BGA Cellphone ICs 27

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD6636BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e1		260	17 mm
AD6636BBC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm				240	17 mm
GC5016-PBZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	252	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B252	3	2.02 mm	17 mm	Not Qualified	e1	30	260	17 mm
GC5018IZDL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	305	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B305	3	2.02 mm	19 mm	Not Qualified	e1	30	260	19 mm
GC5016-PB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	252	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B252	3	2.02 mm	17 mm	Not Qualified	e0	20	220	17 mm
GC5318IZED	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B388	3	2.5 mm	27 mm	Not Qualified	e1	30	260	27 mm
CC1000_UCSP/T&R	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	GRID ARRAY	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B28		1.2 mm	2.339 mm	Not Qualified				4.034 mm
AD6654BBCZ	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e1		260	17 mm
AD6650BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B121	3	1.85 mm	12 mm	Not Qualified	e1			12 mm
AD6634XBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel		BOTTOM	S-PBGA-B196			15 mm	Not Qualified				15 mm
AD6635XBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel		BOTTOM	S-PBGA-B324			19 mm	Not Qualified				19 mm
AD6634BBC	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA196,14X14,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3		15 mm	Not Qualified	e0		240	15 mm
AD6635BBC	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B324		3.5 mm	19 mm	Not Qualified	e0			19 mm
AD6654CBCZ	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e1		260	17 mm
AD6636CBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e1		260	17 mm
AD6654BBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e0		240	17 mm
AD6650BBC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B121	3	1.85 mm	12 mm	Not Qualified	e0			12 mm
AD6635BBZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B324		3.5 mm	19 mm	Not Qualified	e1			19 mm
AD6650ABC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B121	3	1.85 mm	12 mm	Not Qualified	e0		240	12 mm
AD6635BB	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B324	3	3.5 mm	19 mm	Not Qualified	e0		225	19 mm
AD6650ABCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B121		1.85 mm	12 mm	Not Qualified	e1			12 mm
AD6634BBCZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3		15 mm	Not Qualified	e1		260	15 mm
AD6636CBC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm				240	17 mm
AD6654CBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e0		240	17 mm
BGS8H2UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		7 mA	1.8 V		GRID ARRAY			.26 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.31 mm	.44 mm					.69 mm
F5280AVGK	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	49	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				GRID ARRAY				105 Cel	-40 Cel	Tin (Sn)	BOTTOM	S-PBGA-B49	3				e3	NOT SPECIFIED	260
F5280AVGK8	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	49	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				GRID ARRAY				105 Cel	-40 Cel	Tin (Sn)	BOTTOM	S-PBGA-B49	3				e3	NOT SPECIFIED	260

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.