DIP Cellphone ICs 17

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Position	JESD-30 Code	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
1605C	Murata Manufacturing	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	UNSPECIFIED	NO	1					IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	R-XDIP-T16	6.84 mm		7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	22.5 mm
TCM320AC56CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0099 mA	5 V	5	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel	0 Cel	1 dB	DUAL	R-PDIP-T20	5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW	NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV320AC56IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel	-40 Cel	1 dB	DUAL	R-PDIP-T20	5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW	NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TCM320AC56N	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T20	5.08 mm		7.62 mm	Not Qualified				24.325 mm
TLV321AC36IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		3 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T20	5.08 mm		7.62 mm	Not Qualified				24.325 mm
TLV320AC57N	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			3 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T20	5.08 mm		7.62 mm	Not Qualified				24.325 mm
TCM320AC56IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0099 mA	5 V	5	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel	-40 Cel	1 dB	DUAL	R-PDIP-T20	5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW	NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV321AC37CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		3 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	R-PDIP-T20	5.08 mm		7.62 mm	Not Qualified				24.325 mm
TCM320AC57N	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T20	5.08 mm		7.62 mm	Not Qualified				24.325 mm
TCM320AC57IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0099 mA	5 V	5	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel	-40 Cel	1 dB	DUAL	R-PDIP-T20	5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW	NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV320AC56N	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			3 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T20	5.08 mm		7.62 mm	Not Qualified				24.325 mm
TCM320AC57CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0099 mA	5 V	5	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel	0 Cel	1 dB	DUAL	R-PDIP-T20	5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW	NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV320AC57IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel	-40 Cel	1 dB	DUAL	R-PDIP-T20	5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW	NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV320AC57CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel	0 Cel	1 dB	DUAL	R-PDIP-T20	5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW	NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV320AC56CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel	0 Cel	1 dB	DUAL	R-PDIP-T20	5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW	NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV321AC36CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		3 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	R-PDIP-T20	5.08 mm		7.62 mm	Not Qualified				24.325 mm
TLV321AC37IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		3 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T20	5.08 mm		7.62 mm	Not Qualified				24.325 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.