32 Cellphone ICs 103

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Resolution (um) Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Width Qualification Companding Law Input Type Additional Features Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

AT86RF233-ZU

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

1.8,3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

e3

5 mm

CC1101QRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

AT86RF233-ZUR

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

1.8,3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

e3

5 mm

CC1020RSSR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.1536 Mbps

S-XQCC-N32

3

1 mm

7 mm

Not Qualified

e4

NOT SPECIFIED

260

7 mm

AT86RF231-ZF

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

1.8,3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

e3

5 mm

AT86RF233-ZF

Microchip Technology

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1 mm

5 mm

e3

5 mm

AT86RF233-ZFR

Microchip Technology

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1 mm

5 mm

e3

5 mm

LTC5594IUH#PBF

Analog Devices

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

.8 mm

5 mm

e3

260

5 mm

AD6672BCPZ-250

Analog Devices

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.145 mA

1.8 V

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

AD6672BCPZRL7-250

Analog Devices

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.145 mA

1.8 V

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

LMH6521SQE/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2

245 mA

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

26 dB

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

e3

30

260

5 mm

LMH6521SQX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2

245 mA

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

26 dB

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

e3

30

260

5 mm

MC13202FCR2

NXP Semiconductors

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQCC-N32

3

1 mm

5 mm

Not Qualified

e3

40

260

5 mm

AT86RF231-ZU

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

1.8,3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

e3

5 mm

LMH6521SQX

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

VQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

5 mm

LMH6521SQ

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

VQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

5 mm

LMH6521SQE

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

VQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

5 mm

LMH6521SQ/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2

245 mA

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

26 dB

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

e3

30

260

5 mm

CC1131QRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC1020RUZR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1131IRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC1131TRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC1020RSST

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.1536 Mbps

S-PQCC-N32

3

1 mm

7 mm

e4

30

260

7 mm

CC1021-RTB1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1020-RTR1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1021RSSR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.1536 Mbps

S-XQCC-N32

3

1 mm

7 mm

Not Qualified

e4

NOT SPECIFIED

260

7 mm

CC1020-RTB1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1151TRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC1021RUZ

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1020RSS

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1151QRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC1021-RTR1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1151IRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC1020RSSG4

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N32

1 mm

7 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7 mm

CC1021RSS

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1021RSST

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.1536 Mbps

S-PQCC-N32

3

1 mm

7 mm

e4

30

260

7 mm

CC1021RUZR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1020RUZ

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1021RSSRG4

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

3

1.05 mm

7 mm

e4

30

260

7 mm

CC1101IRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC1101TRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

HMC900LP5ETR

Analog Devices

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

AD8366ACPZ-R7

Analog Devices

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

2

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

HMC993LP5E

Analog Devices

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, VERY THIN PROFILE

1 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

1 mm

5 mm

e3

260

5 mm

HMC900LP5E

Analog Devices

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e3

5 mm

LTC5594IUH#TRPBF

Analog Devices

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

.8 mm

5 mm

e3

260

5 mm

MAX2046ETJ+

Analog Devices

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

HMC627ALP5E

Analog Devices

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.