LGA Cellphone ICs 21

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NRF9160-SICA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA127,21X30,20	.5 mm	85 Cel	-40 Cel	BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm				16 mm
NRF9160-SICA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA127,21X30,20	.5 mm	85 Cel	-40 Cel	BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm				16 mm
NRF9160-SIAA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA127,21X30,20	.5 mm	85 Cel	-40 Cel	BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm				16 mm
NRF9160-SIAA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA127,21X30,20	.5 mm	85 Cel	-40 Cel	BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm				16 mm
NRF9160-SIBA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA127,21X30,20	.5 mm	85 Cel	-40 Cel	BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm				16 mm
SARA-R410M-02B-01	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA96(UNSPEC)		65 Cel	-20 Cel	BOTTOM	R-XLGA-N96	4	2.78 mm	16 mm	-40 to 85 extended operating temp available			26 mm
SARA-R410M-02B	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY			65 Cel	-20 Cel	BOTTOM	R-XBGA-N96	4	2.78 mm	16 mm				26 mm
SARA-R410M-02B-04	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA96(UNSPEC)		65 Cel	-20 Cel	BOTTOM	R-XBGA-N96	4	2.78 mm	16 mm	-40 to 85 extended operating temp available			26 mm
LARA-R211-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	300 mA	3.8 V	GRID ARRAY	LGA100(UNSPEC)		65 Cel	-20 Cel	BOTTOM	R-XLGA-N100	4	2.87 mm	24 mm	-40 to 85 extended operating temp available			26 mm
TOBY-L210-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY			65 Cel	-20 Cel	BOTTOM	R-XBGA-N152	4	2.87 mm	24.8 mm	-40 to 85 extended operating temp available			35.6 mm
SARA-R410M-02B-03	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA96(UNSPEC)		65 Cel	-20 Cel	BOTTOM	R-XLGA-N96	4	2.78 mm	16 mm	-40 to 85 extended operating temp available			26 mm
TOBY-L210-03S-03	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY			65 Cel	-20 Cel	BOTTOM	R-XBGA-N152		2.87 mm	24.8 mm	-40 to 85 extended operating temp available			35.6 mm
SARA-R412M-02B	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	BUTT	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY			65 Cel	-20 Cel	BOTTOM	R-XBGA-B96	4	2.78 mm	16 mm		NOT SPECIFIED	NOT SPECIFIED	26 mm
NRF9160-SIBA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA127,21X30,20	.5 mm	85 Cel	-40 Cel	BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm				16 mm
SARA-R412M-02B-03	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA96(UNSPEC)		65 Cel	-20 Cel	BOTTOM	R-XLGA-N96	4	2.78 mm	16 mm	-40 to 85 extended operating temp available			26 mm
HL7692	Sierra Wireless	RF AND BASEBAND CIRCUIT		NO LEAD	146	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.7 V	GRID ARRAY	LGA146(UNSPEC)		85 Cel	-40 Cel	BOTTOM	R-XBGA-N146		2.7 mm	22 mm	Also Operates with class A: -30 deg c to 70 deg c			23 mm
TOBY-L210-65S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY			65 Cel	-20 Cel	BOTTOM	R-XBGA-N152	4	2.87 mm	24.8 mm	-40 to 85 extended operating temp available			35.6 mm
TOBY-L210-62S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY			65 Cel	-20 Cel	BOTTOM	R-XBGA-N152	4	2.87 mm	24.8 mm	-40 to 85 extended operating temp available			35.6 mm
TOBY-L280-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY			65 Cel	-20 Cel	BOTTOM	R-XBGA-N152	4	2.87 mm	24.8 mm	-40 to 85 extended operating temp available			35.6 mm
LARA-R202-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949		3.8 V	GRID ARRAY	LGA100(UNSPEC)		65 Cel	-20 Cel	BOTTOM	R-XLGA-N100	4	2.87 mm	24 mm	-40 to 85 extended operating temp available		245	26 mm
MMM7210B	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	170	LGA	RECTANGULAR	UNSPECIFIED	YES	1			1.2 V	GRID ARRAY			85 Cel	-30 Cel	BOTTOM	R-XBGA-N170		1.2 mm	7.65 mm				9.25 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.