LSSOP Cordless Phone ICs 69

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

TA31137FN-TP2

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5.6 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

7.8 mm

TA31136FN(ER)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA2056FNG

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

1.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7.8 mm

TA31170FN-TP2

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9 mA

3.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

e0

5 mm

TA31132FN-TP2

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

7.8 mm

TA2056FN

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31136FN(EL)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31170FN

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9 mA

3.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

e0

5 mm

TA31170FN-TP1

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9 mA

3.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

e0

5 mm

TA31103FN-TP2

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31136FN

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31170FN(ER)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9 mA

3.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31103FN

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31132FN

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

7.8 mm

TA31137FN

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5.6 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31161FN(ER)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

7.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-35 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31137FN(EL)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5.6 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31136FNG

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0046 mA

2 V

2

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

TA31136FN-TP2

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31161FN-TP2

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

7.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-35 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

e0

5 mm

TA31103FN-TP1

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.