COMMERCIAL EXTENDED ATM/SONET/SDH Circuits 3
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- ATM/SONET/SDH Circuits
Manufacturers
-
Analog Devices
-
Broadcom
-
Diodes Incorporated
-
Infineon Technologies
-
Intel
-
M/a-com Technology Solutions
-
Maxim Integrated
-
Microchip Technology
-
NXP Semiconductors
-
Onsemi
-
Pulse Electronics
-
Renesas Electronics
-
STMicroelectronics
-
Samsung
-
Silicon Labs
-
Sony
-
Texas Instruments
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Toshiba
Telecom IC Type
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ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
-
ATM/SONET/SDH ICS
-
ATM/SONET/SDH MUX/DEMUX
-
ATM/SONET/SDH NETWORK INTERFACE
-
ATM/SONET/SDH RECEIVER
-
ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
-
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER
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ATM/SONET/SDH SUPPORT CIRCUIT
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ATM/SONET/SDH SWITCHING CIRCUIT
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ATM/SONET/SDH TERMINATOR
-
ATM/SONET/SDH TRANSCEIVER
-
ATM/SONET/SDH TRANSMITTER
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MULTI-PROTOCOL CLOCK AND DATA RECOVERY CIRCUIT
Temperature Grade (1)
-
COMMERCIAL EXTENDED
-
AUTOMOTIVE
-
COMMERCIAL
-
INDUSTRIAL
-
MILITARY
-
OTHER
Terminal Form
-
BALL
-
BUTT
-
FLAT
-
GULL WING
-
J BEND
-
NO LEAD
-
PIN/PEG
-
THROUGH-HOLE
-
UNSPECIFIED
No. of Terminals
-
10
-
100
-
1152
-
12
-
120
-
127
-
128
-
13
-
14
-
143
-
144
-
16
-
160
-
1605
-
17
-
1724
-
176
-
177
-
18
-
186
-
19
-
195
-
196
-
198
-
20
-
208
-
21
-
22
-
23
-
24
-
240
-
244
-
25
-
256
-
26
-
272
-
28
-
289
-
29
-
301
-
304
-
32
-
33
-
34
-
342
-
352
-
36
-
37
-
388
-
4
-
40
-
400
-
42
-
44
-
456
-
48
-
49
-
5
-
500
-
52
-
520
-
56
-
576
-
580
-
6
-
600
-
64
-
676
-
68
-
680
-
7
-
700
-
72
-
76
-
792
-
8
-
80
-
81
-
84
-
896
-
9
-
909
Package Code
-
BGA
-
DIE
-
FBGA
-
FQFP
-
HBGA
-
HLBGA
-
HLFQFP
-
HLQFP
-
HQCCN
-
HQFP
-
HTFQFP
-
HTQFP
-
HVBCC
-
HVQCCN
-
LBGA
-
LFBGA
-
LFQFP
-
LQFP
-
QCCJ
-
QCCN
-
QFP
-
SON
-
SOP
-
SSOP
-
TFBGA
-
TFQFP
-
TSOP
-
TSSOP
-
VBCC
-
VFLGA
-
VQCCN
-
VSON
Package Shape
-
RECTANGULAR
-
SQUARE
-
UNSPECIFIED
Package Body Material
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CERAMIC
