Part | RoHS | Manufacturer | Sensors or Transducers Type | Mounting Feature | No. of Terminals | Output Type | Package Shape or Style | Output Range | Package Body Material | Minimum Range Of Magnetic Field | Maximum Supply Voltage | Maximum Output Current | Technology | Screening Level | Input Mode | Maximum Magnetic Field Range | Hysteresis | Body Length/Diameter | Body Width | Power Supplies (V) | Output Circuit Type | Resistance | Package Equivalence Code | No. of Axes | Sub-Category | Linearity (%) | Body Height | Minimum Supply Voltage | Maximum Operating Temperature | Response Time | Minimum Operating Temperature | Sensitivity (mV/G) | Terminal Finish | Termination Type | Output Interface Type | Output (V) | Maximum Operating Current | Output Polarity | Additional Features | Maximum Measurement Range (mm) | Housing | JESD-609 Code | Operating Frequency | Minimum Measurement Range (mm) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
0.40-3.30V |
3.5 V |
130 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1.1 mm |
2.8 V |
125 Cel |
-40 Cel |
TIN |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
3.7 mA |
MAGNETIC RANGE +/-130mT NOMINAL, HYSTERESIS 1 LSB, SENSITIVITY 10.2 LSB/mT |
PLASTIC |
e3 |
|||||||||||||||||||
|
Texas Instruments |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
VOLTAGE OUTPUT |
RECTANGULAR |
0-5.5V |
3.6 V |
2 A |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
1.7 V |
125 Cel |
-40 Cel |
TIN |
SOLDER |
2-WIRE INTERFACE |
3 mA |
PLASTIC |
e3 |
||||||||||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.20-1.60V |
PLASTIC/EPOXY |
.6 mT |
3.3 V |
.5 A |
CMOS |
5.5 mT |
.8 mT |
1.6 mm |
1.2 inch |
1.8/3 |
FL6,.047,20 |
Other Sensors |
.6 mm |
1.65 V |
85 Cel |
-40 Cel |
MATTE TIN |
SOLDER |
4 mA |
NON-INVERTING |
BATTERY OPERATION, ITS ALSO USE MAGNETIC RANGE MINUS 0.6 TO MINUS 5.5 MT |
e3 |
|||||||||||||||
|
Texas Instruments |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
VOLTAGE OUTPUT |
RECTANGULAR |
0-5.5V |
3.6 V |
2 A |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
1.7 V |
125 Cel |
-40 Cel |
TIN |
SOLDER |
2-WIRE INTERFACE |
3 mA |
PLASTIC |
e3 |
||||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL CURRENT |
RECTANGULAR |
0-10mA |
PLASTIC/EPOXY |
-9.5 mT |
24 V |
10 A |
BIPOLAR |
BIPOLAR |
9.5 mT |
15 mT |
2.9 mm |
1.6 inch |
2.7/18 |
TSOP6,.11,37 |
Other Sensors |
1.1 mm |
2.7 V |
TIN |
SOLDER |
OPEN-COLLECTOR |
7 mA |
INVERTING |
DUAL OUTPUT |
PLASTIC |
e3 |
||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL CURRENT |
RECTANGULAR |
0-10mA |
PLASTIC/EPOXY |
-4.2 mT |
18 V |
10 A |
4.2 mT |
5 mT |
2.9 mm |
1.6 inch |
2.7/18 |
SINGLE-ENDED |
TSOP6,.11,37 |
Other Sensors |
1.1 mm |
2.7 V |
TIN |
SOLDER |
SINGLE-ENDED |
7 mA |
PLASTIC |
e3 |
|||||||||||||||||
|
ROHM |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
VOLTAGE OUTPUT |
RECTANGULAR |
0.40-2.60V |
PLASTIC/EPOXY |
.8 mT |
3.6 V |
1 A |
5.5 mT |
.8 mT |
2.9 mm |
1.6 inch |
3 |
TSOP6,.11,37 |
Other Sensors |
1.25 mm |
2.4 V |
85 Cel |
-40 Cel |
SOLDER |
OPEN-DRAIN |
.012 mA |
INVERTING |
SEATED HEIGHT-MAX |
PLASTIC |
||||||||||||||||
