RF AND BASEBAND CIRCUIT Cellphone ICs 1,460

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Peak Reflow Temperature (C)	Length
ACPM-7831-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1		3.4 V	MICROELECTRONIC ASSEMBLY		85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDMA-N6				Not Qualified	e0
W3013BCL	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.7 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-35 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified	e0		6.5 mm
ACMD-7610-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES				UNCASED CHIP				GOLD	UPPER	R-XUUC-N8	3			Not Qualified	e4
HPMX-7202-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3 V	FLATPACK, LOW PROFILE, FINE PITCH	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.55 mm	5 mm	Not Qualified	e0		5 mm
ACPM-7831-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1		3.4 V	MICROELECTRONIC ASSEMBLY		85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDMA-N6				Not Qualified	e0
ACFM-7110-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1			CHIP CARRIER		85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4		5 mm
ACPM-5281-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4	260	5 mm
ACPM-7355-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR	3.4 V	MICROELECTRONIC ASSEMBLY	.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1.05 mm	4 mm			260	5 mm
ACFM-7110-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1			CHIP CARRIER		85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4		5 mm
AJAV-5505-BLK	Broadcom	RF AND BASEBAND CIRCUIT															TIN			1				e3	260
ACFM-7109-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1			CHIP CARRIER		85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4		5 mm
AJAV-5602-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3	260	3 mm
AJAV-5601-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3	260	3 mm
AJAV-5508-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3	260	3 mm
S1T8536X01-T0R0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH	.5 mm	70 Cel	-10 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified			7 mm
S1M8659X01-F0T0	Samsung	RF AND BASEBAND CIRCUIT	OTHER	BUTT	32	BCC	SQUARE	UNSPECIFIED	YES	1	BICMOS	3 V	CHIP CARRIER	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B32			5 mm	Not Qualified			5 mm
S1M8674X01-G0T0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	3 V	CHIP CARRIER, VERY THIN PROFILE	.5 mm	80 Cel	-30 Cel		QUAD	R-PQCC-N24		1 mm	3.5 mm	Not Qualified			4.5 mm
S1M8673X01-V0T0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	.65 mm	80 Cel	-30 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified			6.5 mm
S1M8673X01-G0T0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	3 V	CHIP CARRIER, VERY THIN PROFILE	.5 mm	80 Cel	-30 Cel		QUAD	R-PQCC-N24		1 mm	3.5 mm	Not Qualified			4.5 mm
S1M8674X01-V0T0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	.65 mm	80 Cel	-30 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified			6.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.