CORDLESS TELEPHONE BURST MODE CONTROLLER Cordless Phone ICs 14

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Length
PCD5041H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified		20 mm
PCD5041-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm				QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified		20 mm
PCD5043H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified		20 mm
PCD5041HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified		12 mm
PCD5042H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified		20 mm
PCD5042HZ	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Cordless Telephone ICs	.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified		12 mm
PCD5041HZ	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified		12 mm
PCD5042HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified		12 mm
PCD5041	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm				QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified		20 mm
PCD5042H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK	QFP64,.7X.95,40	Cordless Telephone ICs	1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified		20 mm
PCD5040-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm			TIN	QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified	e3	20 mm
PCD5041H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified		20 mm
PCD5043H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK	QFP64,.7X.95,40	Cordless Telephone ICs	1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified		20 mm
PCD5040	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm			TIN	QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified	e3	20 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.