Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
279 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
279 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N36 |
2 |
.95 mm |
6 mm |
e4 |
40 |
260 |
6 mm |
||||||||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.03 mA |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM; SONET |
YES |
1 |
BIPOLAR |
.0415 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
|||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
260 |
5 mm |
|||||||||||||
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
78 mA |
1.8 V |
FLATPACK, THIN PROFILE, FINE PITCH |
SPQFP64,.48SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
e3 |
10 mm |
|||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
260 |
5 mm |
|||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2 |
3.465 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
30 |
260 |
7 mm |
|||||||||
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
1.8 V |
GRID ARRAY, FINE PITCH |
BGA100,10X10,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
1.72 mm |
9 mm |
Not Qualified |
e1 |
9 mm |
||||||||||||
Sony |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
74 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP32,.28SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1.7 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
|||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
5 mm |
||||||||||||||
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
GRID ARRAY, FINE PITCH |
BGA100,10X10,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
1.72 mm |
9 mm |
e1 |
9 mm |
|||||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
Not Qualified |
6 mm |
|||||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2 |
3.465 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
30 |
260 |
7 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
2 |
.29 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
2 |
.29 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
1.8 V |
GRID ARRAY |
BGA64,8X8,40 |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
1.72 mm |
9 mm |
Not Qualified |
e1 |
9 mm |
||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
40 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.04 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B196 |
|||||||||||||||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.9 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
279 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
BGA100,10X10,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
3 |
1.72 mm |
9 mm |
Not Qualified |
e1 |
30 |
260 |
9 mm |
||||||||||
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
80 |
VFLGA |
SQUARE |
UNSPECIFIED |
SONET;SDH |
YES |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
LGA80,20X20,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XBGA-N80 |
.9 mm |
11 mm |
11 mm |
||||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
SON |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.041 mA |
3.3 V |
3.3 |
SMALL OUTLINE |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N10 |
1 |
.8 mm |
3 mm |
Not Qualified |
3 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
SON |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.041 mA |
3.3 V |
3.3 |
SMALL OUTLINE |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER, HEAT SINK/SLUG |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
40 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.04 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
279 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
1 |
120 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Other Telecom ICs |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
1 |
120 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Other Telecom ICs |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
120 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Other Telecom ICs |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SONET |
YES |
1 |
60 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
2 |
.9 mm |
3 mm |
e4 |
40 |
260 |
3 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.169 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.027 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
9.9 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.027 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
9.9 mm |
|||||
|
Silicon Labs |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.9 mm |
6 mm |
6 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.