Texas Instruments |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL CURRENT |
RECTANGULAR |
0-5.5V |
PLASTIC/EPOXY |
3.6 V |
2 A |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
3 |
1.1 mm |
1.7 V |
125 Cel |
-40 Cel |
SOLDER |
2-WIRE INTERFACE |
PLASTIC |
||||||||||||||||||||||||
|
Texas Instruments |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
VOLTAGE OUTPUT |
RECTANGULAR |
0-5.5V |
3.6 V |
2 A |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
1.7 V |
125 Cel |
-40 Cel |
TIN |
SOLDER |
2-WIRE INTERFACE |
3 mA |
PLASTIC |
e3 |
||||||||||||||||||||||
|
ROHM |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
VOLTAGE OUTPUT |
RECTANGULAR |
0.20-1.60V |
PLASTIC/EPOXY |
.6 mT |
3.3 V |
.5 A |
CMOS |
5 mT |
.9 mT |
1.6 mm |
1.2 inch |
1.8 |
FL6,.047,20 |
Other Sensors |
.6 mm |
1.65 V |
85 Cel |
-40 Cel |
SOLDER |
.012 mA |
INVERTING |
SEATED HEIGHT-MAX |
PLASTIC |
||||||||||||||||
|
Texas Instruments |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
VOLTAGE OUTPUT |
RECTANGULAR |
0-5.5V |
3.6 V |
2 A |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
1.7 V |
125 Cel |
-40 Cel |
TIN |
SOLDER |
2-WIRE INTERFACE |
3 mA |
PLASTIC |
e3 |
||||||||||||||||||||||
|
Texas Instruments |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
VOLTAGE OUTPUT |
RECTANGULAR |
0-5.5V |
3.6 V |
2 A |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
1.7 V |
125 Cel |
-40 Cel |
TIN |
SOLDER |
2-WIRE INTERFACE |
3 mA |
PLASTIC |
e3 |
||||||||||||||||||||||
|
Allegro MicroSystems |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
0.30V |
PLASTIC/EPOXY |
.6 mT |
3.5 V |
1 A |
UNIPOLAR |
5.5 mT |
.6 mT |
2 mm |
1.5 inch |
1.8/3.3 |
SOLCC6,.08,20 |
Other Sensors/Transducers |
.38 mm |
1.65 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
SOLDER |
OPEN-DRAIN |
2 mA |
COMPLEMENTARY |
BATTERY OPERATION |
e4 |
||||||||||||||
|
Texas Instruments |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
VOLTAGE OUTPUT |
RECTANGULAR |
0-5.5V |
3.6 V |
2 A |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
1.7 V |
125 Cel |
-40 Cel |
TIN |
SOLDER |
2-WIRE INTERFACE |
3 mA |
PLASTIC |
e3 |
||||||||||||||||||||||
|
ROHM |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.20-1.60V |
PLASTIC/EPOXY |
.6 mT |
3.3 V |
.5 A |
CMOS |
5 mT |
.9 mT |
1.6 mm |
1.2 inch |
1.8 |
FL6,.047,20 |
Other Sensors |
.6 mm |
1.65 V |
85 Cel |
-40 Cel |
SOLDER |
OPEN-DRAIN |
.009 mA |
INVERTING |
CMOS OUTPUT |
||||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.2-1.6V |
PLASTIC/EPOXY |
.6 mT |
3.3 V |
CMOS |
BIPOLAR |
5 mT |
1.5 mT |
1.6 mm |
1.175 inch |
1.8/3 |
FL6,.047,20 |
Other Sensors |
.585 mm |
1.65 V |
85 Cel |
-40 Cel |
MATTE TIN |
SOLDER |
4 mA |
NON-INVERTING |
BATTERY OPERATION |
e3 |
|||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.2-1.6V |
PLASTIC/EPOXY |
1.5 mT |
3.3 V |
CMOS |
BIPOLAR |
5.9 mT |
.8 mT |
1.6 mm |
1.175 inch |
1.8/3 |
FL6,.047,20 |
Other Sensors |
.585 mm |
1.65 V |
85 Cel |
-40 Cel |
MATTE TIN |
SOLDER |
4 mA |
NON-INVERTING |
BATTERY OPERATION |
e3 |
|||||||||||||||
|
ROHM |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.20-1.60V |
PLASTIC/EPOXY |
-2.1 mT |
3.3 V |
.5 A |
CMOS |
-3 mT |
.9 mT |
