QFP Cordless Phone ICs 30

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC13109AFB	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES	1		12 mA	2.6 V		FLATPACK	QFP52,.52SQ		.65 mm	85 Cel	-20 Cel		QUAD	S-PQFP-G52	2.45 mm	10 mm					10 mm
MC13110AFB	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES	1		10.5 mA	3.6 V		FLATPACK	QFP52,.52SQ		.65 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G52	2.45 mm	10 mm					10 mm
MC13111AFB	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES	1		10.5 mA	3.6 V		FLATPACK	QFP52,.52SQ		.65 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G52	2.45 mm	10 mm					10 mm
PCD5090H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified				20 mm
PCD5041H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCD5041-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm				QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCD5043H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCD5097H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified				20 mm
PCD5042H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCD5091H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified	e3			20 mm
PCD5092H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified	e3			20 mm
PCD5090H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified				20 mm
PCD5097H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified				20 mm
PCD5041	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm				QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCD5042H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK	QFP64,.7X.95,40	Cordless Telephone ICs	1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCD5040-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm			TIN	QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified	e3			20 mm
PCD5095H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified				20 mm
PCD5041H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCA5097H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified				20 mm
PCD5091H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified				20 mm
PCD5092H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			.65 mm			TIN	QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified	e3			20 mm
PCD5043H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK	QFP64,.7X.95,40	Cordless Telephone ICs	1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCA5097H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified				20 mm
PCD5040	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm			TIN	QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified	e3			20 mm
TB31262F	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK			.65 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G52	2.45 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
TB31261AF	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.0333 mA	3.6 V	3.6	FLATPACK	QFP52,.52SQ	Cordless Telephone ICs	.65 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G52	2.45 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
S1T8528X01-Q0R0	Samsung	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V	3.6	FLATPACK	QFP48,.5SQ,30	Other Telecom ICs	.75 mm	70 Cel	-20 Cel	TIN LEAD	QUAD	S-PQFP-G48	2.3 mm	10 mm	Not Qualified	e0		240	10 mm
KA8510Q	Samsung	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	2/6	FLATPACK	QFP64(UNSPEC)	Other Telecom ICs	1 mm	75 Cel	-25 Cel	TIN LEAD	QUAD	R-PQFP-G64	3 mm	14 mm	Not Qualified	e0			20 mm
KA8511Q	Samsung	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	2/6	FLATPACK	QFP64(UNSPEC)	Other Telecom ICs	1 mm	75 Cel	-25 Cel	TIN LEAD	QUAD	R-PQFP-G64	3 mm	14 mm	Not Qualified	e0			20 mm
S1T8527C01-Q0R0	Samsung	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK			.75 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48	2.3 mm	10 mm	Not Qualified				10 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.