56 Cellphone ICs 9

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SKY58081-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		3200 mA	3.4 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.23X.3,17	.44 mm	110 Cel	-40 Cel		QUAD	R-PQCC-N56		.7 mm	6 mm					7.6 mm
ADRF6650ACPZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
ADRF6650ACPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX2550ETN+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		390 mA	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.30SQ,16	.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N56	1	.8 mm	7 mm		e3	30	260	7 mm
STA8089FGTR	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.9 mm	7 mm		e3	30	260	7 mm
STA8089FGB	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.9 mm	7 mm		e3	30	260	7 mm
STA8089FGBTR	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.9 mm	7 mm		e3	30	260	7 mm
STA8089FG	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.9 mm	7 mm		e3		260	7 mm
HD155131TF	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	56	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				FLATPACK			75 Cel	-20 Cel		QUAD	R-PQFP-G56				Not Qualified

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.