-
CERAMIC, GLASS-SEALED
-
CERAMIC, METAL-SEALED COFIRED
-
METAL
-
PLASTIC/EPOXY
-
UNSPECIFIED
Applications
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ATM
-
ATM; SDH
-
ATM; SDH; SONET
-
ATM; SONET
-
ATM;SONET
-
SDH
-
SDH; SONET
-
SONET
-
SONET;SDH
Surface Mount
-
NO
-
YES
No. of Functions
-
1
-
2
-
4
No. of Channels
-
1
-
2
Technology
-
BICMOS
-
BIPOLAR
-
CMOS
-
ECL
-
ECL10K
-
HYBRID
-
MOS
Nominal Negative Supply Voltage
-
-2 V
-
-2.2 V
-
-3 V
-
-3.3 V
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-3.35 V
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-4.5 V
-
-5 V
-
-5.2 V
Maximum Supply Current
-
.00051 mA
-
.00053 mA
-
.004 mA
-
.021 mA
-
.024 mA
-
.027 mA
-
.028 mA
-
.03 mA
-
.035 mA
-
.037 mA
-
.0395 mA
-
.04 mA
-
.041 mA
-
.0415 mA
-
.044 mA
-
.045 mA
-
.046 mA
-
.049 mA
-
.053 mA
-
.054 mA
-
.055 mA
-
.056 mA
-
.057 mA
-
.063 mA
-
.064 mA
-
.07 mA
-
.075 mA
-
.09 mA
-
.095 mA
-
.1 mA
-
.106 mA
-
.111 mA
-
.12 mA
-
.131 mA
-
.14 mA
-
.142 mA
-
.145 mA
-
.146 mA
-
.16 mA
-
.167 mA
-
.169 mA
-
.18 mA
-
.185 mA
-
.19 mA
-
.192 mA
-
.2 mA
-
.212 mA
-
.215 mA
-
.217 mA
-
.218 mA
-
.23 mA
-
.247 mA
-
.259 mA
-
.265 mA
-
.28 mA
-
.29 mA
-
.3 mA
-
.35 mA
-
.38 mA
-
.381 mA
-
.42 mA
-
.448 mA
-
.45 mA
-
.468 mA
-
.47 mA
-
.51 mA
-
.525 mA
-
.53 mA
-
.61 mA
-
.7 mA
-
.85 mA
-
1.3 mA
-
100 mA
-
1000 mA
-
1040 mA
-
118 mA
-
120 mA
-
122 mA
-
1300 mA
-
135 mA
-
140 mA
-
145 mA
-
154 mA
-
155 mA
-
160 mA
-
167 mA
-
170 mA
-
175 mA
-
180 mA
-
185 mA
-
190 mA
-
192 mA
-
200 mA
-
205 mA
-
210 mA
-
215 mA
-
242 mA
-
250 mA
-
255 mA
-
266 mA
-
270 mA
-
279 mA
-
28 mA
-
280 mA
-
3.465 mA
-
300 mA
-
305 mA
-
310 mA
-
318 mA
-
350 mA
-
36 mA
-
364 mA
-
380 mA
-
4 mA
-
40 mA
-
400 mA
-
41 mA
-
410 mA
-
416 mA
-
43 mA
-
435 mA
-
44 mA
-
45 mA
-
49 mA
-
511 mA
-
52 mA
-
528 mA
-
53 mA
-
570 mA
-
60 mA
-
62 mA
-
64 mA
-
65 mA
-
72 mA
-
73 mA
-
74 mA
-
750 mA
-
78 mA
-
80 mA
-
800 mA
-
830 mA
-
850 mA
-
90 mA
-
900 mA
-
95 mA
Nominal Supply Voltage
-
1 V
-
1.2 V
-
1.5 V
-
1.6 V
-
1.8 V
-
2.5 V
-
3 V
-
3.3 V
-
5 V
-
6 V
-
8 V
Power Supplies (V)
-
-4.5
-
-5
-
-5.2
-
1.5,3.3
-
1.6/3.3
-
1.8
-
1.8,3.3
-
2.5
-
2/3.5
-
3.3
-
3.3,3.3/5
-
3.3,5
-
3.3,5,-4.5
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3.3/5
-
3/3.3
-
3/5
