HVQCCN ATM/SONET/SDH Circuits 304

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3882AETX+	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1			.23 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX3748HETE	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	ATM; SONET	YES	1	BIPOLAR		.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX3942ETG	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR	-5.2 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e0			4 mm
MAX3991UTG+T	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.14 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e3			4 mm
MAX3992UTG	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.145 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e0			4 mm
MAX3748BETE#	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	ATM; SONET	YES	1	BIPOLAR		.053 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	3 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	3 mm
8A34002E-DDDNLG8	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1			380 mA	1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N72		1 mm	10 mm					10 mm
8A34002E-000NLG#	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1			380 mA	1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel	-40 Cel	Tin (Sn)	QUAD	S-XQCC-N72	3	1 mm	10 mm		e3	NOT SPECIFIED	260	10 mm
8A34002E-DDDNLG	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1			380 mA	1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N72		1 mm	10 mm					10 mm
8T49N281B-DDDNLGI#	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1			90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm
8A34002E-000NLG	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1			380 mA	1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N72	3	1 mm	10 mm		e3		260	10 mm
8A34002E-DDDNLG#	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1			380 mA	1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N72		1 mm	10 mm					10 mm
8T49N281B-DDDNLGI8	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1			90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm
8T49N281B-DDDNLGI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1			90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm
8T49N281B-014NLGI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1			90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm
TMOD0110G5YP1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1		-5.2 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-N28		1 mm	5 mm	Not Qualified	e0	30	240	5 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.