TFQFP Cellphone ICs 18

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TCM4400EPETR	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK			.4 mm	85 Cel	-25 Cel		QUAD	S-PQFP-G80		1.2 mm	10 mm	Not Qualified				10 mm
TCM4400EPET	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.03 mA	3 V	3	FLATPACK	TQFP80,.48SQ,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel		QUAD	S-PQFP-G80		1.2 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
PMB2240	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.1 mm	7 mm	Not Qualified				7 mm
PMB2411	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.1 mm	7 mm	Not Qualified				7 mm
MAX2360ECM+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX2364ECM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX2364ECM+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX2362ECM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.161 mA	2.75 V	3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G48		1.2 mm	7 mm	Not Qualified	e0	20	240	7 mm
MAX2360ECM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX2362ECM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G48		1.2 mm	7 mm	Not Qualified	e0	20	240	7 mm
MAX2364ECM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		2.75 V	3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G48		1.2 mm	7 mm	Not Qualified	e0	20	240	7 mm
MAX2362ECM+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX2360ECM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		2.75 V	3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G48		1.2 mm	7 mm	Not Qualified	e0	20	240	7 mm
MAX2360ECM+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX2362ECM+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX2364ECM+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
LUCW3020CCS-DB	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.2 mm	10 mm	Not Qualified	e0	30	240	10 mm
LUCW3020CCS	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.2 mm	10 mm	Not Qualified	e0	30	240	10 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.