64 ATM/SONET/SDH Circuits 64

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3881ECB	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	BIPOLAR		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	1	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3831UCB-T	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3890ECB+TD	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3			10 mm
MAX3891ECB+TD	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1	BIPOLAR		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3			10 mm
MAX3880ECB+D	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.38 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3			10 mm
MAX3880ECB-D	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.38 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3832UCB-D	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel		QUAD	S-PQFP-G64		1.2 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
MAX3885ECB+TD	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.28 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
MAX3880ECB-T	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.38 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	1	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3890ECB-TD	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3885ECB-T	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	1	1.2 mm	10 mm	Not Qualified	e0			10 mm
IDT77V126L200TF8	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	e0			10 mm
77V126L200TF	Renesas Electronics		COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY		YES		CMOS		3.3 V	3.3	FLATPACK	QFP64,.47SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3			Not Qualified	e0	30	240
IDT77101L25STQFP	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	e0			10 mm
IDT77101L25TF8	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0			10 mm
HDMP-0482	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY		YES			400 mA	3.3 V	3.3	FLATPACK	QFP64,.51SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G64				Not Qualified

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.