LBGA ATM/SONET/SDH Circuits 25

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SI5100-H-GL	Silicon Labs	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	195	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		830 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE	BGA195,14X14,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B195		1.56 mm	15 mm	Not Qualified	e1			15 mm
ZL81001GGG2	Microchip Technology	ATM/SONET/SDH ICS	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		154 mA	1.8 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.7 mm	17 mm					17 mm
DS31400GN+T	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.7 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
DS3102GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	81	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.192 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81	3	1.48 mm	10 mm	Not Qualified				10 mm
DS26102	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.5 mm	17 mm	Not Qualified	e0			17 mm
DS31400GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.7 mm	17 mm	Not Qualified		30	260	17 mm
DS3104GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	81	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.185 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B81	3	1.47 mm	10 mm	Not Qualified	e0			10 mm
DS26101N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.5 mm	17 mm	Not Qualified	e0			17 mm
DS3177+	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B100	3	1.5 mm	11 mm					11 mm
DS31400GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.7 mm	17 mm	Not Qualified	e0			17 mm
DS3104GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	81	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.185 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B81	3	1.47 mm	10 mm	Not Qualified	e3			10 mm
DS26101	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.5 mm	17 mm	Not Qualified	e0			17 mm
DS3177N+T	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER		BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		145 mA	3.3 V		GRID ARRAY, LOW PROFILE	BGA100,10X10,40		1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B100		1.5 mm	11 mm			NOT SPECIFIED	NOT SPECIFIED	11 mm
DS31406GN+	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.7 mm	17 mm			30	260	17 mm
DS3102GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	81	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.192 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81	3	1.48 mm	10 mm	Not Qualified				10 mm
DS3101GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.12 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.26 mm	17 mm	Not Qualified	e0			17 mm
DS3177N+	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B100	3	1.5 mm	11 mm					11 mm
DS3101GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.12 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.26 mm	17 mm	Not Qualified	e3			17 mm
TC35885TB	Toshiba	ATM/SONET/SDH MUX/DEMUX	OTHER	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1.27 mm	85 Cel	-5 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.7 mm	27 mm	Not Qualified	e0			27 mm
77V500S25BCI	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA144,12X12,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.5 mm	13 mm	Not Qualified	e0	20	225	13 mm
77V400S156BC	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm	Not Qualified	e0	20	225	17 mm
77V500S25BC	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT	COMMERCIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA144,12X12,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	S-PBGA-B144	3	1.5 mm	13 mm	Not Qualified	e0	20	225	13 mm
77V400S156BCI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm	Not Qualified	e0	20	225	17 mm
UPD98412N7-H6-A	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT	INDUSTRIAL	BALL	576	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	MOS	1.3 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA576,30X30,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B576	3	1.7 mm	40 mm	Not Qualified	e1	10	260	40 mm
TAAD08JU2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	520	LBGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1.5 V	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA520,31X31,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B520		1.67 mm	40 mm	Not Qualified	e0	30	225	40 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.