Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
380 mA |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
NOT SPECIFIED |
260 |
10 mm |
||||||||||
|
Silicon Labs |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
2 |
.9 mm |
6 mm |
Not Qualified |
30 |
260 |
6 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-XQCC-N56 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
11 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||
Infineon Technologies |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
3.3 V |
3.3 |
GRID ARRAY |
BGA352,26X26,50 |
ATM/SONET/SDH ICs |
1.27 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B352 |
Not Qualified |
|||||||||||||||
Infineon Technologies |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
BALL |
456 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
3.3 V |
3.3 |
GRID ARRAY |
BGA456,26X26,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-45 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B456 |
2.5 mm |
35 mm |
Not Qualified |
e0 |
35 mm |
||||||||||
Infineon Technologies |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
3.3 V |
3.3 |
GRID ARRAY |
BGA352,26X26,50 |
ATM/SONET/SDH ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B352 |
2.5 mm |
35 mm |
Not Qualified |
e0 |
35 mm |
||||||||||
Infineon Technologies |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
BALL |
456 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
GRID ARRAY |
1.27 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B456 |
2.5 mm |
35 mm |
Not Qualified |
35 mm |
||||||||||||||||
Maxim Integrated |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
||||||||||||
Maxim Integrated |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
e0 |
245 |
5 mm |
|||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
BALL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA144,12X12,40 |
ATM/SONET/SDH ICs |
1 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B144 |
3 |
1.5 mm |
13 mm |
Not Qualified |
e0 |
20 |
225 |
13 mm |
||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
160 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC84,1.2SQ |
ATM/SONET/SDH ICs |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J84 |
Not Qualified |
e0 |
|||||||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
200 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
20 |
240 |
14 mm |
|||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G80 |
1.7 mm |
12 mm |
Not Qualified |
e3 |
12 mm |
||||||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
|||||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
380 mA |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N72 |
1 mm |
10 mm |
10 mm |
|||||||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
.16 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
1.7 mm |
12 mm |
Not Qualified |
e0 |
12 mm |
||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
180 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC84,1.2SQ |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J84 |
Not Qualified |
e0 |
|||||||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
160 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC84,1.2SQ |
ATM/SONET/SDH ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J84 |
4.57 mm |
29.3116 mm |
Not Qualified |
e0 |
29.3116 mm |
||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G80 |
1.7 mm |
12 mm |
Not Qualified |
e3 |
12 mm |
||||||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
1 |
3.3 V |
TIN LEAD |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
180 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC84,1.2SQ |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J84 |
4.57 mm |
29.3116 mm |
Not Qualified |
e0 |
29.3116 mm |
||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G80 |
1.7 mm |
12 mm |
Not Qualified |
e3 |
12 mm |
||||||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
160 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
1.7 mm |
12 mm |
Not Qualified |
e0 |
12 mm |
||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
380 mA |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
NOT SPECIFIED |
260 |
10 mm |
||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
160 mA |
3.3 V |
3.3 |
FLATPACK |
ATM/SONET/SDH ICs |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
Not Qualified |
e0 |
|||||||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
380 mA |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N72 |
1 mm |
10 mm |
10 mm |
|||||||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
.18 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
1.7 mm |
12 mm |
Not Qualified |
e0 |
12 mm |
||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
180 mA |
3.3 V |
3.3 |
FLATPACK |
ATM/SONET/SDH ICs |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
3 |
Not Qualified |
e0 |
||||||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
380 mA |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
260 |
10 mm |
|||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
380 mA |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N72 |
1 mm |
10 mm |
10 mm |
|||||||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G80 |
1.7 mm |
12 mm |
Not Qualified |
e3 |
12 mm |
||||||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
BALL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA144,12X12,40 |
ATM/SONET/SDH ICs |
1 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
S-PBGA-B144 |
3 |
1.5 mm |
13 mm |
Not Qualified |
e0 |
20 |
225 |
13 mm |
||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
|||||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
BALL |
576 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
MOS |
1.3 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA576,30X30,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B576 |
3 |
1.7 mm |
40 mm |
Not Qualified |
e1 |
10 |
260 |
40 mm |
|||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
.16 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
1.7 mm |
12 mm |
Not Qualified |
e0 |
12 mm |
||||||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
175 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
20 |
240 |
14 mm |
|||||||
Renesas Electronics |
ATM/SONET/SDH SWITCHING CIRCUIT |
BALL |
580 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
BOTTOM |
S-PBGA-B580 |
2.78 mm |
45 mm |
Not Qualified |
45 mm |
||||||||||||||||||||
Broadcom |
ATM/SONET/SDH SWITCHING CIRCUIT |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
GRID ARRAY |
TIN LEAD |
BOTTOM |
S-PBGA-B388 |
Not Qualified |
e0 |
30 |
225 |
|||||||||||||||||||
Broadcom |
ATM/SONET/SDH SWITCHING CIRCUIT |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
GRID ARRAY |
TIN LEAD |
BOTTOM |
S-PBGA-B352 |
Not Qualified |
e0 |
30 |
225 |
|||||||||||||||||||
Broadcom |
ATM/SONET/SDH SWITCHING CIRCUIT |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
GRID ARRAY |
TIN LEAD |
BOTTOM |
S-PBGA-B352 |
Not Qualified |
e0 |
30 |
225 |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.