400 ATM/SONET/SDH Circuits 32

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Length
DS3183N+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3163N+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.381 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3163+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.381 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3162N+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.3 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3161+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.218 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3162+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.3 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3161N+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.218 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3183+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3182N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.448 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3163N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.381 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3162	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.3 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3164N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.468 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3183	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.61 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3161N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.218 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3184	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3164+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.468 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified		27 mm
DS3181+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3183N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.61 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3182N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3162N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.3 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3181N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3181	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.28 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3161	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.218 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3164N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.468 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3163	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.381 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3184+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e3	27 mm
DS3184N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3182	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.448 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3182+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1	27 mm
DS3181N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.28 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm
DS3184N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e3	27 mm
DS3164	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	.468 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0	27 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.