100 Cordless Phone ICs 18

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Length
SAA1575HLBE	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
PCD5090H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
PCD5097H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
PCD5091HZ	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3 V	3/3.3,5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	R-PQFP-G100	1.6 mm	14 mm	Not Qualified	e3	14 mm
SAA1575HL/V2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
PCD5091H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified	e3	20 mm
PCD5092H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified	e3	20 mm
PCD5090H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
PCD5090HZ	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
PCD5097H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
935260577557	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
PCD5090HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
PCD5095H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
PCA5097H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
PCD5091H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3 V		FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
PCD5092H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3 V		FLATPACK			.65 mm			TIN	QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified	e3	20 mm
PCD5091HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	R-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
PCA5097H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.