1.6 mm |
1.2 inch |
1.8 |
FL6,.047,20 |
Other Sensors |
.6 mm |
1.65 V |
85 Cel |
-40 Cel |
SOLDER |
.009 mA |
INVERTING |
CMOS OUTPUT |
|||||||||||||||||
|
Melexis N V |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
CURRENT OUTPUT |
RECTANGULAR |
-.8 mT |
3.6 V |
OMNIPOLAR |
6 mT |
2.3 mT |
2 mm |
1.5 inch |
OPEN-DRAIN |
.33 mm |
1.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
SOLDER |
5 mA |
e4 |
||||||||||||||||||||||
Texas Instruments |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
0.30-2.95V |
.7 mT |
5.5 V |
5 A |
OMNIPOLAR |
16 mT |
1 mT |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
1.65 V |
125 Cel |
-40 Cel |
SOLDER |
PUSH-PULL |
.0014 mA |
PLASTIC |
|||||||||||||||||||||
|
Texas Instruments |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
0.30-2.95V |
.7 mT |
5.5 V |
5 A |
OMNIPOLAR |
16 mT |
1 mT |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
1.65 V |
125 Cel |
-40 Cel |
TIN |
SOLDER |
PUSH-PULL |
.0014 mA |
PLASTIC |
e3 |
||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
-160 mT |
3.5 V |
AEC-Q100 |
160 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1 mm |
2.8 V |
125 Cel |
-40 Cel |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
5 mA |
SEATED HEIGHT-CALCULATED |
PLASTIC |
||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL OUTPUT |
RECTANGULAR |
PLASTIC/EPOXY |
-10 mT |
18 V |
10 A |
BIPOLAR |
AEC-Q100 |
BIPOLAR |
10 mT |
15 mT |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
2.7 V |
TERMINALS |
7 mA |
PLASTIC |
|||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
-160 mT |
3.5 V |
AEC-Q100 |
160 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1 mm |
2.8 V |
125 Cel |
-40 Cel |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
5 mA |
SEATED HEIGHT-CALCULATED |
PLASTIC |
||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
-160 mT |
3.5 V |
AEC-Q100 |
160 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1 mm |
2.8 V |
125 Cel |
-40 Cel |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
5 mA |
SEATED HEIGHT-CALCULATED |
PLASTIC |
||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
-160 mT |
3.5 V |
AEC-Q100 |
160 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1 mm |
2.8 V |
125 Cel |
-40 Cel |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
5 mA |
SEATED HEIGHT-CALCULATED |
PLASTIC |
||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
-160 mT |
3.5 V |
AEC-Q100 |
160 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1 mm |
2.8 V |
125 Cel |
-40 Cel |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
5 mA |
SEATED HEIGHT-CALCULATED |
PLASTIC |
||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
-160 mT |
3.5 V |
AEC-Q100 |
160 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1 mm |
2.8 V |
125 Cel |
-40 Cel |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
5 mA |
SEATED HEIGHT-CALCULATED |
PLASTIC |
||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL OUTPUT |
RECTANGULAR |
PLASTIC/EPOXY |
-10 mT |
18 V |
10 A |
BIPOLAR |
AEC-Q100 |
BIPOLAR |
10 mT |
15 mT |
2.9 mm |
1.6 inch |
TSOP6,.11,37 |
1.1 mm |
2.7 V |
TIN |
TERMINALS |
7 mA |
PLASTIC |
e3 |