-
5
-
5,-4.5
-
5/-5.2
Package Style (Meter)
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CHIP CARRIER
-
CHIP CARRIER, HEAT SINK/SLUG
-
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
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CHIP CARRIER, VERY THIN PROFILE
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FIBER OPTIC
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FLANGE MOUNT
-
FLATPACK
-
FLATPACK, FINE PITCH
-
FLATPACK, HEAT SINK/SLUG
-
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
-
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
-
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
-
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
-
FLATPACK, LOW PROFILE
-
FLATPACK, LOW PROFILE, FINE PITCH
-
FLATPACK, THIN PROFILE, FINE PITCH
-
GRID ARRAY
-
GRID ARRAY, FINE PITCH
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GRID ARRAY, HEAT SINK/SLUG
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GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
-
GRID ARRAY, LOW PROFILE
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GRID ARRAY, LOW PROFILE, FINE PITCH
-
GRID ARRAY, THIN PROFILE, FINE PITCH
-
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
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MICROELECTRONIC ASSEMBLY
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SMALL OUTLINE
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SMALL OUTLINE, SHRINK PITCH
-
SMALL OUTLINE, THIN PROFILE
-
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
-
SMALL OUTLINE, VERY THIN PROFILE
-
UNCASED CHIP
Package Equivalence Code
-
BGA100,10X10,32
-
BGA100,10X10,40
-
BGA1152,34X34,50
-
BGA144(UNSPEC)
-
BGA144,12X12,32
-
BGA144,12X12,40
-
BGA186,16X16,40
-
BGA195,14X14,40
-
BGA244(UNSPEC)
-
BGA256,16X16,40
-
BGA256,20X20,50
-
BGA272,20X20,50
-
BGA304,22X22,32
-
BGA352,26X26,50
-
BGA388,26X26,50
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BGA400,20X20,50
-
BGA456,26X26,50
-
BGA520,31X31,50
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BGA576,30X30,50
-
BGA64,8X8,40
-
BGA700,34X34,40
-
BGA792,39X39,40
-
BGA81,9X9,40
-
BGA909,34X34,40
-
DIE OR CHIP
-
HQFP100,.63SQ,20
-
LCC16,.12SQ,20
-
LCC16,.16SQ,25
-
LCC20,.16SQ,20
-
LCC24,.16SQ,20
-
LCC32,.16SQ,16
-
LCC32,.2SQ,20
