10 ATM/SONET/SDH Circuits 17

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3747AEUB	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.041 mA	3.3 V	3.3	SMALL OUTLINE	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified				3 mm
MAX3747AEUB+	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.041 mA	3.3 V	3.3	SMALL OUTLINE	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
SY88993AVKG-TR	Microchip Technology	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			65 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G10	2	1.1 mm	3 mm	Not Qualified	e4	40	260	3 mm
HMC-C065	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED		NO	1		-3.3 V				MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	R-XQMA-X10				Not Qualified	e4
HMC-C060	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED		NO	1		-3.3 V				MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	R-XQMA-X10				Not Qualified	e4
HMC-C064	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED		NO	1		-3.3 V				MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	R-XQMA-X10				Not Qualified	e4
HMC-C061	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED		NO	1		-3.3 V				MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	R-XQMA-X10				Not Qualified	e4
MAX3747EUBTR	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	VSON	SQUARE	PLASTIC/EPOXY		YES	1	BIPOLAR			3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N10		.8 mm	3 mm					3 mm
MAX3747BEUB+	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1	BIPOLAR		43 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3747AEUB+T	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.041 mA	3.3 V	3.3	SMALL OUTLINE	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3747BEUB+T	Analog Devices		INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	BIPOLAR		43 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G10	1			Not Qualified	e3	30	260
MAX3747EUB	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.035 mA	3.3 V	3.3	SMALL OUTLINE	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e0		245	3 mm
MAX3747BEUB	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY		YES	1	BIPOLAR			3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX3747EUB+T	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.035 mA	3.3 V	3.3	SMALL OUTLINE	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		30	260	3 mm
MAX3747EUB-T	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.035 mA	3.3 V	3.3	SMALL OUTLINE	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX3747EUB+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.035 mA	3.3 V	3.3	SMALL OUTLINE	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		30	260	3 mm
MAX3747AEUB-T	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.041 mA	3.3 V	3.3	SMALL OUTLINE	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N10		.8 mm	3 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	3 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.