Texas Instruments ATM/SONET/SDH Circuits 161
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
40 mA |
3.3 V |
UNCASED CHIP |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N |
.87 mm |
Data rate is 11.3 Gbps |
1.036 mm |
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|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.049 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
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|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.064 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
ATM/SONET/SDH ICs |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
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|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
14 mm |
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|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
COMMERCIAL |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
BICMOS |
180 mA |
5 V |
5 |
FLATPACK |
QFP144,1.2SQ |
ATM/SONET/SDH ICs |
.65 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G144 |
4.1 mm |
28 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
28 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
64 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
ATM/SONET/SDH ICs |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
45 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.04 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
175 mA |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J84 |
4.57 mm |
29.3116 mm |
Not Qualified |
29.3116 mm |
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|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
14 mm |
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|
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
|||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
14 mm |
||||||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE |
COMMERCIAL |
GULL WING |
240 |
QFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
5 V |
FLATPACK |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G240 |
Not Qualified |
||||||||||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-PQCC-N20 |
1 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
1.8 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B289 |
Not Qualified |
|||||||||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.028 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
BICMOS |
180 mA |
5 V |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G144 |
1.6 mm |
20 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
5 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G160 |
4.1 mm |
28 mm |
Not Qualified |
28 mm |
||||||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.049 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
NO LEAD |
19 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
44 mA |
3.3 V |
UNCASED CHIP |
DIE OR CHIP |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N19 |
.94 mm |
ESD for RSSI_IB and RSSI_EB is 1C, for input IN is 1B |
1.195 mm |
||||||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.04 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
19 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
44 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N19 |
.94 mm |
Not Qualified |
Data rate is 11.3 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
1.195 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
19 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
44 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N19 |
.94 mm |
Not Qualified |
Data rate is 11.3 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
1.195 mm |
||||||||||
|
Texas Instruments |
ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE |
COMMERCIAL |
GULL WING |
240 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
5 V |
5 |
FLATPACK, FINE PITCH |
QFP240,1.3SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G240 |
4.2 mm |
32 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
32 mm |
|||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
100 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N16 |
1 |
1 mm |
3 mm |
e4 |
NOT SPECIFIED |
260 |
3 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.04 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
3 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
3.3 V |
3.3,5 |
FLATPACK |
QFP160,1.2SQ |
ATM/SONET/SDH ICs |
.65 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G160 |
4.1 mm |
28 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
28 mm |
|||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
BICMOS |
255 mA |
5 V |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G144 |
1.6 mm |
20 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
266 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
Texas Instruments |
INDUSTRIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 V |
5 |
FLATPACK |
QFP160,1.2SQ |
ATM/SONET/SDH ICs |
.635 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G160 |
Not Qualified |
|||||||||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
19 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
44 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N19 |
.94 mm |
Not Qualified |
Data rate is 11.3 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
1.195 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.04 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
1 mm |
3 mm |
Not Qualified |
e4 |
3 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
18 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
.07 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
85 Cel |
-25 Cel |
UPPER |
R-XUUC-N18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
45 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||
|
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
200 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
e4 |
30 |
260 |
14 mm |
||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
5 V |
5 |
FLATPACK |
QFP100,.63SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
52 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N16 |
2 |
1 mm |
3 mm |
e4 |
NOT SPECIFIED |
260 |
3 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.