Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
260 |
5 mm |
|||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
122 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
122 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
122 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
260 |
5 mm |
|||||||||||||
Sony |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
74 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP32,.28SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1.7 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
|||||||||
|
Silicon Labs |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
BUTT |
32 |
VBCC |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER |
.5 mm |
95 Cel |
-40 Cel |
BOTTOM |
.95 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
5 mm |
||||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N32 |
3 |
1.12 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
.131 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
.131 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
.131 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
-3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N32 |
3 |
1.12 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
|||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
.217 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Microchip Technology |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
160 mA |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE |
TQFP32,.35SQ,32 |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
||||||||
|
Microchip Technology |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
160 mA |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE |
TQFP32,.35SQ,32 |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1.2 mm |
7 mm |
e3 |
7 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH MUX/DEMUX |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
.095 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
260 |
5 mm |
|||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
-3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N32 |
3 |
1.12 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.215 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH MUX/DEMUX |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
.095 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
260 |
5 mm |
|||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
.259 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
.259 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
145 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
145 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
.217 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Microchip Technology |
ATM/SONET/SDH NETWORK INTERFACE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
43 mA |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
145 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.169 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
Intel |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
-5.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G32 |
1.6 mm |
5 mm |
Not Qualified |
5 mm |
||||||||||||||||
|
Silicon Labs |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
BUTT |
32 |
VBCC |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER |
.5 mm |
95 Cel |
-40 Cel |
BOTTOM |
3 |
.95 mm |
5 mm |
Not Qualified |
40 |
260 |
5 mm |
||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
5 mm |
||||||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
200 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
266 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
200 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
266 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
COMMERCIAL |
GULL WING |
32 |
HLQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE |
QFP32,.35SQ,32 |
ATM/SONET/SDH ICs |
.8 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
185 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
185 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
185 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.185 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.185 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.169 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
185 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
155 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.