CORDLESS TELEPHONE SUPPORT CIRCUIT Cordless Phone ICs 77

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LMX3161VBHX	Texas Instruments	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-10 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e0			7 mm
LMX3161VBH	Texas Instruments	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-10 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e0			7 mm
CGY2032TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		400 mA	3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
CGY2032TS-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		400 mA	3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
SA58640DK	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
935277002112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
UAA2077AM-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		4 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
935202550518	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2078M-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
UAA2078M	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
UAA2077AM	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		4 V	4	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
SA58640DK,112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA58641DK,112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935277007112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
UAA2067G-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
935202550557	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
SA58641DK	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
UBA1706TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.0032 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Digital Transmission Interfaces	.65 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		2 mm	5.3 mm	Not Qualified	e4			8.2 mm
UBA1707T/C2	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UAA3540TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	60 Cel	-10 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935277007118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
UBA1707TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3/5	SMALL OUTLINE	SSOP28,.3	Digital Transmission Interfaces	.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified				10.2 mm
UBA1707T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3/5	SMALL OUTLINE	SOP28,.4	Digital Transmission Interfaces	1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
935277002118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
UAA2067G/C1	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
SA58640DK,118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935202550551	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2068AHL	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-10 Cel	Tin (Sn)	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2068G	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	Other Telecom ICs	.5 mm	60 Cel	-10 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UBA1707TS/C2	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified				10.2 mm
UAA2067GBE	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
UBA1707T-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UBA1707TS-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified				10.2 mm
UAA2067G	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
SA58641DK,118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
TA31103F(ER)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		9.5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G24		2.2 mm	6 mm	Not Qualified				13 mm
TA31101AP	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	5 mA	3 V	1.8/9	IN-LINE	DIP16,.3	Cordless Telephone ICs	2.54 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDIP-T16		4.45 mm	7.62 mm	Not Qualified	e0			19.25 mm
TA31101F-TP1	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31102F(EL)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31101AF-TP1	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31101F(EL)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31101AF(EL)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31103FN(ER)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		9.5 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G24		1.6 mm	5.6 mm	Not Qualified	e0			7.8 mm
TA31103F	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		9.5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G24		2.2 mm	6 mm	Not Qualified	e0			13 mm
TA31170FN(EL)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		9 mA	3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TA31101F	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	5 mA	3 V	1.8/9	SMALL OUTLINE, SHRINK PITCH	SOP16,.25,40	Cordless Telephone ICs	1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31101AF	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	5 mA	3 V	1.8/9	SMALL OUTLINE, SHRINK PITCH	SOP16,.25,40	Cordless Telephone ICs	1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31103F-TP2	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		9.5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G24		2.2 mm	6 mm	Not Qualified	e0			13 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.