Texas Instruments Cellphone ICs 433

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Resolution (um) Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Width Qualification Companding Law Input Type Additional Features Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CC1101RGPR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.5 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

CC1101RGPT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.5 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

CC1101RGP

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.5 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

LMH2110TMX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

5.5 mA

4.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.675 mm

.84 mm

e1

30

260

1.24 mm

CC110LRGPR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

.6 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

LMH2110TM/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

5.5 mA

4.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.675 mm

.84 mm

e1

30

260

1.24 mm

CC1101QRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC115LRGPR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.6 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

CC2510F32RHHR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

S-PQCC-N36

3

1 mm

6 mm

Not Qualified

e4

NOT SPECIFIED

260

6 mm

CC115LRTKT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N20

3

.9 mm

4 mm

e4

30

260

4 mm

CC115LRGPT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.6 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

CC1000PW

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.001 mA

3 V

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e4

30

260

9.7 mm

CC1020RSSR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.1536 Mbps

S-XQCC-N32

3

1 mm

7 mm

Not Qualified

e4

NOT SPECIFIED

260

7 mm

1185

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

.95 mm

4 mm

Not Qualified

4 mm

LMH2110TM

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

.675 mm

.84 mm

Not Qualified

1.24 mm

CC115LRTKR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N20

3

.9 mm

4 mm

Not Qualified

e4

30

260

4 mm

CC2591RGVR

Texas Instruments

RF FRONT END CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4 mA

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

CC1110EMK433

Texas Instruments

RF AND BASEBAND CIRCUIT

CC1000PWR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.001 mA

3 V

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e4

30

260

9.7 mm

CC1110F32RSP

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

30

260

6 mm

AFE8030EDIABJ

Texas Instruments

RF AND BASEBAND CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

e1

260

17 mm

AFE8030IABJ

Texas Instruments

RF AND BASEBAND CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

e1

260

17 mm

CC1110EMK868-915

Texas Instruments

RF AND BASEBAND CIRCUIT

TRF372017IRGZT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.25 mA

3.3 V

3.3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N48

2

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1000PWRG3

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e4

30

260

9.7 mm

CC2591RGVRG4

Texas Instruments

RF FRONT END CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4 mA

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

1168

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

.95 mm

4 mm

Not Qualified

4 mm

TRF370317IRGER

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.245 mA

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

TRF370317IRGET

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.245 mA

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

CC1100RTKR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

3

.95 mm

4 mm

Not Qualified

e3

30

260

4 mm

CC2511F32RSPR

Texas Instruments

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

NOT SPECIFIED

260

6 mm

LMV228TLX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

1

8 mA

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B4

1

e1

30

260

TRF3705IRGET

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

CC1110F32RSPR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

30

260

6 mm

CC1111F32RSPRG3

Texas Instruments

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

36

QCCN

SQUARE

PLASTIC/EPOXY

YES

CMOS

3 V

3

CHIP CARRIER

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N36

3

Not Qualified

e4

30

260

CC2511F32RSP

Texas Instruments

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

NOT SPECIFIED

260

6 mm

LMH6521SQE/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2

245 mA

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

26 dB

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

e3

30

260

5 mm

LMH6521SQX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2

245 mA

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

26 dB

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

e3

30

260

5 mm

TRF3710IRGZT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

AFE8030EDIALK

Texas Instruments

RF AND BASEBAND CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

e0

220

17 mm

CC110LRGPT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

.6 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

CC2400RSUR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

7 mm

TCM320AC57PT

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

LMH6523SQE/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

54

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

4

485 mA

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

25.74 dB

MATTE TIN

QUAD

R-XQCC-N54

2

.8 mm

5.5 mm

e3

30

260

10 mm

LMV225TLX

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B4

1

.675 mm

1.014 mm

Not Qualified

1.014 mm

CC2400RSU

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

7 mm

LMH2121TMX

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B4

.675 mm

.866 mm

1.07 mm

TCM8002IFR

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G44

2.25 mm

10 mm

10 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.