Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
.12 mA |
3.3 V |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
ATM/SONET/SDH ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e3 |
30 |
260 |
8.2 mm |
||||||
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
.12 mA |
3.3 V |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
ATM/SONET/SDH ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G24 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e0 |
245 |
8.2 mm |
||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
2 |
.29 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
2 |
.29 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER, HEAT SINK/SLUG |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
118 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
118 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
118 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
135 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
170 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
170 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
135 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
|||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
|||||||||||
|
Analog Devices |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
122 mA |
5 V |
5 |
CHIP CARRIER |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N24 |
Not Qualified |
||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N24 |
Not Qualified |
|||||||||||||||||
Analog Devices |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
122 mA |
5 V |
5 |
CHIP CARRIER |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N24 |
Not Qualified |
|||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e0 |
||||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.145 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
4 mm |
|||||||
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
.12 mA |
3.3 V |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
ATM/SONET/SDH ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G24 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e0 |
245 |
8.2 mm |
||||||||
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.14 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
.12 mA |
3.3 V |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
ATM/SONET/SDH ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e3 |
30 |
260 |
8.2 mm |
||||||
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.145 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.14 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||
|
Maxim Integrated |
COMMERCIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BIPOLAR |
60 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
ATM/SONET/SDH ICs |
.635 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
Not Qualified |
||||||||||||||||
|
Maxim Integrated |
COMMERCIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BIPOLAR |
60 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
ATM/SONET/SDH ICs |
.635 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
Not Qualified |
||||||||||||||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e0 |
|||||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.14 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||
|
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.145 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.14 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
4 mm |
|||||||
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.145 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||
Renesas Electronics |
ATM/SONET/SDH RECEIVER |
PIN/PEG |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
-5.2 V |
5 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-P24 |
Not Qualified |
||||||||||||||||||||||||
Renesas Electronics |
ATM/SONET/SDH TRANSMITTER |
PIN/PEG |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
-2.2 V |
5 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-P24 |
Not Qualified |
||||||||||||||||||||||||
Renesas Electronics |
ATM/SONET/SDH TRANSMITTER |
PIN/PEG |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
-5.2 V |
5 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-P24 |
Not Qualified |
||||||||||||||||||||||||
Renesas Electronics |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
270 mA |
5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
Not Qualified |
|||||||||||||||||
Renesas Electronics |
ATM/SONET/SDH TRANSMITTER |
PIN/PEG |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
-2.2 V |
5 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-P24 |
Not Qualified |
||||||||||||||||||||||||
Renesas Electronics |
ATM/SONET/SDH TRANSMITTER |
PIN/PEG |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
-2.2 V |
5 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-P24 |
Not Qualified |
||||||||||||||||||||||||
Broadcom |
ATM/SONET/SDH SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
24 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
-5.2 V |
FLATPACK |
.8 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G24 |
6.9596 mm |
Not Qualified |
e0 |
30 |
240 |
8.4328 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.