors			60 Cel	1696	0 Cel												1710
CYIWOSC1300AA-2XWC	Infineon Technologies
CYIL2SM1300AA-GZWC	Infineon Technologies	IMAGE SENSOR,CMOS	THROUGH HOLE MOUNT				14X14					2.5		CCD Image Sensors			70 Cel	1280	0 Cel												1024
CYIS1SM0250AA-C	Infineon Technologies
CYIH1SM1000AA-HHCES	Infineon Technologies	IMAGE SENSOR,CMOS	SURFACE MOUNT				18X18					3.3		CCD Image Sensors			85 Cel	1024	-40 Cel	Gold (Au)									e4		1024
CYIL1SN3000AA-BDCES	Infineon Technologies		SURFACE MOUNT				8X8					2.5		CCD Image Sensors			60 Cel	1696	0 Cel												1710
CYIM1SN9600AA-QZDC	Infineon Technologies
IBIS4-6600-M-1	Infineon Technologies	IMAGE SENSOR,CMOS
IBIS4-1300-M-1	Infineon Technologies	IMAGE SENSOR,CMOS
FLB6100	Diodes Incorporated
TCD2703ADG	Toshiba		THROUGH HOLE MOUNT				9.325X9.325					11		CCD Image Sensors			60 Cel	7500	0 Cel												3
TCD2704D	Toshiba	IMAGE SENSOR,CCD	THROUGH HOLE MOUNT	ANALOG VOLTAGE	RECTANGULAR	5-7V	5X5	13 V		53.6 mm	10.16 inch	12		CCD Image Sensors	3.9 mm	11.4 V	60 Cel	7500	0 Cel	Tin/Lead (Sn/Pb)	SOLDER					LINEAR	SENSITIVITY FOR RED 4.60 V/LX.S, RED 5.40 V/LX.S, GREEN 2.80 V/LX.S	CERAMIC, METAL-SEALED COFIRED	e0		4
T8EV4	Toshiba
TCM5114PL	Toshiba

Image Sensors

Image sensors are electronic devices that capture images and convert them into digital signals that can be processed and stored in electronic devices such as cameras, smartphones, and security systems. They are a critical component of digital imaging technology and have revolutionized the way we capture and store visual information.

Image sensors work by detecting and converting light into electrical signals. They typically consist of a grid of millions of tiny photodiodes, each of which generates an electrical charge in response to the amount of light it receives. When light enters the sensor, it is absorbed by the photodiodes, which generate a corresponding electrical signal. The signals from each photodiode are then combined to form a digital image.

There are two main types of image sensors: charge-coupled devices (CCDs) and complementary metal-oxide-semiconductor (CMOS) sensors. CCDs are the older of the two technologies and are characterized by their high image quality, low noise, and low power consumption. CMOS sensors, on the other hand, are more modern and are known for their high-speed performance, low power consumption, and lower cost.

Image sensors are widely used in a variety of applications, including digital cameras, smartphones, security systems, and medical imaging. They have also enabled the development of new technologies such as virtual and augmented reality, self-driving cars, and facial recognition.