256 ATM/SONET/SDH Circuits 31

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ZL81001GGG2	Microchip Technology	ATM/SONET/SDH ICS	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		154 mA	1.8 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.7 mm	17 mm					17 mm
DS31400GN+T	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.7 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
MC92500ZQ	NXP Semiconductors	ATM/SONET/SDH NETWORK INTERFACE		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM;SONET	YES	1			3.3 V		GRID ARRAY	BGA256,20X20,50		1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256		2.834 mm	27 mm					27 mm
PXB4220EV34	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm					27 mm
PXB4221	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS	.47 mA	3.3 V	3.3	GRID ARRAY	QFP256,1.2SQ,16	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256			27 mm	Not Qualified	e0			27 mm
PXB4219	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS	.7 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.13 mm	27 mm	Not Qualified	e0			27 mm
PXB4219E	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH	YES	1	CMOS	.7 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm	Not Qualified				27 mm
PXB4220EV33	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm					27 mm
PXB4221E	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH	YES	1	CMOS	.7 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm	Not Qualified				27 mm
PXB4220	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS	.47 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256			27 mm	Not Qualified	e0			27 mm
PXB4220E	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH	YES	1	CMOS	.7 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm	Not Qualified				27 mm
DS26102	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.5 mm	17 mm	Not Qualified	e0			17 mm
DS31400GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.7 mm	17 mm	Not Qualified		30	260	17 mm
DS26101N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.5 mm	17 mm	Not Qualified	e0			17 mm
DS3100GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.146 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.77 mm	17 mm	Not Qualified		20	240	17 mm
DS31400GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.7 mm	17 mm	Not Qualified	e0			17 mm
DS26101	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.5 mm	17 mm	Not Qualified	e0			17 mm
DS31415GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B256						NOT SPECIFIED	NOT SPECIFIED
DS31407GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		416 mA	1.8 V		GRID ARRAY	BGA256,16X16,40		1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.62 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
DS31406GN+	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.7 mm	17 mm			30	260	17 mm
DS31408GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B256
DS3100GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.146 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified	e3			17 mm
DS3101GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.12 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.26 mm	17 mm	Not Qualified	e0			17 mm
DS3100GN#	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.77 mm	17 mm	Not Qualified				17 mm
DS31408GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B256						NOT SPECIFIED	NOT SPECIFIED
DS3101GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.12 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.26 mm	17 mm	Not Qualified	e3			17 mm
TC35885TB	Toshiba	ATM/SONET/SDH MUX/DEMUX	OTHER	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1.27 mm	85 Cel	-5 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.7 mm	27 mm	Not Qualified	e0			27 mm
82P5088BB	Renesas Electronics	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	3.5 mm	17 mm	Not Qualified	e0			17 mm
82P5088BBG	Renesas Electronics	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B256	3				e1	NOT SPECIFIED	260
77V400S156BC	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm	Not Qualified	e0	20	225	17 mm
77V400S156BCI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm	Not Qualified	e0	20	225	17 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.