196 Cellphone ICs 12

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ISL5216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
AD6688BBPZ-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.53 mm	12 mm			30	260	12 mm
AD6688BBPZRL-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.53 mm	12 mm			30	260	12 mm
AD6634XBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel		BOTTOM	S-PBGA-B196			15 mm	Not Qualified				15 mm
AD6634BBC	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA196,14X14,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3		15 mm	Not Qualified	e0		240	15 mm
AD6634BBCZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3		15 mm	Not Qualified	e1		260	15 mm
ISL5216KI-1Z	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
ISL5216KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		700 mA	2.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	12 mm		e0			12 mm
ISL5217KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
HSP50216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	12 mm	Not Qualified	e1			12 mm
ISL5216KI-1	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		700 mA	2.5 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm
ISL5217KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.