HTSSOP Cellphone ICs 10

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TRF4000PWP	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	80 Cel	-30 Cel		DUAL	R-PDSO-G14		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
HMC485MS8G	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1		5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0		235	3 mm
HMC485MS8GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1		5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3		260	3 mm
MAX2055EUP+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	6.5 mm
MAX2055EUP+TD	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	6.5 mm
MAX2055EUP+D	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	6.5 mm
MRFIC1854AR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm					6.5 mm
MRFIC0954R2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm					6.5 mm
MAX2055EUP-D	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm
MAX2055EUP-TD	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.