ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE ATM/SONET/SDH Circuits 27

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TNETA1575MFP	Texas Instruments	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY		YES					3.3,5	FLATPACK	QFP240,1.3SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G240				Not Qualified
TNETA1575PGC	Texas Instruments	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V	3.3,5	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G240		4.2 mm	32 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	32 mm
TNETA1560PGC	Texas Instruments	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1			5 V	5	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G240		4.2 mm	32 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	32 mm
TNETA1570MFP	Texas Instruments	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		5 V	5	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G240		4.2 mm	32 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	32 mm
XTNETA1570MFP	Texas Instruments	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1			5 V		FLATPACK				70 Cel	0 Cel		QUAD	S-PQFP-G240				Not Qualified
TNETA1561PGC	Texas Instruments	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1			5 V	5	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G240		4.2 mm	32 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	32 mm
PXB4110	Infineon Technologies	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V	3.3,5	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0			28 mm
TC35860F	Toshiba	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			5 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G240		4.45 mm	32.2 mm	Not Qualified				32.2 mm
TC35861F	Toshiba	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			5 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G240		4.45 mm	32.2 mm	Not Qualified				32.2 mm
TC35856AF	Toshiba	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.45 mm	28 mm	Not Qualified				28 mm
TC35856BF	Toshiba	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.45 mm	28 mm	Not Qualified				28 mm
TC35854F	Toshiba	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G240		4.45 mm	32 mm	Not Qualified				32 mm
UPD98409GN-LMU-A	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE		GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V		FLATPACK, FINE PITCH			.5 mm				QUAD	S-PQFP-G240	3	3.8 mm	32 mm	Not Qualified		10	250	32 mm
UPD98401AGD-MML	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		5 V	5	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		3.8 mm	28 mm	Not Qualified	e0			28 mm
UPD98405S1-6C	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	BALL	304	LFBGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	CMOS		3.3 V	3.3,3.3/5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA304,22X22,32	ATM/SONET/SDH ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B304		1.56 mm	19 mm	Not Qualified	e0			19 mm
UPD98401AGD-MML-A	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL EXTENDED	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		5 V	5	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	80 Cel	0 Cel	TIN BISMUTH	QUAD	S-PQFP-G208	3	3.8 mm	28 mm	Not Qualified	e6	10	250	28 mm
UPD98405S1-6C-A	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	INDUSTRIAL	BALL	304	LFBGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	CMOS		3.3 V	3.3,3.3/5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA304,22X22,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B304	3	1.66 mm	19 mm	Not Qualified	e1	10	250	19 mm
UPD98405GL-PMU	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	304	FQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	CMOS	900 mA	3.3 V	3.3,3.3/5	FLATPACK, FINE PITCH	QFP304,1.7SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G304		4.3 mm	40 mm	Not Qualified				40 mm
UPD98409GN-LMU	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE		GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V		FLATPACK, FINE PITCH			.5 mm				QUAD	S-PQFP-G240	1	3.8 mm	32 mm	Not Qualified				32 mm
UPD98405	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE		GULL WING	304	QFP	UNSPECIFIED	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	CMOS		3.3 V		FLATPACK						TIN LEAD	QUAD	X-PQFP-G304				Not Qualified	e0
UPD98401GD-MML	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES		CMOS	570 mA	5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G208				Not Qualified	e0
L644360A2WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL		YES		CMOS		5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208				Not Qualified	e0
L644360A3WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL		YES		CMOS		5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208				Not Qualified	e0
L644360A4WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL		YES		CMOS		5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208				Not Qualified	e0
L644360A1WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL		YES		CMOS		5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208				Not Qualified	e0
L64364NL	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE		GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY		YES		CMOS	1040 mA	3.3 V	3.3	FLATPACK	QFP240,1.3SQ,20	ATM/SONET/SDH ICs	.5 mm				QUAD	S-PQFP-G240				Not Qualified
L64360	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES			750 mA	5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	50 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G208				Not Qualified	e0

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.