Renesas Electronics Cellphone ICs 63

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
UPC8112TB-E3-A	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e6			2 mm
82V3395NLG	Renesas Electronics
F0440NBGI	Renesas Electronics	RF AND BASEBAND CIRCUIT																	Tin (Sn)			1				e3	NOT SPECIFIED	260
F0452BLEGK	Renesas Electronics	RF AND BASEBAND CIRCUIT																	Tin (Sn)			3				e3	NOT SPECIFIED	260
UPG2106TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
F1180NBGI	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		YES	1		410 mA	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm		e3		260	7 mm
UPC8191K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	85 Cel	-25 Cel		QUAD	R-PQCC-N20		.9 mm	3 mm					4 mm
ISL5416KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	GRID ARRAY, LOW PROFILE		1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm		e0	20	220	17 mm
UPG2110TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
F6102NTGK	Renesas Electronics																		TIN			1				e3		260
F0448NBGK	Renesas Electronics	RF AND BASEBAND CIRCUIT																	TIN			1				e3		260
UPG2126TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
ISL5217KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V	GRID ARRAY, LOW PROFILE		1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm
F6102NTGK8	Renesas Electronics																		TIN			1				e3		260
82V3395BNLG8	Renesas Electronics	RF AND BASEBAND CIRCUIT

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.