56 ATM/SONET/SDH Circuits 17

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD9554-1BCPZ-REEL7	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	1			1.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.8 mm	8 mm		e3	30	260	8 mm
AD9554-1BCPZ	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	1			1.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.8 mm	8 mm		e3	30	260	8 mm
78P2351R-IM/A06/F	Analog Devices	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm	Not Qualified				7 mm
MAX4927ETN+	Analog Devices	ATM/SONET/SDH SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	UNSPECIFIED	SDH; SONET	YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-XQCC-N56	3	.8 mm	5 mm	Not Qualified	e3	30	260	11 mm
78P2351R-IM/A06R/F	Analog Devices	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm	Not Qualified				7 mm
78P2351R-IM/A06R	Analog Devices	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm	Not Qualified				7 mm
78P2351R-IM/A06	Analog Devices	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm	Not Qualified				7 mm
MAX4927ETN+T	Analog Devices		INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-XQCC-N56	3	.8 mm	5 mm		e3	30	260	11 mm
ADN2865ACP	Analog Devices	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1		350 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	1	1 mm	8 mm	Not Qualified				8 mm
ADN2865ACP-RL	Analog Devices	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1		350 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	1	1 mm	8 mm	Not Qualified				8 mm
ADN2865ACP-RL7	Analog Devices	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1		350 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	1	1 mm	8 mm	Not Qualified				8 mm
MAX3886ETN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET	YES	1	BICMOS	310 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.8 mm	8 mm	Not Qualified	e3	30	260	8 mm
MAX3886ETN+T	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.8 mm	8 mm		e3	30	260	8 mm
8T49N281B-DDDNLGI#	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1		90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm
8T49N281B-DDDNLGI8	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1		90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm
8T49N281B-DDDNLGI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1		90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm
8T49N281B-014NLGI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1		90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.