12 Cellphone ICs 22

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SKY66105-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	12	HVQCCN	RECTANGULAR		YES	1				3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			85 Cel	-40 Cel		QUAD	R-XQCC-N12		1.15 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
LMH9226IRRLR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		100 mA	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC12,.08SQ,20	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N12	2	.8 mm	2 mm		e4	30	260	2 mm
LMH9126IRRLR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG			105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-XQCC-N12	2				e4	30	260
MAX2387EGC+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e3			3 mm
MC13770FC	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		2.75 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N12		1 mm	3 mm					3 mm
MAX2389EGC	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e0			3 mm
MAX2388ETC+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N12	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX2388EGC+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX2387EGC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e0			3 mm
MAX2388ETC+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N12	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX2389EGC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e0			3 mm
MAX2388EGC+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX2388EGC	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e0			3 mm
MAX2387EGC	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e0			3 mm
MAX2388EGC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e0			3 mm
MAX2307EBC	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	e0			2.02 mm
MAX2307EBC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified				2.02 mm
ALM-2412-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V	CHIP CARRIER		2 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B12	3	1.2 mm	2.5 mm	Not Qualified			260	3.3 mm
ALM-2412-BLKG	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V	CHIP CARRIER		2 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B12	3	1.2 mm	2.5 mm	Not Qualified			260	3.3 mm
ALM-2712-SG1G	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER		1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified			260	3 mm
ALM-2712-TR1G	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER		1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified			260	3 mm
ALM-2712-BLKG	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	CHIP CARRIER		1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified			260	3 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.