ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH Circuits 20

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD8153ACPZ-RL7	Analog Devices	ATM/SONET/SDH MUX/DEMUX	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1			.095 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3		260	5 mm
AD8153ACPZ	Analog Devices	ATM/SONET/SDH MUX/DEMUX	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1			.095 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3		260	5 mm
PM5337-FEI	Microchip Technology	ATM/SONET/SDH MUX/DEMUX		BALL	896	BGA	SQUARE	PLASTIC/EPOXY		YES	1						GRID ARRAY							BOTTOM	S-PBGA-B896
OQ2536HP	NXP Semiconductors	ATM/SONET/SDH MUX/DEMUX	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	BICMOS	-4.5 V	.525 mA	1.5 V	3.3,5,-4.5	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1	1.6 mm	14 mm	Not Qualified				14 mm
OQ2536HP-T	NXP Semiconductors	ATM/SONET/SDH MUX/DEMUX		GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-4.5 V		1.5 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified				14 mm
OQ2535HP-T	NXP Semiconductors	ATM/SONET/SDH MUX/DEMUX	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-4.5 V	364 mA	3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified				14 mm
OQ2535HP	NXP Semiconductors	ATM/SONET/SDH MUX/DEMUX	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	BICMOS	-4.5 V	364 mA	3.3 V	3.3,5,-4.5	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified				14 mm
MAX3831UCB-D	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3831UCB	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	1	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3832UCB-T	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3832UCB	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	1	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3831UCB-TD	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3832UCB-TD	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel		QUAD	S-PQFP-G64		1.2 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
MAX3831UCB-T	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3832UCB-D	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel		QUAD	S-PQFP-G64		1.2 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
TC35885TB	Toshiba	ATM/SONET/SDH MUX/DEMUX	OTHER	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY, LOW PROFILE			1.27 mm	85 Cel	-5 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.7 mm	27 mm	Not Qualified	e0			27 mm
TMUX03155	Broadcom	ATM/SONET/SDH MUX/DEMUX	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
BCM8129	Broadcom	ATM/SONET/SDH MUX/DEMUX		BALL	143	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B143				Not Qualified
BCM8128	Broadcom	ATM/SONET/SDH MUX/DEMUX		BALL	127	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B127				Not Qualified
BCM8125	Broadcom	ATM/SONET/SDH MUX/DEMUX		BALL	127	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B127				Not Qualified

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.