CORDLESS TELEPHONE BASEBAND CIRCUIT Cordless Phone ICs 62

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Length
AD6190ARS	Analog Devices	CORDLESS TELEPHONE BASEBAND CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28	2 mm	5.3 mm	Not Qualified	e0	10.2 mm
AD6190ARSRL	Analog Devices	CORDLESS TELEPHONE BASEBAND CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28	2 mm	5.3 mm	Not Qualified	e0	10.2 mm
MC33411BFTA	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	20 mA	3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel	TIN LEAD	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0	7 mm
MC33411AFTA	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	20 mA	3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel	TIN LEAD	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0	7 mm
SAA1575HLBE	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
TEA1118M-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified	e4	5.2 mm
PCD5090H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
TEA1118T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0014 mA	2.9 V	2.9	SMALL OUTLINE	SOP14,.25	Cordless Telephone ICs	1.27 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
TEA1118AT	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0014 mA	2.9 V	2.9	SMALL OUTLINE	SOP14,.25	Cordless Telephone ICs	1.27 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
935237440112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
TEA1118TD	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
PCD50922H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm			TIN	QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified	e3	12 mm
935220640118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
PCD50912H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm			TIN	QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified	e3	12 mm
PCD5097H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
935237450518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118TD-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
PCD5091HZ	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	R-PQFP-G100	1.6 mm	14 mm	Not Qualified	e3	14 mm
TEA1118AM-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
TEA1118AT-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
SAA1575HL/V2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
935237450512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
PCD50912H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified	e3	12 mm
TEA1118ATD	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
PCD5091H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified	e3	20 mm
PCD5092H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified	e3	20 mm
PCD5090H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
PCD50922H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified	e3	12 mm
PCD5090HZ	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
935220650518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
PCD5097H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
953237440118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
935260577557	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
TEA1118M	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0014 mA	2.9 V	2.9	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Cordless Telephone ICs	.65 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified	e4	5.2 mm
TEA1118AT/C1	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118AM/C1	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
953237440112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
PCD5090HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified		14 mm
PCD5095H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm
953237450512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
935220640112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
953220640118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
953220640112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
UAA2079M	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G24	2 mm	5.3 mm	Not Qualified		8.2 mm
TEA1118M/C2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
TEA1118T-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
TEA1118MDK-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
PCA5097H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100	3.2 mm	14 mm	Not Qualified		20 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.