-
LCC36,.25SQ,20
-
LCC44,.28SQ,20
-
LCC48,.27SQ,20
-
LCC48,.28SQ,20
-
LCC56,.31SQ,20
-
LCC64,.35SQ,20
-
LCC68,.31SQ,16
-
LCC68,.4SQ,20
-
LCC72,.39SQ,20
-
LDCC28(UNSPEC)
-
LDCC52,.8SQ
-
LDCC84,1.2SQ
-
LGA80,20X20,20
-
QFP100,.63SQ,20
-
QFP120,.63SQ,16
-
QFP128,.64SQ,16
-
QFP144,.87SQ,20
-
QFP144,1.2SQ
-
QFP160,1.0SQ,20
-
QFP160,1.2SQ
-
QFP176,1.0SQ,20
-
QFP208,1.2SQ,20
-
QFP240,1.3SQ,20
-
QFP256,1.2SQ,16
-
QFP304,1.7SQ,20
-
QFP32,.28SQ,20
-
QFP32,.35SQ,32
-
QFP44,.47SQ,32
-
QFP44,.5SQ,32
-
QFP48,.35SQ,20
-
QFP64,.47SQ,20
-
QFP64,.51SQ,20
-
QFP64,.66SQ,32
-
QFP80,.55SQ,20
-
QFP80,.6SQ
-
SIP12,.1
-
SOLCC4,.05,25
-
SOP16,.25
-
SOP20,.4
-
SOP24,.4
-
SOP28,.5
-
SOP8,.25
-
SPQFP64,.48SQ,20
-
SSOP16,.25
-
SSOP20,.25
-
SSOP24,.3
-
SSOP28,.3
-
TQFP100,.63SQ
-
TQFP32,.28SQ
-
TQFP32,.35SQ,32
-
TQFP48,.35SQ
-
TQFP64,.47SQ
-
TSOP5/6,.11,37
-
TSSOP10,.19,20
-
TSSOP16,.25
-
TSSOP20,.25
-
TSSOP28,.25
-
TSSOP48,.3,20
-
TSSOP8,.19
Sub-Category
-
ATM/SONET/SDH ICs
-
Digital Transmission Interfaces
-
Other Telecom ICs
Terminal Pitch
-
.4 mm
-
.5 mm
-
.635 mm
-
.64 mm
-
.65 mm
-
.762 mm
-
.8 mm
-
.95 mm
-
1 mm
-
1.27 mm
-
2.54 mm
Maximum Operating Temperature
-
100 Cel
-
105 Cel
-
125 Cel
-
50 Cel
-
65 Cel
-
70 Cel
-
80 Cel
-
85 Cel
-
90 Cel
-
95 Cel
Minimum Operating Temperature
-
-10 Cel
-
-20 Cel
-
-25 Cel
-
-30 Cel
-
-40 Cel
-
-45 Cel
-
-5 Cel
-
-55 Cel
-
0 Cel
Terminal Finish
-
GOLD OVER NICKEL
-
MATTE TIN
-
Matte Tin (Sn)
-
Matte Tin (Sn) - annealed
-
NICKEL GOLD PALLADIUM
-
NICKEL PALLADIUM GOLD
-
Nickel/Palladium/Gold (Ni/Pd/Au)
-
TIN
-
TIN BISMUTH
-
TIN LEAD
-
TIN SILVER COPPER
-
Tin (Sn)
-
Tin/Lead (Sn/Pb)
-
Tin/Lead (Sn63Pb37)
-
Tin/Lead (Sn85Pb15)
-
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position
-
BOTTOM
-
DUAL
-
QUAD
-
SINGLE
-
UNSPECIFIED
-
UPPER
Data Rate
-
1000 Mbps
JESD-30 Code
-
R-MDFO-G16
-
R-MDFO-T4
-
R-MDFO-T6
-
R-PDFO-P
-
R-PDSO-G10
-
R-PDSO-G16
-
R-PDSO-G20
-
R-PDSO-G24
-
R-PDSO-G28
-
R-PDSO-G48
-
R-PDSO-G5
-
R-PDSO-G8
-
R-PDSO-N4
-
R-PQCC-N48
-
R-PQFP-G128
-
R-PQFP-G24
-
R-XDFO-F14
-
R-XDFO-F8
-
R-XDFO-G12
-
R-XDFO-G14
-
R-XDFO-P14
-
R-XDFO-P20
-
R-XDFO-T28
-
R-XDFO-T4
-
R-XDFO-T8
-
R-XDFO-X
-
R-XDMA-P18
-
R-XQCC-N44
-
R-XQCC-N56
-
R-XQMA-N8
-
R-XQMA-X10
-
R-XSFO-F13
-
R-XSFO-F7
-
R-XSFO-P6
-
R-XSMA-P9
-
R-XSMA-T9
-
