Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Broadcom |
ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
METAL |
YES |
CMOS |
5 V |
5 |
FLATPACK |
QFP208,1.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-MQFP-G208 |
Not Qualified |
e0 |
|||||||||||||||
Broadcom |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G128 |
13.89 mm |
Not Qualified |
e0 |
30 |
225 |
19.86 mm |
|||||||||||||
Broadcom |
ATM/SONET/SDH RECEIVER |
GULL WING |
14 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
-5.2 V |
5 V |
FIBER OPTIC |
TIN LEAD |
DUAL |
R-XDFO-G14 |
Not Qualified |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
Broadcom |
ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
METAL |
YES |
CMOS |
5 V |
5 |
FLATPACK |
QFP208,1.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-MQFP-G208 |
Not Qualified |
e0 |
|||||||||||||||
Broadcom |
ATM/SONET/SDH SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
LQFP |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
1 |
FLATPACK, LOW PROFILE |
.762 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-GQFP-G16 |
1.3716 mm |
5.842 mm |
Not Qualified |
e0 |
30 |
240 |
5.842 mm |
||||||||||||||
Broadcom |
ATM/SONET/SDH RECEIVER |
GULL WING |
14 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
-5.2 V |
5 V |
FIBER OPTIC |
TIN LEAD |
DUAL |
R-XDFO-G14 |
Not Qualified |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
Broadcom |
ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE |
GULL WING |
240 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1040 mA |
3.3 V |
3.3 |
FLATPACK |
QFP240,1.3SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
QUAD |
S-PQFP-G240 |
Not Qualified |
|||||||||||||||||||
Broadcom |
ATM/SONET/SDH SUPPORT CIRCUIT |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5.2 V |
FLATPACK |
.65 mm |
TIN LEAD |
QUAD |
S-PQFP-G32 |
Not Qualified |
e0 |
30 |
240 |
|||||||||||||||||||
Broadcom |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G128 |
13.89 mm |
Not Qualified |
e0 |
30 |
225 |
19.86 mm |
|||||||||||||
Broadcom |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
COMMERCIAL |
GULL WING |
68 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G68 |
4.3942 mm |
29.972 mm |
Not Qualified |
e0 |
30 |
225 |
29.972 mm |
|||||||||||||
Broadcom |
ATM/SONET/SDH RECEIVER |
COMMERCIAL |
GULL WING |
14 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
-5.2 V |
FIBER OPTIC |
65 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-XDFO-G14 |
Not Qualified |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||
Broadcom |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
COMMERCIAL |
GULL WING |
68 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G68 |
4.3942 mm |
29.972 mm |
Not Qualified |
e0 |
30 |
225 |
29.972 mm |
|||||||||||||
Broadcom |
ATM/SONET/SDH RECEIVER |
GULL WING |
16 |
RECTANGULAR |
METAL |
YES |
1 |
6 V |
FIBER OPTIC |
TIN LEAD |
DUAL |
R-MDFO-G16 |
Not Qualified |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||
Broadcom |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
COMMERCIAL |
GULL WING |
68 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G68 |
4.3942 mm |
29.972 mm |
Not Qualified |
e0 |
30 |
225 |
29.972 mm |
|||||||||||||
Broadcom |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
400 mA |
3.3 V |
3.3 |
FLATPACK |
QFP64,.51SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
Not Qualified |
|||||||||||||||||
Broadcom |
ATM/SONET/SDH RECEIVER |
GULL WING |
14 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
-5.2 V |
5 V |
FIBER OPTIC |
TIN LEAD |
DUAL |
R-XDFO-G14 |
Not Qualified |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
Broadcom |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
1.8 V |
FLATPACK |
.65 mm |
85 Cel |
0 Cel |
QUAD |
S-PQFP-G160 |
4.1 mm |
28 mm |
Not Qualified |
28 mm |
|||||||||||||||
Broadcom |
ATM/SONET/SDH SUPPORT CIRCUIT |
GULL WING |
24 |
QFP |
SQUARE |
UNSPECIFIED |
YES |
1 |
-5.2 V |
FLATPACK |
.8 mm |
TIN LEAD |
QUAD |
S-XQFP-G24 |
2.0828 mm |
7 mm |
Not Qualified |
e0 |
30 |
240 |
7 mm |
||||||||||||||||
Broadcom |
ATM/SONET/SDH RECEIVER |
GULL WING |
16 |
RECTANGULAR |
METAL |
YES |
1 |
6 V |
FIBER OPTIC |
TIN LEAD |
DUAL |
R-MDFO-G16 |
Not Qualified |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||
Broadcom |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
GULL WING |
24 |
HQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
-5.2 V |
FLATPACK, HEAT SINK/SLUG |
.8 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G24 |
6.9596 mm |
Not Qualified |
e0 |
30 |
240 |
8.4328 mm |
||||||||||||||
Broadcom |
ATM/SONET/SDH RECEIVER |
INDUSTRIAL |
GULL WING |
14 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
-5.2 V |
5 V |
FIBER OPTIC |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDFO-G14 |
Not Qualified |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Broadcom |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
OTHER |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
80 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G48 |
1.2 mm |
7 mm |
Not Qualified |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||||||
Broadcom |
ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
750 mA |
5 V |
5 |
FLATPACK |
QFP208,1.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
50 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G208 |
Not Qualified |
e0 |
|||||||||||||||
Broadcom |
ATM/SONET/SDH TRANSCEIVER |
GULL WING |
128 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK |
QUAD |
R-PQFP-G128 |
Not Qualified |
|||||||||||||||||||||||
Broadcom |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G128 |
13.89 mm |
Not Qualified |
e0 |
30 |
225 |
19.86 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.