14 Cellphone ICs 17

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SKY13524-639LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	90 Cel	-30 Cel		QUAD	S-XQCC-N14		.5 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
SX8652IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N14	2	.8 mm	3 mm	Not Qualified	e3		260	4 mm
SKY13526-485LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HQCCN	SQUARE	UNSPECIFIED	YES	1		2.85 V	CHIP CARRIER, HEAT SINK/SLUG		90 Cel	-30 Cel		QUAD	S-XQCC-N14		.6 mm	2 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
SX8653IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N14		.8 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
TRF4000PWP	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	80 Cel	-30 Cel		DUAL	R-PDSO-G14		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MD7IC2250GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES	1		28 V	FLANGE MOUNT				TIN	DUAL	R-PDFM-G14	3			Not Qualified	e3	40	260
MD7IC2250NBR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		THROUGH-HOLE	14		RECTANGULAR	PLASTIC/EPOXY	NO	1		28 V	FLANGE MOUNT				TIN	DUAL	R-PDFM-T14	3			Not Qualified	e3	40	260
MD7IC2250NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		THROUGH-HOLE	14		RECTANGULAR	PLASTIC/EPOXY	NO	1		28 V	FLANGE MOUNT				MATTE TIN	DUAL	R-PDFM-T14	3			Not Qualified	e3
HFA3600IB	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V	SMALL OUTLINE	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
ACPM-7355-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR	3.4 V	MICROELECTRONIC ASSEMBLY	.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1.05 mm	4 mm				260	5 mm
ACPM-5252-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACPM-7353-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR	3.4 V	MICROELECTRONIC ASSEMBLY	.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1 mm	4 mm				260	5 mm
ACPM-5252-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACPM-7353-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR	3.4 V	MICROELECTRONIC ASSEMBLY	.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1 mm	4 mm				260	5 mm
ACPM-5281-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACPM-5281-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACPM-7355-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR	3.4 V	MICROELECTRONIC ASSEMBLY	.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1.05 mm	4 mm				260	5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.