20 Cordless Phone ICs 15

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA58640DK	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
935277002112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
UAA2077AM-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	4 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
UAA2077AM	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	4 V	4	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
SA58640DK,112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA58641DK,112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935277007112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA58641DK	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
UAA3540TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	60 Cel	-10 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935277007118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
935277002118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA58640DK,118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA58641DK,118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
TG2401F	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20		1.04 mm	4.4 mm	Not Qualified	e0			5 mm
TG2403CT	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	20	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B20		.53 mm	2.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3.9 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.