BUTT ATM/SONET/SDH Circuits 10

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Nominal Negative Supply Voltage	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SI5040-D-GMR	Silicon Labs	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BUTT	32	VBCC		UNSPECIFIED	SDH; SONET	YES	1		1.8 V	CHIP CARRIER	.5 mm	95 Cel	-40 Cel	BOTTOM			.95 mm	5 mm	Not Qualified	NOT SPECIFIED	NOT SPECIFIED	5 mm
SI5040-D-GM	Silicon Labs	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BUTT	32	VBCC		UNSPECIFIED	SDH; SONET	YES	1		1.8 V	CHIP CARRIER	.5 mm	95 Cel	-40 Cel	BOTTOM		3	.95 mm	5 mm	Not Qualified	40	260	5 mm
TZA3014V	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	-3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified			5 mm
TZA3014VH	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified			5 mm
TZA3019AVH	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified			5 mm
TZA3019CVH	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified			5 mm
TZA3019CV	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	-3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified			5 mm
TZA3019BVH	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified			5 mm
TZA3019AV	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	-3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified			5 mm
TZA3019BV	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	-3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified			5 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.