R-XUUC-N
-
R-XUUC-N17
-
R-XUUC-N18
-
R-XUUC-N19
-
R-XUUC-N20
-
R-XUUC-N21
-
R-XUUC-N22
-
R-XUUC-N25
-
R-XUUC-N26
-
R-XUUC-N33
-
R-XUUC-N34
-
R-XUUC-N36
-
R-XUUC-N42
-
R-XUUC-N44
-
R-XUUC-N48
-
R-XUUC-N49
-
R-XUUC-N6
-
R-XUUC-N7
-
R-XUUC-N9
-
R-XXFO-G72
-
R-XXFO-P20
-
R-XXFO-P22
-
R-XXFO-P24
-
R-XXFO-P26
-
R-XXFO-P28
-
R-XXFO-P40
-
R-XXFO-X
-
R-XXFO-X18
-
R-XXFO-X9
-
R-XXMA-X
-
S-CBGA-B177
-
S-CBGA-B198
-
S-CQCC-N16
-
S-CQCC-N20
-
S-CQCC-N32
-
S-CQCC-N36
-
S-GQCC-J52
-
S-GQFP-G16
-
S-MQFP-G208
-
S-PBCC-B32
-
S-PBGA-B
-
S-PBGA-B100
-
S-PBGA-B1152
-
S-PBGA-B127
-
S-PBGA-B143
-
S-PBGA-B144
-
S-PBGA-B1605
-
S-PBGA-B1724
-
S-PBGA-B177
-
S-PBGA-B186
-
S-PBGA-B195
-
S-PBGA-B196
-
S-PBGA-B208
-
S-PBGA-B244
-
S-PBGA-B256
-
S-PBGA-B272
-
S-PBGA-B289
-
S-PBGA-B301
-
S-PBGA-B304
-
S-PBGA-B342
-
S-PBGA-B352
-
S-PBGA-B388
-
S-PBGA-B400
-
S-PBGA-B456
-
S-PBGA-B500
-
S-PBGA-B520
-
S-PBGA-B576
-
S-PBGA-B580
-
S-PBGA-B600
-
S-PBGA-B64
-
S-PBGA-B676
-
S-PBGA-B680
-
S-PBGA-B700
-
S-PBGA-B792
-
S-PBGA-B81
-
S-PBGA-B896
-
S-PBGA-B909
-
S-PDSO-G10
-
S-PDSO-G8
-
S-PDSO-N10
-
S-PQCC-J84
-
S-PQCC-N16
-
S-PQCC-N20
-
S-PQCC-N24
-
S-PQCC-N28
-
S-PQCC-N32
-
S-PQCC-N40
-
S-PQCC-N44
-
S-PQCC-N48
-
S-PQCC-N72
-
S-PQFP-G100
-
S-PQFP-G120
-
S-PQFP-G128
-
S-PQFP-G144
-
S-PQFP-G160
-
S-PQFP-G176
-
S-PQFP-G208
-
S-PQFP-G240
-
S-PQFP-G304
-
S-PQFP-G32
-
S-PQFP-G44
-
S-PQFP-G48
-
S-PQFP-G64
-
S-PQFP-G68
-
S-PQFP-G80
-
S-XBGA-N80
-
S-XQCC-J52
-
S-XQCC-N16
-
S-XQCC-N20
-
S-XQCC-N24
-
S-XQCC-N32
-
S-XQCC-N36
-
S-XQCC-N40
-
S-XQCC-N44
-
S-XQCC-N48
-
S-XQCC-N56
-
S-XQCC-N64
-
S-XQCC-N68
-
S-XQCC-N72
-
S-XQFP-G24
-
S-XQFP-G32
-
S-XUUC-N14
-
S-XUUC-N18
-
S-XUUC-N21
-
S-XUUC-N29
-
S-XUUC-N32
-
S-XUUC-N34
-
S-XUUC-N36
-
S-XUUC-N48
-
X-PQFP-G304
-
X-XUUC-N16
-
X-XUUC-N22
-
X-XUUC-N23
-
X-XUUC-N26
-
X-XUUC-N32
-
X-XXFM-X4
-
X-XXFO-X
-
X-XXFO-X4
-
X-XXMA-X37
Moisture Sensitivity Level (MSL)
-
1
-
2
-
2A
-
3
Maximum Seated Height
-
.8 mm
-
.9 mm
-
.95 mm
-
1 mm
-
1.1 mm
-
1.12 mm
-
1.2 mm
-
1.26 mm
-
1.31 mm
-
1.3716 mm
-
1.47 mm
-
1.48 mm
-
1.5 mm
-
1.56 mm
-
1.58 mm
-
1.6 mm
-
1.62 mm
-
1.66 mm
-
1.67 mm
-
1.7 mm
-
1.72 mm
-
1.73 mm
-
1.74 mm
-
1.75 mm
-
1.77 mm
-
1.885 mm
-
1.95 mm
-
1.961 mm
-
1.99 mm
-
2.06 mm
-
2.0828 mm
-
2.12 mm
-
2.13 mm
-
2.32 mm
-
2.388 mm
-
2.41 mm
-
2.49 mm
-
2.5 mm