|||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
-160 mT |
3.5 V |
AEC-Q100 |
160 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1 mm |
2.8 V |
125 Cel |
-40 Cel |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
5 mA |
SEATED HEIGHT-CALCULATED |
PLASTIC |
||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
-160 mT |
3.5 V |
AEC-Q100 |
160 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1 mm |
2.8 V |
125 Cel |
-40 Cel |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
5 mA |
SEATED HEIGHT-CALCULATED |
PLASTIC |
||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
0.40-3.30V |
3.5 V |
130 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1.1 mm |
2.8 V |
125 Cel |
-40 Cel |
TIN |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
3.7 mA |
MAGNETIC RANGE +/-130mT NOMINAL, HYSTERESIS 1 LSB, SENSITIVITY 10.2 LSB/mT |
PLASTIC |
||||||||||||||||||||
|
Infineon Technologies |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
-160 mT |
3.5 V |
AEC-Q100 |
160 mT |
2.9 mm |
1.6 inch |
OPEN-DRAIN |
TSOP6,.11,37 |
1 mm |
2.8 V |
125 Cel |
-40 Cel |
SOLDER |
I2C INTERFACE |
OPEN-DRAIN |
5 mA |
SEATED HEIGHT-CALCULATED |
PLASTIC |
||||||||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.60-4.40V |
PLASTIC/EPOXY |
-5 mT |
5 V |
148 A |
5 mT |
6 mT |
1.6 mm |
1.175 inch |
1.8/5 |
FL6,.047,20 |
Other Sensors |
.585 mm |
1.8 V |
100 Cel |
-40 Cel |
MATTE TIN |
SOLDER |
OPEN-DRAIN |
5 mA |
e3 |
|||||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
SQUARE |
0.30V |
PLASTIC/EPOXY |
1 mT |
5.5 V |
4 mT |
.8 mT |
2.01 mm |
2.01 inch |
3 |
SOLCC6,.08,25 |
Other Sensors |
.6 mm |
2.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
SOLDER |
OPEN-DRAIN |
10 mA |
NON-INVERTING |
BATTERY OPERATION |
e4 |
||||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.2-1.6V |
PLASTIC/EPOXY |
.6 mT |
3.3 V |
BIPOLAR |
5.5 mT |
.8 mT |
1.6 mm |
1.175 inch |
1.8 |
FL6,.047,20 |
Other Sensors |
.585 mm |
1.65 V |
85 Cel |
-40 Cel |
MATTE TIN |
SOLDER |
4 mA |
NON-INVERTING |
BATTERY OPERATION |
e3 |
||||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
SQUARE |
0.1-2.8V |
PLASTIC/EPOXY |
-4 mT |
5.5 V |
BIPOLAR |
4 mT |
1 mT |
2.01 mm |
2.01 inch |
2.5/5 |
SOLCC6,.08,25 |
Other Sensors |
.6 mm |
2.4 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
SOLDER |
9 mA |
NON-INVERTING |
BATTERY OPERATION |
e4 |
||||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
0.30V |
PLASTIC/EPOXY |
1 mT |
5.5 V |
5 mT |
1 mT |
1.6 mm |
1.17 inch |
3 |
FL6,.047,20 |
Other Sensors/Transducers |
.58 mm |
2.5 V |
85 Cel |
-40 Cel |
MATTE TIN |
SOLDER |
OPEN-DRAIN |
.04 mA |
NON-INVERTING |
e3 |
|||||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.30V |
PLASTIC/EPOXY |
1 mT |
5.5 V |
BIPOLAR(LATCHED) |
5.5 mT |
.8 mT |
2.01 mm |
1.51 inch |
3/5 |
SOLCC6,.08,20 |
Other Sensors |
.4 mm |
2.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
SOLDER |
OPEN-DRAIN |
10 mA |
NON-INVERTING |
BATTERY OPERATION |
e4 |
|||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.30V |
PLASTIC/EPOXY |
1 mT |
5.5 V |
BIPOLAR(LATCHED) |
5.5 mT |
.8 mT |
3.01 mm |
2.01 inch |
3/5 |
SOLCC6,.12,20 |
Other Sensors |
.4 mm |
