HVQCCN Cellphone ICs 737

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Maximum Output Voltage	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC1110F32RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD		QUAD		S-XQCC-N36		3	.9 mm	6 mm	Not Qualified			e4	30	260	6 mm
CC2511F32RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		S-XQCC-N36		3	.9 mm	6 mm	Not Qualified			e4	NOT SPECIFIED	260	6 mm
HMC602LP4E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-PQCC-N24		1	1 mm	4 mm	Not Qualified			e3	30	260	4 mm
HMC702LP6CE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-PQCC-N40		1	.9 mm	6 mm	Not Qualified			e3			6 mm
LMH6521SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		2		245 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	26 dB	MATTE TIN		QUAD		S-XQCC-N32		3	.8 mm	5 mm				e3	30	260	5 mm
LMH6521SQX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		2		245 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	26 dB	MATTE TIN		QUAD		S-XQCC-N32		3	.8 mm	5 mm				e3	30	260	5 mm
SI4720-B20-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel		MATTE TIN		QUAD		S-XQCC-N20		3	.6 mm	3 mm	Not Qualified			e3	40	260	3 mm
TRF3710IRGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER		QUAD		S-PQCC-N48		3	1 mm	7 mm	Not Qualified			e4	30	260	7 mm
ADF7021BCPZ-RL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3		260	7 mm
CC110LRGPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER		QUAD	.6 Mbps	S-PQCC-N20		3	1 mm	4 mm	Not Qualified			e4	30	260	4 mm
CC2400RSUR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N48			1 mm	7 mm	Not Qualified						7 mm
MAX9986AETP+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed		QUAD		S-XQCC-N20		1	.8 mm	5 mm	Not Qualified			e3	30	260	5 mm
MAX9986AETP-T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		TIN LEAD		QUAD		S-XQCC-N20		1	.8 mm	5 mm	Not Qualified			e0			5 mm
MC13202FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		TIN		QUAD		S-PQCC-N32		3	1 mm	5 mm	Not Qualified			e3	40	260	5 mm
SKY66420-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,20		.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N16			.8 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
ADF4360-8BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3	30	260	4 mm
ADF4360-1BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3	30	260	4 mm
ADF7021-NBCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm
MAX5864ETM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS	.0165 mA	3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel		TIN LEAD	3 V	QUAD		S-XQCC-N48	VOLTAGE	1	.8 mm	7 mm	Not Qualified	DIFFERENTIAL	1.5 V	e0		245	7 mm
MAX5864ETM+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed		QUAD		S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e3	30	260	7 mm
SKY66423-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,20		.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N16			.8 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
ADL5387ACPZ-WP	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BIPOLAR		5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3		260	4 mm
MAX2902ETI+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					4.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed		QUAD		S-XQCC-N28		1	.9 mm	5 mm	Not Qualified			e3	30	260	5 mm
ADL5387ACPZ-R7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BIPOLAR		5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3		260	4 mm
LT5521EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-PQCC-N16		1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
SKY66121-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1				600 mA	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32		.8 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N16		3	.81 mm	4 mm						260	4 mm
SKY66122-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	36	HVQCCN	SQUARE		YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20		.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N36		3	1 mm	6 mm							6 mm
RFX1010	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel				QUAD		S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
RFX2402E	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel				QUAD		S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY53735-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	47	HVQCCN	RECTANGULAR		YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC47,.16X.24,16		.4 mm	85 Cel		-30 Cel				QUAD		R-XQCC-N47		3	.7 mm	4.2 mm						260	6.2 mm
RFX2411	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	125 Cel		-40 Cel				QUAD		S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY66105-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	12	HVQCCN	RECTANGULAR		YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				85 Cel		-40 Cel				QUAD		R-XQCC-N12			1.15 mm	6 mm					NOT SPECIFIED	NOT SPECIFIED	8 mm
RFX5000B	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SE5007BT-R	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY53735-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	47	HVQCCN	RECTANGULAR		YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC47,.16X.24,16		.4 mm	85 Cel		-30 Cel				QUAD		R-XQCC-N47		3	.7 mm	4.2 mm						260	6.2 mm
SKY58081-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3200 mA	3.4 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.23X.3,17		.44 mm	110 Cel		-40 Cel				QUAD		R-PQCC-N56			.7 mm	6 mm							7.6 mm
SKY66115-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32		.8 mm	85 Cel		-40 Cel		GOLD OVER NICKEL		QUAD		S-XQCC-N16		3	1 mm	4 mm				e4		260	4 mm
SKY73420-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm							QUAD		S-XQCC-N36			.9 mm	6 mm					NOT SPECIFIED	NOT SPECIFIED	6 mm
SKY85402-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N20		3	.9 mm	4 mm						260	4 mm
ADF7020BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3		260	7 mm
ADF7021-VBCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm
AT86RF231-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N32			1 mm	5 mm	Not Qualified			e3			5 mm
HMC689LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-PQCC-N24		1	1 mm	4 mm				e3	30	260	4 mm
LMH6523SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1		4		485 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	25.74 dB	MATTE TIN		QUAD		R-XQCC-N54		2	.8 mm	5.5 mm				e3	30	260	10 mm
CC2400RSU	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N48			1 mm	7 mm	Not Qualified						7 mm
CC2510F8RHH	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N36		3	1 mm	6 mm	Not Qualified			e4	30	260	6 mm
CC2511F16RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N36		3	.9 mm	6 mm	Not Qualified			e4	30	260	6 mm
CC2510F32RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)		QUAD		S-PQCC-N36		3	1 mm	6 mm	Not Qualified			e4	NOT SPECIFIED	260	6 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.