-
2.51 mm
-
2.54 mm
-
2.78 mm
-
2.8 mm
-
2.8194 mm
-
2.834 mm
-
2.85 mm
-
3 mm
-
3.05 mm
-
3.1 mm
-
3.22 mm
-
3.42 mm
-
3.5 mm
-
3.8 mm
-
4.07 mm
-
4.1 mm
-
4.2 mm
-
4.3 mm
-
4.3942 mm
-
4.45 mm
-
4.57 mm
-
5.08 mm
Width
-
.68 mm
-
.87 mm
-
.94 mm
-
1.45 mm
-
10 mm
-
10.0075 mm
-
11 mm
-
12 mm
-
13 mm
-
13.89 mm
-
14 mm
-
15 mm
-
17 mm
-
18.935 mm
-
19 mm
-
20 mm
-
24 mm
-
27 mm
-
28 mm
-
29.3116 mm
-
29.972 mm
-
3 mm
-
3.9 mm
-
32 mm
-
32.2 mm
-
35 mm
-
4 mm
-
4.4 mm
-
40 mm
-
42.5 mm
-
45 mm
-
5 mm
-
5.29 mm
-
5.842 mm
-
6 mm
-
6.1 mm
-
6.9596 mm
-
7 mm
-
7.5 mm
-
8 mm
-
8.99 mm
-
9 mm
Qualification
-
Not Qualified
Additional Features
-
Data rate is 11.3 Gbps
-
Data rate is 28 Gbps
-
ESD for RSSI_IB and RSSI_EB is 1C, for input IN is 1B
JESD-609 Code
-
e0
-
e1
-
e3
-
e4
-
e6
Maximum Time At Peak Reflow Temperature (s)
-
10
-
20
-
30
-
40
-
NOT SPECIFIED
Peak Reflow Temperature (C)
-
225
-
235
-
240
-
245
-
250
-
255
-
260
-
NOT SPECIFIED
Length
-
1.036 mm
-
1.14 mm
-
1.195 mm
-
10 mm
-
10.0075 mm
-
10.2 mm
-
11 mm
-
12 mm
-
12.5 mm
-
13 mm
-
14 mm
-
15 mm
-
17 mm
-
17.9 mm
-
18.935 mm
-
19 mm
-
19.86 mm
-
20 mm
-
24 mm
-
27 mm
-
28 mm
-
29.3116 mm
-
29.972 mm
-
3 mm
-
3.25 mm
-
32 mm
-
32.2 mm
-
35 mm
-
4 mm
-
4.9 mm
-
40 mm
-
42.5 mm
-
45 mm
-
5 mm
-
5.842 mm
-
6 mm
-
6.5 mm
-
7 mm
-
8 mm
-
8.2 mm
-
8.4328 mm
-
8.65 mm
-
8.99 mm
-
9 mm
-
9.9 mm
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
ATM/SONET/SDH TRANSMITTER |
COMMERCIAL EXTENDED |
GULL WING |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
FIBER OPTIC |
80 Cel |
0 Cel |
UNSPECIFIED |
R-XXFO-G72 |
Not Qualified |
||||||||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH RECEIVER |
COMMERCIAL EXTENDED |
GULL WING |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
FIBER OPTIC |
80 Cel |
0 Cel |
UNSPECIFIED |
R-XXFO-G72 |
Not Qualified |
||||||||||||||||||||||
|
Renesas Electronics |
ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE |
COMMERCIAL EXTENDED |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
5 V |
5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
80 Cel |
0 Cel |
TIN BISMUTH |
QUAD |
S-PQFP-G208 |
3 |
3.8 mm |
28 mm |
Not Qualified |
e6 |
10 |
250 |
28 mm |
ATM/SONET/SDH Circuits
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.