Onsemi Cellphone ICs 10

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
08906-002-XTD	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	68	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	.07 mA	3.3 V	3.3	CHIP CARRIER	LCC68(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N68				Not Qualified	e0
08906-808-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	.07 mA	3.3 V	3.3	FLATPACK	TQFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G64	3			Not Qualified	e3		260
08906-808-XTD	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	.07 mA	3.3 V	3.3	FLATPACK	TQFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G64				Not Qualified	e3		260
08906-004-XTD	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	.07 mA	3.3 V	3.3	FLATPACK	TQFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
08906-003-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	.07 mA	3.3 V	3.3	FLATPACK	QFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
FXLA2203UMX	Onsemi	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1				CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-XQCC-N24	1	.55 mm	2.5 mm		e3	30	260	3.4 mm
08906-003-XTD	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	.07 mA	3.3 V	3.3	FLATPACK	QFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
08906-004-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	.07 mA	3.3 V	3.3	FLATPACK	TQFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
08906-002-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	68	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	.07 mA	3.3 V	3.3	CHIP CARRIER	LCC68(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N68				Not Qualified	e0
FXLA2203	Onsemi	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	RECTANGULAR	UNSPECIFIED	YES	2		1.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N24	1	.55 mm	2.5 mm	Not Qualified				3.4 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.