INDUSTRIAL Cellphone ICs 1,308

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC113LRTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N20	3	.9 mm	4 mm		e4	30	260	4 mm
CC1000YZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B28		.652 mm	2.339 mm	Not Qualified				4.034 mm
CC1100-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N20	3	.95 mm	4 mm	Not Qualified	e3	30	260	4 mm
HMC422MS8	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0		235	3 mm
AD6642BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.291 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1	30	260	10 mm
AD6657BBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1	30	260	10 mm
LTC5598IUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N24	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
AD6643BCPZ-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	2	CMOS	.275 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3	30	260	9 mm
HMC381LP6TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N28		1 mm	6 mm					6 mm
HMC900LP5ETR	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
AD6655ABCPZ-150	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.805 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3	30	260	9 mm
ADRF6620ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N48		.8 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
AD8340ACPZ-REEL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.15 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3		260	4 mm
HMC485MS8GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		e3		260	3 mm
HMC497LP4TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e0		235	4 mm
AD6653BCPZ-105	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	1	1 mm	9 mm	Not Qualified	e3			9 mm
AD6653BCPZ-150	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3		260	9 mm
ADRF5547BCPZN	Analog Devices	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N40	3	1 mm	6 mm			30	260	6 mm
AD8340ACPZ-WP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.15 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3		260	4 mm
AD6655ABCPZ-105	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.575 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3	30	260	9 mm
HMC421QS16ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			.64 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm		e3		260	4.9 mm
AD6653BCPZ-125	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3		260	9 mm
ADRF5549BCPZN-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N40	3	1 mm	6 mm				260	6 mm
AD6650BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B121	3	1.85 mm	12 mm	Not Qualified	e1			12 mm
AD8366ACPZ-R7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	2			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3	30	260	5 mm
AD6688BBPZRL-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.53 mm	12 mm			30	260	12 mm
AD6643BCPZ-200	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	2		.26 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3	30	260	9 mm
AD6642BBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.291 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	S-PBGA-B144	1	1.4 mm	10 mm	Not Qualified	e3			10 mm
HMC485MS8GTR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		e0		235	3 mm
HMC497LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3		260	4 mm
AD6655BCPZ-150	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3		260	9 mm
ADRF5545ABCPZN-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
HMC993LP5E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, VERY THIN PROFILE			1 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N32	1	1 mm	5 mm		e3		260	5 mm
HMC381LP6E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N28	1	1 mm	6 mm	Not Qualified	e3			6 mm
AD7005AS	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G44		2.45 mm	10 mm	Not Qualified				10 mm
AD8348ARUZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
LTC5592IUH#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
HMC420QS16TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			.64 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm					4.9 mm
LTC5590IUH#TRPBF	Analog Devices	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	.8 mm	5 mm		e3	30	260	5 mm
LTC5588IPF-1#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N24	1	.6 mm	4 mm	Not Qualified	e3	30	260	4 mm
HMC422MS8TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		e0		235	3 mm
AD8341ACPZ-WP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.145 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
AD6657BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1			10 mm
AD6653BCPZ-80	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	1	1 mm	9 mm	Not Qualified	e3			9 mm
ADRF5549BCPZN-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N40	3	1 mm	6 mm				260	6 mm
HMC421QS16E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e3		260	4.9 mm
AD6655ABCPZ-80	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.42 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3	30	260	9 mm
AD8341ACPZ-REEL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.145 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.