2.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
SOLDER |
OPEN-DRAIN |
10 mA |
NON-INVERTING |
BATTERY OPERATION |
e4 |
|||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
SQUARE |
0.30V |
PLASTIC/EPOXY |
1 mT |
5.5 V |
1 A |
6 mT |
1.5 mT |
2.01 mm |
2.01 inch |
3 |
SOLCC6,.08,25 |
Other Sensors |
.6 mm |
2.5 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
SOLDER |
OPEN-DRAIN |
9 mA |
NON-INVERTING |
BATTERY OPERATION |
e4 |
|||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.2-1.6V |
PLASTIC/EPOXY |
1.5 mT |
3.3 V |
BIPOLAR |
5.5 mT |
.8 mT |
1.6 mm |
1.175 inch |
1.8/3 |
FL6,.047,20 |
Other Sensors |
.575 mm |
1.65 V |
85 Cel |
-40 Cel |
MATTE TIN |
SOLDER |
4 mA |
NON-INVERTING |
BATTERY OPERATION |
e3 |
||||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
SQUARE |
0.30V |
PLASTIC/EPOXY |
1 mT |
5.5 V |
1 A |
BIPOLAR |
6 mT |
1 mT |
2.01 mm |
2.01 inch |
3/5 |
SOLCC6,.08,25 |
Other Sensors |
.6 mm |
2.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
SOLDER |
OPEN-DRAIN |
9 mA |
INVERTING |
BATTERY OPERATION |
e4 |
||||||||||||||
|
Diodes Incorporated |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
ANALOG VOLTAGE |
RECTANGULAR |
0.2-1.6V |
PLASTIC/EPOXY |
3.5 mT |
3.3 V |
BIPOLAR |
7.9 mT |
.8 mT |
1.6 mm |
1.175 inch |
1.8/3 |
FL6,.047,20 |
Other Sensors |
.585 mm |
1.65 V |
85 Cel |
-40 Cel |
MATTE TIN |
SOLDER |
4 mA |
COMPLEMENTARY |
BATTERY OPERATION |
e3 |
||||||||||||||||
Toshiba |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
0-5.5V |
.3 mT |
3.6 V |
CMOS |
3.8 mT |
1.4 mT |
1.5 mm |
1.15 inch |
OPEN-DRAIN |
SOLCC6,.05,18 |
.38 mm |
2.3 V |
85 Cel |
-40 Cel |
SOLDER |
OPEN-DRAIN |
1.1 mA |
PLASTIC |
|||||||||||||||||||||
Toshiba |
MAGNETIC FIELD SENSOR,HALL EFFECT |
SURFACE MOUNT |
6 |
DIGITAL VOLTAGE |
RECTANGULAR |
0-2.5V |
.3 mT |
3.6 V |
CMOS |
3.8 mT |
1.4 mT |
1.5 mm |
1.15 inch |
SOLCC6,.05,18 |
.38 mm |
2.3 V |
85 Cel |
-40 Cel |
SOLDER |
PUSH-PULL |
1.1 mA |
PLASTIC |
Magnetic field sensors are electronic devices that measure the strength and direction of magnetic fields and convert them into a measurable electrical signal. They are commonly used in a variety of applications, such as navigation, automotive, industrial, and medical.
Magnetic field sensors work by detecting the change in magnetic field strength or direction as a magnetic field interacts with a sensing element. The sensing element is typically a small piece of magnetic material, such as a magnetoresistive or Hall-effect sensor, which generates a measurable electrical signal proportional to the strength and direction of the magnetic field.
There are several types of magnetic field sensors, including Hall-effect sensors, magnetoresistive sensors, and fluxgate sensors. Hall-effect sensors work by measuring the change in voltage across a thin strip of semiconductor material as it is exposed to a magnetic field. Magnetoresistive sensors work by measuring the change in resistance of a thin film of magnetic material as it is exposed to a magnetic field. Fluxgate sensors work by using a coil to detect the magnetic field and a feedback circuit to measure the strength and direction of the field.